Organic light-emitting display device and manufacturing method thereof
A method of manufacturing an OLED device includes: preparing a substrate on which a first conductive layer and a pixel defining film defining a plurality of pixels and exposing the first conductive layer for each of the plurality of pixels; disposing a photoresist pattern on the pixel defining film, the photoresist pattern comprising an opening exposing a first pixel of the plurality of pixels; disposing a first material layer onto an entire surface of the substrate to simultaneously dispose an organic light-emitting layer and a first deposition layer; disposing a second material layer onto the entire surface of the substrate to simultaneously dispose a second conductive layer and a second deposition layer; disposing a third material layer onto the entire surface of the substrate to simultaneously dispose a protection layer and a third deposition layer; and removing the photoresist pattern and the first, second, and third deposition layers.
1. A light-emitting display device, comprising:
a substrate;
a first conductive layer disposed on the substrate;
a first insulating layer disposed on the first conductive layer, the first insulating layer including an opening overlapping the first conductive layer;
a light-emitting layer disposed in the opening;
a second conductive layer disposed on the light-emitting layer;
a second insulating layer disposed on the second conductive layer and exposing a portion of the second conductive layer; and
a sub-conductive layer disposed on the first insulating layer, the sub-conductive layer contacting the portion of the second conductive layer,
wherein the light-emitting layer is interposed between the second insulating layer and the first conductive layer.
2. The light-emitting display device of claim 1 , wherein the second insulating layer is provided in a plural and each of a plurality of the second insulating layers are separated from each other.
3. The light-emitting display device of claim 1 , wherein the second conductive layer is provided in a plural, and each of a plurality of the second conductive layers are separated from each other.
4. The light-emitting display device of claim 1 , wherein the light-emitting layer is surrounded and sealed by the second insulating layer, the first insulating layer, the first conductive layer, and the sub-conductive layer.
5. The light-emitting display device of claim 1 , wherein the second insulating layer comprises an inorganic material.
6. The light-emitting display device of claim 1 , wherein a portion of the second insulating layer does not overlap the sub-conductive layer.
7. The light-emitting display device of claim 1 , wherein the first insulating layer comprises:
a first layer comprising an organic material; and
a second layer comprising an inorganic material and covering the first layer.
8. A light-emitting display device, comprising:
a substrate;
a first conductive layer disposed on the substrate;
a first insulating layer disposed on the first conductive layer, the first insulating layer including an opening that exposes a portion of the first conductive layer;
a light-emitting layer disposed on the portion of the first conductive layer;
a second conductive layer disposed on the light-emitting layer;
a second insulating layer disposed on the second conductive layer and exposing a portion of the second conductive layer; and
a sub-conductive layer disposed on the second insulating layer, the sub-conductive layer directly contacting the portion of the second conductive layer
wherein the light-emitting layer is interposed between the second insulating layer and the first conductive layer.
9. The light-emitting display device of claim 8 , wherein the light-emitting layer is surrounded and sealed by the second insulating layer, the first insulating layer, the first conductive layer, and the sub-conductive layer.
10. The light-emitting display device of claim 8 , wherein a portion of the second insulating layer does not overlap the sub-conductive layer.
11. The light-emitting display device of claim 8 , wherein a portion of the second insulating layer directly contacts the sub-conductive layer.
12. The light-emitting display device of claim 8 , further comprising:
a color filter disposed between the second insulating layer and the sub-conductive layer.
13. A method of manufacturing an organic light-emitting display device, comprising:
preparing a substrate on which a first conductive layer and a pixel defining film defining a plurality of pixels and exposing the first conductive layer for each of the plurality of pixels;
disposing a photoresist pattern on the pixel defining film, the photoresist pattern comprising an opening exposing a first pixel of the plurality of pixels;
disposing a first material layer onto an entire surface of the substrate to simultaneously dispose
an organic light-emitting layer on a portion of the first conductive layer exposed by the pixel defining film, and
a first deposition layer on the photoresist pattern;
disposing a second material layer onto the entire surface of the substrate to simultaneously dispose
a second conductive layer on the organic light-emitting layer, and
a second deposition layer on the first deposition layer;
disposing a third material layer onto the entire surface of the substrate to simultaneously dispose
a protection layer on the second conductive layer, and
a third deposition layer on the second deposition layer; and
removing the photoresist pattern and the first, second, and third deposition layers.
14. The method of claim 13 , wherein at least a part of the protection layer contacts with the pixel defining film.
15. The method of claim 13 , wherein the protection layer completely covers the first conductive layer and the organic light-emitting layer.
16. The method of claim 13 , wherein the organic light-emitting layer is surrounded and sealed by the protection layer, the pixel defining film, and the first conductive layer.
17. The method of claim 13 , herein the photoresist pattern has an inverted taper shape.
18. The method of claim 17 , wherein the photoresist pattern is formed by patterning a negative photoresist composition.
19. The method of claim 13 , wherein the photoresist pattern is removed by a lift-off process using a stripper.
20. The method of claim 13 , further comprising, after removing the photoresist pattern:
disposing an organic light-emitting layer, a second conductive layer and a protection layer in a second pixel of the plurality of pixels;
etching a part of the protection layers in the first pixel and the second pixel of the plurality of pixels to expose a part of the second conductive layers in the first pixel and the second pixel of the plurality of pixels; and
forming a sub-conductive layer to electrically connect the exposed portions of the second conductive layers in the first pixel and the second pixel of the plurality of pixels.
21. The light-emitting display device of claim 1 , further comprising a sub-protection layer covering the second insulating layer and the sub-conductive layer,
wherein the sub-protection layer directly contacts the sub-conductive layer.