Use of metal-core printed circuit board (PCB) for generation of ultra-narrow, high-current pulse driver

1. A metal-core printed circuit board (MCPCB) apparatus comprising:

a rigid, metal heat sink layer;

at least one electrically conductive top layer having at least one conductive trace and at least one via not extending above the at least one electrically conductive top layer, wherein a thickness of the rigid, metal heat sink layer is greater than a thickness of the at least one electrically conductive top layer;

at least one electrically insulating dielectric layer positioned between the electrically conductive top layer and the rigid, metal heat sink layer and extending fully across a top surface of the rigid, metal heat sink layer, wherein the electrically insulating dielectric layer has a thickness of less than 0.007 inches and a lower dielectric constant (μ r ) than FR-4, and wherein the thickness of the electrically insulating dielectric layer is constant across the rigid, metal heat sink layer; and

a switching element mounted above the at least one electrically insulating dielectric layer, wherein the switching element comprises a high-current, ultra-narrow driver circuit of a GaN (Gallium Nitride) MOSFET (Metal-Oxide Semiconductor Field-Effect Transistor) type;

wherein the MCPCB is free from additional heat sinks, thermal pads, greases, or clips.

2. The apparatus of claim 1 , wherein the high-current, ultra-narrow driver circuit is capable of driving peak currents of greater than 50A in a full-wave half-maximum (FWHM) pulse width of less than 10 ns.

3. The apparatus of claim 1 , wherein the at least one conductive trace further comprises a top conductive layer and a bottom conductive layer, wherein the at least one electrically insulating dielectric layer is positioned between the top conductive layer and the bottom conductive layer, and wherein a polymer dielectric layer is positioned between the bottom conductive layer and the rigid, metal heat sink.

4. The apparatus of claim 1 , wherein the at least one electrically insulating dielectric layer has a thickness of between 0.006 inches and 0.002 inches, or between 0.005 inches and 0.001 inches, or between 0.002 inches and 0.001 inches, or less than 0.001 inches.

5. The apparatus of claim 1 , wherein the MCPCB is used in at least one of: a LIDAR source, or a laser illumination source.

6. A method of generating an ultra-narrow, high-curve t pulse driver with a metal-core printed circuit board (MCPCB), the method comprising:

providing the MCPCB having:

a rigid, metal heat sink layer;

at least one electrically conductive top layer having at least one conductive trace and at least one via not extending above the at east one electrically conductive top layer, wherein a thickness of the rigid, metal heat sink layer is greater than a thickness of the at least one electrically conductive top layer;

at least one electrically insulating dielectric layer positioned between the electrically conductive top layer and the rigid, metal heat sink layer and extending fully across a top surface of the rigid, metal heat sink layer, wherein the electrically insulating dielectric layer has a thickness of less than 0.007 inches and a lower dielectric constant (μ r ) than FR-4, and wherein the thickness of the electrically insulating dielectric layer is constant across the rigid, metal heat sink layer; and

a switching element mounted above the at least one electrically insulating dielectric layer, wherein the switching element comprises a high-circuit, ultra-narrow drives circuit of a GaN (Gallium Nitride) MOSFET (Metal-Oxide Semiconductor Field-Effect Transistor) type;

wherein the MCPCB is free from additional heat sinks, thermal pads, greases, or clips; and

applying a voltage to the at least one conductive trace of the MCPCB, thereby generating an ultra-narrow, high-current pulse.

7. The method of claim 6 , wherein the high-current, ultra-narrow driver circuit is capable of driving peak currents of greater than 50A in a full-wave half-maximum (FWHM) pulse width of less than 10 ns.

8. The method of claim 6 , wherein the at least one copper trace farther comprises a top conductive layer and a bottom conductive layer, wherein the at least one electrically insulating dielectric layer is positioned between the top and bottom conductive layers, and wherein a polymer dielectric layer is positioned between the bottom conductive layer and the rigid, metal heat sink.

9. The method of claim 6 , wherein the at least one electrically insulating dielectric layer has a thickness of between 0.006 inches to 0.002 inches, or between 0.005 inches and 0.001 inches, or between 0.002 inches and 0.001 inches, or less than 0.001 inches.

10. The method of claim 6 , wherein the MCPCB is used in at least one of: a LIDAR source, or a laser illumination source.

11. The method of claim 6 , wherein a resulting peak current is greater than 50 amperes peak and a full-wave half-maximum (FWHM) current pulse width is less than 10 nanoseconds.

12. An electrically-activated product comprising:

a power source;

a metal-core printed circuit board (MCPCB) having:

a rigid, metal heat sink;

at least one electrically conductive layer top layer and at least one via not extending above the at least one electrically conductive top layer, wherein a thickness of the rigid, metal heat sink layer is greater than a thickness of the at least one electrically conductive top layer;

at least one electrically insulating dielectric layer positioned between the electrically conductive top layer and the rigid, metal heat sink layer and extending fully across a top surface of the rigid, metal heat sink layer, wherein the electrically insulating dielectric layer has a thickness of less than 0.007 inches and a lower dielectric constant (μ r ) than FR-4, and wherein the thickness of the electrically insulating dielectric layer is constant across the rigid, metal heat sink layer; and

a switching element mounted above the at least one electrically insulating dielectric layer, wherein the switching element comprises high-current, ultra-narrow driver circuit of a GaN (Gallium Nitride) MOSFET (Metal-Oxide Semiconductor Field-Effect Transistor) type;

wherein the MCPCB is free from additional heat sinks, thermal pads, greases, or clips; and

wherein, in response to an applied voltage from the power source, the MCPCB generates an ultra-narrow, high current pulse.

13. The electrically-activated product of claim 12 , wherein the at least one electrically insulating dielectric layer has a thickness of between 0.006 inches and 0.002 inches, or 0.005 inches and 0.001 inches, or between 0.002 inches and 0.001 inches, or less than 0.001 inches.