Efficient heat removal from electronic modules
An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.
1. An electronic module, comprising:
an operational subunit, having upper, lower and lateral surfaces, and comprising one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation,
wherein the operational subunit comprises an optoelectronic module having a window opening through the upper surface;
a heat sink, disposed in proximity to the lower surface of the operational subunit; and
a heat spreader, comprising a continuous sheet of a heat-conducting material, which is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit, and an upper side of the sheet overlies the upper surface of the operational subunit and has an opening through which the window is exposed.
2. The module according to claim 1 , wherein the heat-conducting material comprises graphite.
3. The module according to claim 1 , wherein the heat-conducting material comprises a flexible foil.
4. The module according to claim 1 , wherein the one or more electronic components comprise a light source.
5. The module according to claim 1 , wherein the sheet of the heat-conducting material is folded into a U-shape, which wraps around the operational subunit.
6. An electronic device, comprising:
a backplate;
the module according to claim 1 , which is mounted in the device with the heat sink in thermal contact with the backplate, such that a first part of the heat generated in the operational subunit is conducted through the heat spreader and heat sink to the backplate; and
a cover, which fits over the backplate and contains the module, such that a second part of the heat generated in the operational subunit is dissipated from the upper side of the heat spreader through the cover.
7. A method for producing an electronic module, the method comprising:
providing an operational subunit, having upper and lower surfaces, and comprising one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation,
wherein the operational subunit comprises an optoelectronic module having a window opening through the upper surface;
wrapping a heat spreader, comprising a continuous sheet of a heat-conducting material, around the operational subunit so that a lower side of the sheet covers the lower surface of the operational subunit, and an upper side of the sheet overlies the upper surface of the operational subunit and has an opening through which the window is exposed; and
fixing the lower side of the sheet to a heat sink.
8. The method according to claim 7 , wherein the heat-conducting material comprises graphite.
9. The method according to claim 7 , wherein the heat-conducting material comprises a flexible foil.
10. The method according to claim 7 , wherein the one or more electronic components comprise a light source.
11. The method according to claim 7 , wherein wrapping the heat spreader comprises folding the sheet of the heat-conducting material so that a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit, and the upper side of the sheet overlies the upper surface of the operational subunit.
12. The method according to claim 11 , wherein the sheet of the heat-conducting material is folded into a U-shape, which wraps around the operational subunit.
13. The method according to claim 11 , and comprising:
mounting the module in a device with the heat sink in thermal contact with a backplate of the device, such that a first part of the heat generated in the operational subunit is conducted through the heat spreader and heat sink to the backplate; and
fitting a cover over the backplate and contains the module, such that a second part of the heat generated in the operational subunit is dissipated from the upper side of the heat spreader through the cover.