Semiconductor device
A semiconductor device including an oxide semiconductor in which on-state current is high is provided. The semiconductor device includes a first transistor provided in a driver circuit portion and a second transistor provided in a pixel portion; the first transistor and the second transistor have different structures. Furthermore, the first transistor and the second transistor are transistors having a top-gate structure. In an oxide semiconductor film of each of the transistors, an impurity element is contained in regions which do not overlap with a gate electrode. The regions of the oxide semiconductor film which contain the impurity element function as low-resistance regions. Furthermore, the regions of the oxide semiconductor film which contain the impurity element are in contact with a film containing hydrogen. The first transistor provided in the driver circuit portion includes two gate electrodes between which the oxide semiconductor film is provided.
1. A semiconductor device comprising:
a first transistor over a substrate, the first transistor including:
a conductive film over the substrate;
a first insulating film over the conductive film;
a second insulating film on the first insulating film;
a first oxide semiconductor film on the second insulating film,
the first oxide semiconductor film overlapping with the conductive film;
a first gate insulating film on the first oxide semiconductor film;
a first gate electrode over the first gate insulating film; and
a first source electrode and a first drain electrode over and in direct contact with the first oxide semiconductor film;
a second transistor over the substrate, the second transistor including:
a second oxide semiconductor film on the second insulating film;
a second gate insulating film on the second oxide semiconductor film;
a second gate electrode over the second gate insulating film; and
a second source electrode and a second drain electrode over and in direct contact with the second oxide semiconductor film; and
a third insulating film covering the first oxide semiconductor film, the first gate insulating film, the first gate electrode, the second oxide semiconductor film, the second gate insulating film, and the second gate electrode,
wherein the first source electrode, the first drain electrode, the second source electrode, and the second drain electrode comprise the same materials of the first gate electrode and the second gate electrode.
2. The semiconductor device according to claim 1 , wherein each of the first gate insulating film and the second gate insulating film comprises oxygen.
3. The semiconductor device according to claim 1 , wherein each of the first gate electrode and the second gate electrode comprises one or more metal elements selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten.
4. The semiconductor device according to claim 1 , wherein the conductive film is configured to be a back-gate electrode of the first transistor.
5. The semiconductor device according to claim 1 , wherein the second transistor has a single-gate structure.
6. The semiconductor device according to claim 1 , wherein one of the first transistor and the second transistor is provided in a driver circuit portion of the semiconductor device, and the other of the first transistor and the second transistor is provided in a pixel portion of the semiconductor device.
7. A semiconductor device comprising:
a first transistor over a substrate, the first transistor including:
a conductive film over the substrate;
a nitride insulating film over the conductive film;
an oxide insulating film on the nitride insulating film;
a first oxide semiconductor film on the oxide insulating film, the first oxide semiconductor film overlapping with the conductive film;
a first gate insulating film on the first oxide semiconductor film;
a first gate electrode over the first gate insulating film; and
a first source electrode and a first drain electrode over and in direct contact with the first oxide semiconductor film;
a second transistor over the substrate, the second transistor including:
a second oxide semiconductor film on the oxide insulating film;
a second gate insulating film on the second oxide semiconductor film;
a second gate electrode over the second gate insulating film; and
a second source electrode and a second drain electrode over and in direct contact with the second oxide semiconductor film; and
an insulating film covering the first oxide semiconductor film, the first gate insulating film, the first gate electrode, the second oxide semiconductor film, the second gate insulating film, and the second gate electrode,
wherein the first source electrode, the first drain electrode, the second source electrode, and the second drain electrode comprise the same materials of the first gate electrode and the second gate electrode.
8. The semiconductor device according to claim 7 , wherein each of the first gate insulating film and the second gate insulating film comprises oxygen.
9. The semiconductor device according to claim 7 , wherein each of the first gate electrode and the second gate electrode comprises one or more metal elements selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten.
10. The semiconductor device according to claim 7 , wherein the conductive film is configured to be a back-gate electrode of the first transistor.
11. The semiconductor device according to claim 7 , wherein the second transistor has a single-gate structure.
12. The semiconductor device according to claim 7 , wherein one of the first transistor and the second transistor is provided in a driver circuit portion of the semiconductor device, and the other of the first transistor and the second transistor is provided in a pixel portion of the semiconductor device.
13. A semiconductor device comprising:
a first transistor over a substrate, the first transistor including:
a conductive film over the substrate;
a first insulating film over the conductive film;
a second insulating film on the first insulating film;
a first oxide semiconductor film on the second insulating film, the first oxide semiconductor film overlapping with the conductive film;
a first gate insulating film on the first oxide semiconductor film;
a first gate electrode over the first gate insulating film; and
a first source electrode and a first drain electrode over and in direct contact with the first oxide semiconductor film;
a second transistor over the substrate, the second transistor including:
a second oxide semiconductor film on the second insulating film;
a second gate insulating film on the second oxide semiconductor film;
a second gate electrode over the second gate insulating film; and
a second source electrode and a second drain electrode over and in direct contact with the second oxide semiconductor film; and
a third insulating film covering the first oxide semiconductor film, the first gate insulating film, the first gate electrode, the second oxide semiconductor film, the second gate insulating film, and the second gate electrode,
wherein each of the first gate electrode and the second gate electrode has a two-layer structure, and
wherein the first source electrode, the first drain electrode, the second source electrode, and the second drain electrode comprise the same materials of the first gate electrode and the second gate electrode.
14. The semiconductor device according to claim 13 , wherein each of the first gate insulating film and the second gate insulating film comprises oxygen.
15. The semiconductor device according to claim 13 , wherein each of the first gate electrode and the second gate electrode comprises one or more metal elements selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten.
16. The semiconductor device according to claim 13 , wherein the conductive film is configured to be a back-gate electrode of the first transistor.
17. The semiconductor device according to claim 13 , wherein the second transistor has a single-gate structure.
18. The semiconductor device according to claim 13 , wherein one of the first transistor and the second transistor is provided in a driver circuit portion of the semiconductor device, and the other of the first transistor and the second transistor is provided in a pixel portion of the semiconductor device.