IP Library › Granted Patent US 10,716,220
Granted Patent B2
US 10,716,220 · App. 16/532,320 · Granted Jul 14, 2020

Variable temperature controlled soldering iron

Inventor: Hoa Nguyen (Santa Ana, CA)
Assignee: OK International, Inc.
H05K3/34B23K1/0016B23K3/02B23K3/025B23K3/03B23K3/033B23K3/0353B23K3/0471B23K3/0478B23K3/0615B23K3/08B23K31/125H05K3/3484B23K2101/42G01B21/08H05K1/0268H05K1/0269H05K3/306H05K3/341H05K3/3442H05K2203/04H05K2203/163
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Quick Facts
Patent No.
US 10,716,220
App. No.
16/532,320
Granted
Jul 14, 2020
Kind
B2
Abstract

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

Claims (25)

1. A soldering iron system with automatic variable temperature control comprising:

a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip;

a variable power supply for delivering variable power to the coil to heat the soldering tip;

a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input,

wherein the set temperature input is automatically adjustable by the processor based on one or more of a cartridge type, a tip type, a tip size, a tip shape, a thermal load type or size, and a quality of a soldering joint being formed by the solder tip and determined by the processor.

2. The soldering iron system of claim 1 , wherein the temperature sensor is a temperature sensor for sensing a temperature of the soldering tip, and the processor includes associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at the set temperature input.

3. The soldering iron system of claim 1 , wherein the control signal is a pulse width modulated signal to control the output power of the variable power supply.

4. The soldering iron system of claim 1 , wherein the processor determines the quality of the soldering joint by determining a thickness of an intermetallic compound (IMC) of the soldering joint and determining whether the thickness of the IMC is within a predetermined range.

5. The soldering iron system of claim 1 , wherein the processor generates an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range, and transmits the indication signal.

6. The soldering iron system of claim 1 , wherein the coil receives alternated electric current, generating electromagnetic induction to heat the soldering tip, which is an electrically conductive object, by eddy currents.

7. The soldering iron system of claim 1 , wherein the soldering cartridge includes a memory that stores a unique PID factor to maximize thermal performance.

8. A soldering iron system with automatic variable temperature control comprising:

a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip;

a variable power supply for delivering variable power to the coil to heat the soldering tip;

a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input,

wherein the soldering cartridge includes a plurality of soldering cartridges with each soldering cartridge of the plurality of soldering cartridges including a memory that stores a unique PID factor to maximize thermal performance.

9. The soldering iron system of claim 8 , wherein the soldering iron system uses the temperature sensor to control different temperature set points.

10. The soldering iron system of claim 8 , wherein the temperature sensor is a temperature sensor for sensing a temperature of the soldering tip, and the processor includes associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at the set temperature input.

11. The soldering iron system of claim 8 , wherein the control signal is a pulse width modulated signal to control the output power of the variable power supply.

12. The soldering iron system of claim 8 , wherein the set temperature input is adjustable by an operator of the soldering iron system.

13. The soldering iron system of claim 8 , wherein the set temperature input is automatically adjustable by the processor based on one or more of a cartridge type, a tip type, a tip size, a tip shape, a thermal load type or size, and a quality of a soldering joint being formed by the solder tip and determined by the processor.

14. The soldering iron system of claim 13 , wherein the processor determines the quality of the soldering joint by determining a thickness of an intermetallic compound (IMC) of the soldering joint and determining whether the thickness of the IMC is within a predetermined range.

15. The soldering iron system of claim 13 , wherein the processor generates an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range, and transmits the indication signal.

16. The soldering iron system of claim 8 , wherein the coil receives alternated electric current, generating electromagnetic induction to heat the soldering tip, which is an electrically conductive object, by eddy currents.

17. The soldering iron system of claim 8 , wherein the soldering cartridge includes a memory that stores a unique PID factor to maximize thermal performance.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2019
From: NGUYEN, HOA DINH
To: OK INTERNATIONAL, INC.
Reel/Frame 049963/0299 →
Continuity (8)
Continuation In Part 16365279 · Mar 26, 2019
Continuation In Part 15450425 · Mar 6, 2017
Continuation In Part 15333590 · Oct 25, 2016
Continuation 15096035 · Apr 11, 2016
Continuation 14966975 · Dec 11, 2015
Continuation In Part 14794678 · Jul 8, 2015
Provisional Application 62033037 · Aug 4, 2014
Related Publication 20190364668A1 · Nov 28, 2019