Substrate inspection method and substrate inspection apparatus
A substrate inspection method includes: acquiring a feature amount of each of divided areas in an inspection target peripheral edge image, the inspection target peripheral edge image being an image of a peripheral portion of a target substrate as an inspection target, the divided areas being obtained by dividing a predetermined area in the image of the peripheral portion of the target substrate into a plurality of areas; and performing a predetermined determination concerning inspection of the peripheral portion of the target substrate based on an acquisition result in the acquiring the feature amount.
1. A substrate inspection method comprising:
acquiring a first feature amount of each of divided areas in an inspection target peripheral edge image, the inspection target peripheral edge image being an image of a peripheral portion of a target substrate as an inspection target, the divided areas being obtained by dividing a predetermined area in the image of the peripheral portion of the target substrate into a plurality of areas; and
performing a predetermined determination concerning inspection of the peripheral portion of the target substrate based on an acquisition result in the acquiring the first feature amount,
wherein the predetermined determination in each of the divided areas is performed by comparing the first feature amount of each of the divided areas in the inspection target peripheral edge image with a second feature amount of each of divided areas in a reference peripheral edge image, the reference peripheral edge image being an image of a peripheral portion of a reference substrate as a reference of the predetermined determination,
wherein each of the divided areas has a rectangular shape having an identical width, and
wherein the first feature amount is an average of pixel values in each of the divided areas having the identical width.
2. The substrate inspection method of claim 1 , wherein the first feature amount is an amount related to pixel values of a specific color.
3. The substrate inspection method of claim 1 , wherein the divided areas are obtained by dividing the predetermined area in a radial direction of the target substrate.
4. The substrate inspection method of claim 1 , wherein the divided areas are obtained by dividing the predetermined area in a circumferential direction of the target substrate.
5. The substrate inspection method of claim 1 , further comprising:
imaging the peripheral portion of the target substrate,
wherein the inspection target peripheral edge image is an image of the peripheral portion of the target substrate based on an imaging result in the imaging the peripheral portion.
6. A substrate inspection apparatus comprising:
a first feature amount acquisition part configured to acquire a first feature amount of each of divided areas in an inspection target peripheral edge image, the inspection target peripheral edge image being an image of a peripheral portion of a substrate as an inspection target, the divided areas being obtained by dividing a predetermined area in the image of the peripheral portion of the substrate into a plurality of areas; and
a determination part configured to perform a predetermined determination concerning inspection of the peripheral portion of the substrate based on an acquisition result in the first feature amount acquisition part,
wherein the predetermined determination in each of the divided areas is performed by comparing the first feature amount of each of the divided areas in the inspection target peripheral edge image with a second feature amount of each of divided areas in a reference peripheral edge image, the reference peripheral edge image being an image of a peripheral portion of a reference substrate as a reference of the predetermined determination,
wherein each of the divided areas has a rectangular shape having an identical width, and
wherein the first feature amount is an average of pixel values in each of the divided areas having the identical width.