Semiconductor device and semiconductor device fabrication method
A semiconductor device includes a printed circuit board in a peripheral portion of a housing portion of a case in which a laminated substrate is housed. A terminal block holding control terminals from which control signals are outputted to the printed circuit board is disposed over the printed circuit board. A gate electrode of a semiconductor chip and the printed circuit board are electrically connected by a wire.
1. A semiconductor device comprising:
a laminated substrate including an insulating board and a circuit board disposed over a front surface of the insulating board;
a semiconductor chip disposed over the circuit board;
a case having a shape of a frame that has a concavity formed in a central area thereof, the case having a housing area for housing the laminated substrate and the semiconductor chip, the housing area being formed in the concavity, the case being made of resin;
external connection terminals each having a first end portion, a second end portion lower than the first end portion, and a body portion; and
a printed circuit board having a first principal plane and a second principal plane opposite the first principal plane, disposed over a periphery of the housing area, electrically connected to a control electrode of the semiconductor chip by a connecting member, connected to the second end portions of the external connection terminals, and attached to the case, wherein
the second principal plane of the printed circuit board is fixed to a front surface of the frame of the case by integral molding,
a front surface of the semiconductor chip is located at a lower level than the first and second principal planes of the printed circuit board, and
an end portion of the printed circuit board extends from the case toward the semiconductor chip inside the housing area.
2. The semiconductor device according to claim 1 , wherein:
the printed circuit board has a wiring layer and a plurality of electrodes electrically connected to the wiring layer; and
the plurality of electrodes are arranged over the printed circuit board along the projecting end portion of the printed circuit board.
3. The semiconductor device according to claim 1 , wherein:
the printed circuit board has a plurality of through holes piercing from the first principal plane to the second principal plane; and
the plurality of through holes have therein resin.
4. The semiconductor device according to claim 3 , wherein the second end potions of the external connection terminals are each press-fitted in one of the plurality of through holes of the printed circuit board.
5. The semiconductor device according to claim 4 , wherein the first and second end portions of the external connection terminals are thicker than the body portions of the external connection terminals.
6. The semiconductor device according to claim 1 , wherein:
the semiconductor chip includes a plurality of semiconductor chips;
the plurality of semiconductor chips are disposed over the circuit board of the laminated substrate along the printed circuit board; and
control electrodes of the plurality of semiconductor chips are disposed along the printed circuit board and are electrically connected to the printed circuit board.
7. The semiconductor device according to claim 6 , wherein:
the plurality of semiconductor chips each have a main electrode; and
the semiconductor device further includes wiring terminals disposed along the printed circuit board and connected to the main electrodes of the plurality of semiconductor chips.
8. A semiconductor device comprising:
a laminated substrate including an insulating board and a circuit board disposed over a front surface of the insulating board;
a semiconductor chip disposed over the circuit board;
a case having a housing area for housing the laminated substrate and the semiconductor chip, the case being made of resin, the housing area being substantially rectangular including two first sides that are opposite to each other and two second sides that are opposite to each other;
external connection terminals each having a first end portion, a second end portion lower than the first end portion, and a body portion; and
a printed circuit board having a first principal plane and a second principal plane opposite the first principal plane, disposed over a periphery of the housing area, the second principal plane of the printed circuit board being fixed to a periphery of the case by integral molding, wherein
the printed circuit board is disposed along one side of the housing area, said side being one of the first sides,
the external connection terminals are disposed on the printed circuit board at one end thereof and at one of the second sides of the housing area,
the printed circuit board is electrically connected to a control electrode of the semiconductor chip by a connecting member,
a front surface of the semiconductor chip is located at a lower level than the first principal plane of the printed circuit board, and
an end portion of the printed circuit board extends from the case toward an inside of the housing area.
9. The semiconductor device according to claim 8 , wherein
the printed circuit board includes a first portion and a second portion that form a L-shape, the first portion being longer than the second portion,
the first portion of the printed circuit board is disposed along said one first side of the housing area, and
the external connection terminals are formed on the second portion of the printed circuit board.
10. The semiconductor device according to claim 8 , wherein the connecting member extends substantially in parallel to the second sides of the housing area.
11. The semiconductor device according to claim 8 , wherein the printed circuit board is disposed only along said side of the housing area.