Semiconductor device package and acoustic device having the same
A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.
1. An electronic device, comprising:
a substrate;
a microphone disposed on a surface of the substrate, and be adjacent to or on a center of the surface of the substrate;
a connector configured for external connection, and disposed on the surface of the substrate and at a first side of the microphone;
a feeding structure configured to feed a radio frequency (RF) signal to an antenna, and disposed on the surface of the substrate and at a second side of the microphone opposite to the first side of the microphone;
a plurality of ground pads disposed at two opposite sides of the feeding structure respectively;
a controller disposed on the surface of the substrate and at a third side of the microphone adjacent to the first side and the second side of the microphone;
at least one electronic component disposed between the microphone and the feeding structure, wherein a height of the at least one electronic component is less than a height of the microphone and a height of the feeding structure, and wherein the at least one electronic component includes a plurality of electronic components arranged in an array, and the electronic components and the ground pads together surround the feeding structure;
a first conductive pad disposed between the controller and the connector, wherein the first conductive pad is configured to connect a battery; and
a second conductive pad disposed at a fourth side of the microphone opposite to the third side of the microphone, wherein the second conductive pad is configured to connect a speaker.
2. The electronic device of claim 1 , wherein a first imaginary line extends through the center of the surface of the substrate, the first imaginary line extends through the microphone, the feeding structure and the connector.
3. The electronic device of claim 2 , wherein a second imaginary line perpendicular to the first imaginary line extends through the center of the surface of the substrate and the microphone, the second imaginary line is spaced apart from the feeding structure and the connector.
4. The electronic device of claim 3 , wherein a length of the connector measured along a direction parallel with the second imaginary line is greater than a sum of a width of the microphone measured along the direction and a width of the controller measured along the direction.
5. The electronic device of claim 4 , wherein a length of the microphone measured along a direction parallel with the first imaginary line is greater than a length of the controller measured along the direction parallel with the first imaginary line.
6. The electronic device of claim 5 , wherein a width of the feeding structure is less than the width of the microphone.
7. The electronic device of claim 6 , further comprising a plurality of electronic components disposed between the microphone and the feeding structure, and the electronic components are arranged in a row.