IP Library Granted Patent US 10,975,495
Granted Patent B2
US 10,975,495 · App. 16/482,800 · Granted Apr 13, 2021

Epitaxial growth apparatus, preheat ring, and method of manufacturing epitaxial wafer using these

Inventor: Haku Komori (Tokyo, JP)
Assignee: SUMCO CORPORATION
C30B25/14C30B25/10C30B25/12C30B35/007H01L21/68714
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Quick Facts
Patent No.
US 10,975,495
App. No.
16/482,800
Granted
Apr 13, 2021
Kind
B2
Abstract

An epitaxial growth apparatus that can provide an improved thickness uniformity of an epitaxial film is provided. An epitaxial growth apparatus in accordance with the present disclosure includes a susceptor and a preheat ring surrounding a side of the susceptor having a gap interposed therebetween. A width of the gap at least in part between the susceptor and the preheat ring is set to be longer than a width w 1 of the gap between the susceptor and the preheat ring in the vicinity of the reactant gas inlet.

Claims (35)

1. An epitaxial growth apparatus used for a vapor phase growth of an epitaxial film on a surface of a semiconductor wafer, the epitaxial growth apparatus comprising:

a chamber,

a susceptor for mounting the semiconductor wafer inside the chamber;

a preheat ring surrounding a side of the susceptor having a gap interposed therebetween; and

a reactant gas inlet for supplying a reactant gas for the vapor phase growth of an epitaxial layer, to a front surface of the semiconductor wafer,

wherein:

a width of the gap at least in part between the susceptor and the preheat ring is set to be longer than the width of the gap between the susceptor and the preheat ring in a vicinity of the reactant gas inlet;

a difference between outer and inner diameters of the preheat ring varies radially around the preheat ring;

outer and inner circumferences of the preheat rings have circular shapes of different diameters, and center points of the outer and inner circumferences do not coincide with each other; and

an angle about the center point of the outer circumference between a point closest to the reactant gas inlet and a position where the width of the gap is the shortest is no smaller than −40° and less than 0° where angles in a direction of a rotation of the susceptor are defined as positive angles.

2. The epitaxial growth apparatus according to claim 1 , wherein the inner circumference of the preheat ring is provided with a notch.

3. The epitaxial growth apparatus according to claim 1 , wherein the outer circumference of the preheat ring has a circular shape, and the inner circumference of the preheat ring has an elliptic shape.

4. The epitaxial growth apparatus according to claim 1 , wherein the preheat ring has an annular structure.

5. A preheat ring for surrounding a side of a susceptor for mounting a semiconductor wafer, having a gap interposed between the preheat ring and the susceptor, inside an epitaxial growth apparatus,

wherein:

a difference between outer and inner diameters of the preheat ring varies radially around the preheat ring;

outer and inner circumferences of the preheat ring have circular shapes of different diameters, and center points of the outer and inner circumferences do not coincide with each other; and

an angle about a center of the outer circumference between a point closest to the reactant gas inlet and a position where the width of the gap is the shortest is no smaller than −40° and less than 0° where angles in a direction of a rotation of the susceptor are defined as positive angles.

6. The preheat ring according to claim 5 , wherein the inner circumference of the preheat ring is provided with a notch.

7. The preheat ring according to claim 5 , wherein the outer circumference of the preheat ring has a circular shape, and the inner circumference of the preheat ring has an elliptic shape.

8. The preheat ring according to claim 5 , wherein the preheat ring has an annular structure.

9. A method of manufacturing an epitaxial wafer comprising:

supplying an atmospheric gas and a reactant gas containing hydrogen gas as a carrier gas to the epitaxial growth apparatus according to claim 1 to epitaxially grow an epitaxial layer on a semiconductor wafer.

10. A method of manufacturing an epitaxial wafer comprising:

supplying an atmospheric gas and a reactant gas containing hydrogen gas as a carrier gas to an epitaxial growth apparatus comprising the preheat ring according to claim 5 to epitaxially grow an epitaxial layer on a semiconductor wafer.

11. An epitaxial growth apparatus used for a vapor phase growth of an epitaxial film on a surface of a semiconductor wafer, the epitaxial growth apparatus comprising:

a chamber,

a susceptor for mounting the semiconductor wafer inside the chamber;

a preheat ring surrounding a side of the susceptor having a gap interposed therebetween; and

a reactant gas inlet for supplying a reactant gas for the vapor phase growth of an epitaxial layer, to a front surface of the semiconductor wafer,

wherein:

a width of the gap between the susceptor and the preheat ring in a vicinity of an opposite side to the reactant gas inlet is longer than the width of the gap between the susceptor and the preheat ring in the vicinity of the reactant gas inlet;

a difference between outer and inner diameters of the preheat ring varies radially around the preheat ring;

outer and inner circumferences of the preheat ring have circular shapes of different diameters, and center points of the outer and inner circumferences do not coincide with each other; and

an angle about the center point of the outer circumference between a point closest to the reactant gas inlet and a position where the width of the gap is the shortest is no smaller than −40° and less than 0° where angles in a direction of a rotation of the susceptor are defined as positive angles.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2019
From: KOMORI, HAKU
To: SUMCO CORPORATION
Reel/Frame 049931/0623 →
Priority Claims (1)
JP JP2017-043202 · Mar 7, 2017 · national
Continuity (1)
Related Publication 20200354853A1 · Nov 12, 2020
Cited By (2)
US 12,592,363 US 12,680,191