IP Library › Granted Patent US 11,424,138
Granted Patent B2
US 11,424,138 · App. 16/536,939 · Granted Aug 23, 2022

Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool

Inventor: Tomoatsu Ishibashi (Tokyo, JP)
Assignee: EBARA CORPORATION
H01L21/6704B08B3/08H01L21/02087H01L21/68764
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Quick Facts
Patent No.
US 11,424,138
App. No.
16/536,939
Granted
Aug 23, 2022
Kind
B2
Abstract

A substrate cleaning apparatus comprises a substrate holding roller and an edge cleaner. The substrate holding roller is configured to hold and rotate a substrate to be processed. The edge cleaner is in contact with an edge portion of the substrate to be processed and includes resin material containing fluororesin particles at least in a portion in contact with the substrate to be processed.

Claims (19)

1. A substrate cleaning apparatus comprising:

a spindle configured to hold and rotate a substrate to be processed; and

a first substrate cleaning tool and a second substrate cleaning tool each configured to come into contact with the substrate to be processed and clean the substrate, each of the first substrate cleaning tool and the second substrate cleaning tool comprising:

a plurality of large diameter portions and a plurality of small diameter portions, the large diameter portions being larger than the small diameter portions,

wherein the large diameter portions and the small diameter portions are alternately arranged in a longitudinal direction,

wherein at least the large diameter portions provide a substantially continuous contact surface across a longitudinal direction or around a circumferential direction of the cleaning tool,

at least one of the first cleaning tool or the second cleaning tool comprises a resin material where at least a portion in contact with a substrate to be processed contains fluororesin particles, and

wherein the first cleaning tool and the second cleaning tool are further arranged such that the large diameter portions of the first cleaning tool and the small diameter portions of the second cleaning tool are configured to engage with each other when the substrate to be processed is being processed.

2. The substrate cleaning tool according to claim 1 , further comprising:

at least a first region of the portion in contact with the substrate to be processed; and

a second region of the portion in contact with the substrate to be processed,

wherein a distribution density of the fluororesin particles varies between the first region and the second region.

3. The substrate cleaning tool according to claim 1 , wherein the fluororesin particles are contained in a surface of the substrate cleaning tool.

4. The substrate cleaning tool according to claim 1 , wherein the fluororesin particles are a conductive resin.

5. The substrate cleaning tool according to claim 1 , wherein the fluororesin particles are a resin containing carbon nanotubes.

6. The substrate cleaning apparatus according to claim 1 , wherein the substrate cleaning tool cleans a bevel or a back surface of the rotated substrate to be processed.

7. The substrate cleaning apparatus according to claim 1 , wherein the first cleaning tool and the second cleaning tool are arranged so as not to be in contact with each other.

8. The substrate cleaning apparatus according to claim 1 , wherein the first cleaning tool and the second cleaning tool are arranged such that a bevel and an edge of the substrate to be processed is inserted between the first cleaning tool and the second cleaning tool, and

wherein the first cleaning tool and the second cleaning tool are configured to be swingable in a direction parallel to the surface of the substrate to be processed.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2019
From: ISHIBASHI, TOMOATSU
To: EBARA CORPORATION
Reel/Frame 050073/0854 →
Priority Claims (1)
JP JP2018-150053 · Aug 9, 2018 · national
Continuity (1)
Related Publication 20200066549A1 · Feb 27, 2020