Semiconductor device package and acoustic device having the same
A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.
1. An electronic device, comprising:
a substrate;
a connector disposed over the substrate;
a feeding structure disposed over the substrate and configured to feed a radio frequency (RF) signal to an antenna; and
a conductive pad disposed adjacent to the connector and configured to connect a speaker,
wherein a central axis of a side of a surface of the substrate in a plan view passes the feeding structure.
2. The electronic device of claim 1 , wherein the feeding structure is in contact with the antenna.
3. The electronic device of claim 2 , further comprising a housing for accommodating the substrate, the connector and the feeding structure, wherein the antenna is formed on the housing.
4. The electronic device of claim 1 , wherein the substrate is electrically connected to the speaker through the connector and a flexible printed circuit, wherein the flexible printed circuit connects the connector with the speaker.
5. The electronic device of claim 1 , further comprising:
an electronic component disposed under the substrate and electrically connected to the substrate; and
an encapsulant encapsulating the electronic component and in contact with the substrate.
6. The electronic device of claim 1 , further comprising a microphone and a sensor disposed between the connector and the feeding structure in the plan view.
7. The electronic device of claim 1 , wherein the conductive pad is disposed between the connector and the feeding structure in the plan view.
8. The electronic device of claim 1 , wherein the conductive pad is disposed outside a projection of the feeding structure toward the connector in the plan view.
9. An electronic device, comprising:
a housing;
a battery accommodated by the housing; and
a device comprising:
a substrate;
a connector disposed over the substrate;
a conductive pad disposed adjacent to the connector and configured to connect the battery; and
a feeding structure disposed over the substrate and configured to feed a radio frequency (RF) signal to an antenna, wherein a height of the feeding structure is greater than a height of the connector.
10. The electronic device of claim 9 , further comprising a flexible printed circuit connecting the connector with the battery.
11. The electronic device of claim 10 , wherein a longitudinal direction of the flexible printed circuit is not perpendicular to a longitudinal direction of a lateral surface of the battery.
12. The electronic device of claim 10 , wherein a longitudinal direction of the flexible printed circuit is non-parallel to a central axis of the battery.
13. The electronic device of claim 9 , wherein the housing includes an antenna pattern, wherein the device is disposed between the antenna pattern and the battery, wherein the device is disposed outside a projection of the battery along an axial direction of the battery.
14. The electronic device of claim 13 , wherein the device includes a feeding structure disposed on a first surface of the substrate and in contact with the antenna pattern, wherein the substrate has a second surface opposite to the first surface and facing the battery.
15. The electronic device of claim 9 , further comprising an encapsulant encapsulating the substrate, wherein the substrate and the connector are separated from the battery by the encapsulant.
16. The electronic device of claim 9 , further comprising a speaker accommodated by the housing and separated from the battery by a space, wherein the battery has a first surface facing the speaker and a second surface opposite to the first surface, wherein an extension of the second surface of the battery passes the device.
17. An electronic device, comprising:
a housing;
a speaker accommodated by the housing;
a battery accommodated by the housing, wherein the battery has a first surface facing the speaker, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
a device accommodated by the housing and comprising:
a substrate having a first surface and a second surface opposite to the first surface; and
an encapsulant encapsulating the first surface of the substrate; and
a flexible printed circuit disposed over the second surface of the substrate and electrically connecting the substrate to the battery and the speaker, wherein the flexible printed circuit is electrically connected to the lateral surface of the battery.
18. The electronic device of claim 17 , further comprising a connector disposed on the second surface of the substrate and connecting the substrate with the flexible printed circuit.
19. The electronic device of claim 17 , wherein the device further comprises a first electronic component disposed under the first surface of the substrate and encapsulated by the encapsulant, wherein the first electronic component is spaced apart from the battery by the encapsulant.
20. The electronic device of claim 17 , wherein the lateral surface of the battery includes a first portion and a second portion opposite to the first portion, wherein a bottom surface of the device faces the first portion of the lateral surface of the battery, wherein the flexible printed circuit extends from a top surface of the device to the second portion of the lateral surface of the battery.