Atmospheric plasma in wafer processing system optimization
A method and a system for polishing a wafer is disclosed. In one aspect, the method includes generating atmospheric plasma. The method further includes treating a component of a wafer processing system with the atmospheric plasma. The method further includes delivering a slurry containing abrasive and corrosive particles to a surface of the wafer processing system which includes atmospheric plasma-treated component. The method further includes polishing a wafer with the abrasive and corrosive particles.
1. A system for polishing a wafer, the system comprising:
a polishing pad affixed to a top surface of a platen, the polishing pad having a first surface configured to polish the wafer;
an atmospheric plasma generator configured to: generate atmospheric plasma at a pressure that is substantially the same as surrounding atmosphere, and directly apply the atmospheric plasma to the first surface of the polishing pad to treat the first surface of the polishing pad to modify a processing characteristic of the first surface of the polishing pad;
a slurry delivery system configured to deliver processing slurry to the first surface of the polishing pad; and
a wafer carrier configured to hold a wafer and allow the wafer to be polished by the first surface of the polishing pad.
2. The system of claim 1 , wherein the wafer carrier comprises a membrane attached to the wafer carrier, the membrane configured to provide pressure between the wafer and the polishing pad.
3. The system of claim 1 , wherein the atmospheric plasma generator is embedded in the polishing pad to enable in-situ application of atmospheric plasma to the wafer.
4. The system of claim 1 , wherein the atmospheric plasma generator is mounted above the polishing pad.
5. The system of claim 1 , wherein the atmospheric plasma generator is movable relative to the polishing pad.
6. The system of claim 1 , wherein the atmospheric plasma generator is mounted on a pad conditioning arm.
7. The system of claim 1 , wherein the treating of the first surface the polishing pad with the atmospheric plasma reduces a hydrophobic nature of the polishing pad.
8. The system of claim 1 , wherein the treating of the first surface the polishing pad with the atmospheric plasma reduces a contact angle between the first surface the polishing pad and a fluid droplet.
9. The system of claim 1 , wherein the treating of the first surface the polishing pad with the atmospheric plasma increases a wettability of the first surface the polishing pad.
10. The system of claim 1 , wherein the atmospheric plasma generator further comprises a jet head configured to directly apply the atmospheric plasma to the first surface the polishing pad.
11. The system of claim 10 , wherein the jet head is grounded to earth potential to hold back at least a portion of potential-carrying parts of the atmospheric plasma from reaching the first surface of the polishing pad.
12. The system of claim 1 , wherein the atmospheric plasma is directly applied to the first surface of the polishing pad at a location that is spaced apart from the wafer carrier.
13. The system of claim 1 , wherein the atmospheric plasma generator is further configured to directly apply the atmospheric plasma to the first surface of the polishing pad during polishing of the wafer by the first surface of the polishing pad.
14. The system of claim 1 , wherein the atmospheric plasma generator further comprises a direct current (DC) plasma jet comprising a jet head, the DC plasma jet is configured to:
generate a pulsed electric arc;
flow a process gas past the pulsed electric arc to excite the process gas into the atmospheric plasma; and
pass the atmospheric plasma through the jet head to directly apply the atmospheric plasma to the first surface the polishing pad.
15. The system of claim 14 , wherein the DC plasma jet is further configured to provide an electric discharge having a voltage in the range of 5-15 kV at a frequency in the range of 10-10 kHz to generate the pulsed electric arc.
16. A system for treating a component of a chemical mechanical planarization (CMP) system, the system comprising:
a polishing pad of a chemical mechanical planarization (CMP) system, the polishing pad having a first surface configured to polish a wafer; and
an atmospheric plasma generator configured to: generate atmospheric plasma at a pressure that is substantially the same as surrounding atmosphere, and directly apply the atmospheric plasma to the first surface of the polishing pad to modify a processing characteristic of the first surface of the polishing pad installed in the CMP system.