Granted Patent B2

US 12,689,178 · App. 18/115,615 · Granted Jul 21, 2026

Inventors: Lihui Zheng (Tucson, AZ); Gregory Pennington (Tucson, AZ); Jason Helmrich (Tucson, AZ); Connor Magness (Tucson, AZ); Prabhuram Thiagarajan (Tucson, AZ)

Assignee: LEONARDO ELECTRONICS US INC.

H01S5/02469H01S5/005H01S5/4031

Abstract

Claims (36)

1 . A laser diode apparatus, comprising:

a laser diode array having an emission surface and a mounting surface, wherein at least one mounting plate is affixed to the mounting surface;

a heatsink in thermal communication with the laser diode array at the mounting surface, the heatsink extending perpendicularly away from at least one edge of the emission surface;

positive and negative electrical terminal blocks in mechanical communication with the heatsink opposite the laser diode array;

electrical foils in electrical communication with the laser diode array and the positive and negative terminal blocks, the electrical foils extending perpendicularly away from the emission surface, wherein the positive and negative electrical terminal blocks are electrically isolated from the heatsink; and

an optical assembly located on the laser diode array within an emission path of the laser diode array, the optical assembly comprising a first optical component and at least a second optical component, wherein the first optical component is affixed to the at least one mounting plate by at least a first mounting tab having a first length, and wherein the at least second optical component is affixed to the at least one mounting plate by at least a second mounting tab having at least a second length, and wherein the first and at least second lengths correspond to a distance between the laser diode array and the optical assembly, and

wherein a cross-sectional footprint of the heatsink, positive and negative electrical terminal blocks, electrical foils, and optical assembly is not larger than 120% of a cross-sectional footprint of the laser diode array.

2 . The apparatus of claim 1 , wherein the laser diode array, positive and negative electrical terminal blocks, and electrical foils are soldered to the heatsink.

3 . The apparatus of claim 1 , wherein the optical assembly does not extend beyond the cross-sectional footprint of the laser diode array.

4 . The apparatus of claim 1 , wherein the first and at least second mounting tabs are soldered to the at least one mounting plate and to the first and at least second optical components, respectively.

5 . The apparatus of claim 1 , wherein the first and at least second mounting tabs are welded to the at least one mounting plate and to the first and at least second optical components, respectively.

6 . The apparatus of claim 1 , wherein the positive and negative electrical terminal blocks are oriented in the same direction.

7 . The apparatus of claim 1 , wherein the electrical foils are located adjacent to the heatsink.

8 . The apparatus of claim 1 , wherein the electrical foils are connected to the laser diode array at opposite edges of the laser diode array.

9 . The laser diode apparatus of claim 1 , comprising a plurality of mounting plates affixed across at least one side of the mounting surface.

10 . The laser diode apparatus of claim 9 , wherein the first optical component is affixed to the plurality of mounting plates by a plurality of first mounting tabs having a first length, and wherein the at least second optical component is affixed to the plurality of mounting plates by a plurality of at least second mounting tabs having at least a second length.

11 . A method of manufacturing a laser diode assembly, comprising the following steps:

mechanically coupling a laser diode array and a heatsink, wherein the laser diode array has an emission surface and a mounting surface, wherein at least one mounting plate is affixed to the mounting surface, wherein the heatsink extends perpendicularly away from at least one edge of the emission surface, wherein the emission surface and the heatsink are in thermal communication;

mechanically coupling positive and negative electrical terminal blocks with the heatsink opposite the laser diode array;

electrically coupling electrical foils with the laser diode array and the positive and negative terminals, the electrical foils extending perpendicularly away from the emission surface, wherein the positive and negative electrical terminal blocks are electrically isolated from the heatsink; and

mechanically coupling an optical assembly on the laser diode array within an emission path of the laser diode array, the optical assembly comprising a first optical component and at least a second optical component, wherein the first optical component is affixed to the at least one mounting plate by at least a first mounting tab having a first length, and wherein the at least second optical component is affixed to the at least one mounting plate by at least a second mounting tab having at least a second length, and wherein the first and at least second lengths correspond to a distance between the laser diode array and the optical assembly, and

wherein a cross-sectional footprint of the heatsink, positive and negative electrical terminal blocks, electrical foils, and optical assembly is not larger than 120% of a cross-sectional footprint of the laser diode array.

12 . The method of claim 11 , wherein the laser diode array, positive and negative electrical terminal blocks, and electrical foils are soldered to the heatsink.

13 . The method of claim 11 , wherein the optical assembly does not extend beyond the cross-sectional footprint of the laser diode array.

14 . The method of claim 11 , wherein the first and at least second mounting tabs are soldered to the at least one mounting plate and to the first and at least second optical components, respectively.

15 . The method of claim 11 , wherein the first and at least second mounting tabs are welded to the at least one mounting plate and to the first and at least second optical components, respectively.

16 . The method of claim 11 , wherein the electrical foils are located adjacent to the heatsink.

17 . A method of attaching optical components to a laser diode array, comprising the following steps:

flowing solder along at least a portion of a first and at least second optical components;

positioning first and at least second mounting tabs on the first and at least second optical components, respectively, at a location of the flowed solder, wherein the first mounting tab has a first length, and wherein the at least second mounting tab has at least a second length, and wherein the first and at least second lengths correspond to a mounted distance between the laser diode array and the first and at least second optical components, respectively;

flowing solder along at least a portion of the laser diode array;

positioning at least one mounting plate on the laser diode array at a location of the flowed solder; and

attaching the first and at least second mounting tabs to the at least one mounting plate by at least one from the set of: soldering and welding.

18 . The method of claim 17 , wherein the first and at least second optical components are positioned one on top of another and within a cross-sectional footprint of the laser diode array.

19 . The method of claim 17 , wherein at least one of the first and at least second optical components comprises at least one pedestal extending from a surface of the at least one optical component, and wherein the solder is flowed along the at least one pedestal.

20 . The method of claim 17 , wherein at least one of the first and at least second mounting tabs is soldered to more than one of the first and at least second optical components.

Assignments (1)

Continuity (2)

References Cited (206)