Sacrificial cap for forming semiconductor contact
A method for forming a semiconductor device includes forming a fins on a substrate, forming a sacrificial gate stack over a channel region of the fins, a source/drain region with a first material on the fins, a first cap layer with a second material over the source/drain region, and a second cap layer with a third material on the first cap layer. A dielectric layer is deposited over the second cap layer. The sacrificial gate stack is removed to expose a channel region of the fins. A gate stack is formed over the channel region of the fins. A portion of the dielectric layer is removed to expose the second cap layer. The second cap layer and the first cap layer are removed to expose the source/drain region. A conductive material is deposited on the source/drain region.
1. A semiconductor device comprising:
semiconductor fins on a substrate;
source/drain regions comprising a crystalline material having top faceted surfaces and bottom faceted surfaces, one of the source/drain regions contacting each of the semiconductor fins;
a silicide material on each of the source/drain regions, the silicide material confined to a region having direct contact with a topmost portion of the top faceted surfaces of the source/drain regions;
a conformal air gap comprising a first portion in direct contact with the top faceted surfaces and a second portion in direct contact with the bottom faceted surfaces of the source/drain regions; and
a conductive contact formed on the top faceted surfaces of the source/drain regions and the silicide material, the conductive contact in direct contact with a portion of the conformal air gap on the top faceted surfaces.
2. The device of claim 1 further comprising dielectric material between adjacent semiconductor fins.
3. The device of claim 2 , wherein the dielectric material directly contacts the first portion and the second portion of the conformal air gap.
4. The device of claim 1 , wherein the bottom faceted surfaces of the crystalline material contact each of the semiconductor fins.
5. The device of claim 4 , wherein the top faceted surfaces of the crystalline material do not contact the semiconductor fins.
6. The device of claim 1 , wherein the silicide material on each of the source/drain regions does not directly contact the bottom faceted surfaces of the source/drain regions.
7. The device of claim 1 , wherein the silicide material comprises titanium silicide.
8. The device of claim 1 , wherein the semiconductor fins comprise two or more semiconductor fins.
9. The device of claim 8 , wherein the conductive contact comprises a shared contact electrically coupled to the two or more semiconductor fins.
10. The device of claim 1 , wherein the second portion of the conformal air gap directly contacts a sidewall of the semiconductor fins.
11. A method for forming a semiconductor device, the method comprising:
forming semiconductor fins on a substrate;
forming source/drain regions comprising a crystalline material having top faceted surfaces and bottom faceted surfaces, one of the source/drain regions contacting each of the semiconductor fins;
forming a silicide material on each of the source/drain regions, the silicide material confined to a region having direct contact with a topmost portion of the top faceted surfaces of the source/drain regions;
forming a conformal air gap comprising a first portion in direct contact with the top faceted surfaces and a second portion in direct contact with the bottom faceted surfaces of the source/drain regions; and
forming a conductive contact formed on the top faceted surfaces of the source/drain regions and the silicide material, the conductive contact in direct contact with a portion of the conformal air gap on the top faceted surfaces.
12. The device of claim 11 further comprising forming dielectric material between adjacent semiconductor fins.
13. The device of claim 12 , wherein the dielectric material directly contacts the first portion and the second portion of the conformal air gap.
14. The device of claim 11 , wherein the bottom faceted surfaces of the crystalline material contact each of the semiconductor fins.
15. The device of claim 14 , wherein the top faceted surfaces of the crystalline material do not contact the semiconductor fins.
16. The device of claim 11 , wherein the silicide material on each of the source/drain regions does not directly contact the bottom faceted surfaces of the source/drain regions.
17. The device of claim 11 , wherein the silicide material comprises titanium silicide.
18. The device of claim 11 , wherein the semiconductor fins comprise two or more semiconductor fins.
19. The device of claim 18 , wherein the conductive contact comprises a shared contact electrically coupled to the two or more semiconductor fins.
20. The device of claim 11 , wherein the second portion of the conformal air gap directly contacts a sidewall of the semiconductor fins.