Homogeneous densification of fill layers for controlled reveal of vertical fins
In accordance with an embodiment of the present invention, a method of forming a densified fill layer is provided. The method includes forming a pair of adjacent vertical fins on a substrate, forming an inner liner on the sidewalls of the adjacent vertical fins, and forming a sacrificial layer on the inner liner. The method further includes forming a fill layer between the pair of adjacent vertical fins, wherein the fill layer is in contact with at least a portion of the sacrificial layer, removing at least a portion of the sacrificial layer in contact with the fill layer to form sidewall channels adjacent to the fill layer, and subjecting the fill layer to a densification process to form the densified fill layer.
1. A vertical fin field effect transistor, comprising:
a pair of adjacent vertical fins on a substrate having a trench between the adjacent vertical fins;
a first liner on a base of the trench and a lower portion of each of facing sidewalls of the adjacent vertical fins;
a second liner directly on the first liner comprising a first material on portions of the first liner located on the lower portion of the facing sidewalls;
a third liner comprising a second material directly on portions of the first liner on the base of the trench, wherein the second material is different from the first material;
a fill layer on the second and third liners and between the pair of adjacent vertical fins; and
a gate structure on the fill layer, the first liner, the second liner, and a top portion of each of the adjacent vertical fins.
2. The vertical fin field effect transistor of claim 1 , wherein portions of the first and third liners on the base of the trench between the substrate and the fill layer are doped.
3. The vertical fin field effect transistor of claim 1 , wherein the fill layer is a flowable oxide having a dielectric constant of less than 3.9.
4. The vertical fin field effect transistor of claim 1 , wherein the second material comprises germanium dioxide (GeO 2 ) or amorphous carbon (a-C).
5. The vertical fin field effect transistor of claim 1 , wherein the first liner is made of a material selected from the group consisting of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), silicon borocarbonitride (SiBCN), and a combination thereof.
6. The vertical fin field effect transistor of claim 5 , wherein the first liner has a thickness in a range of about 3 nm to about 8 nm.
7. The vertical fin field effect transistor of claim 2 , wherein the second material comprises germanium oxide, and wherein a dopant in the second material is selected from the group consisting of yttrium (Y), aluminum (Al), scandium (Sc), and combinations thereof.
8. The vertical fin field effect transistor of claim 7 , wherein the gate structure comprises a conductive gate layer on at least a portion of a gate dielectric layer.
9. The vertical fin field effect transistor of claim 8 , further comprising a work function layer between the conductive gate layer and the gate dielectric layer.
10. A vertical fin field effect transistor, comprising:
a pair of adjacent vertical fins on a substrate having a trench between the adjacent vertical fins;
a first liner on a base of the trench and comprising a first material;
a second liner directly on a lower portion of each of facing sidewalls of the adjacent vertical fins and comprising a second material, wherein the second material is different from the first material;
a fill layer on the first and second liners and between the pair of adjacent vertical fins; and
a gate structure on the fill layer, the second liner, and a top portion of each of the adjacent vertical fins.
11. The vertical fin field effect transistor of claim 10 , wherein a portion of the second liner on the base of the trench further comprises a third material.
12. The vertical fin field effect transistor of claim 11 , wherein the second and third materials are doped and wherein the second material is selected from the group consisting of germanium dioxide (GeO 2 ) and amorphous carbon (a-C).
13. The vertical fin field effect transistor of claim 10 , wherein the gate structure comprises a conductive gate layer on at least a portion of a gate dielectric layer.
14. The vertical fin field effect transistor of claim 13 , further comprising a work function layer between the conductive gate layer and the gate dielectric layer.
15. The vertical fin field effect transistor of claim 10 , wherein the fill layer has a bulk modulus greater than 20 GPa (>20 GPa), and a hardness greater than 1 GPa.
16. A vertical fin field effect transistor, comprising:
a pair of adjacent vertical fins on a substrate having a trench between the adjacent vertical fins;
a first liner comprising (i) an inner liner section on a lower portion of sidewalls of the adjacent vertical fins and (ii) a doped liner section on a base of the trench;
a second liner directly on the first liner, the second liner comprising a first material on the inner liner section of the first liner;
a third liner comprising a second material directly on the doped liner section of the first liner, wherein the second material is different from the first material;
a fill layer on the second and third liners and between the pair of adjacent vertical fins;
a gate structure comprising a conductive gate layer on at least a portion of a gate dielectric layer on at least a portion of the adjacent vertical fins, the first liner, the second liner, and the fill layer; and
a work function layer between the conductive gate layer and the gate dielectric layer.
17. The vertical fin field effect transistor of claim 16 , wherein the second material is selected from a group consisting of germanium dioxide (GeO 2 ) and amorphous carbon (a-C).
18. The vertical fin field effect transistor of claim 17 , wherein a dopant in the second material is selected from a group consisting of yttrium (Y), aluminum (Al), scandium (Sc), and combinations thereof.
19. The vertical fin field effect transistor of claim 18 , wherein the fill layer has a bulk modulus greater than 8 gigapascals (>8 GPa).