Wavelength division multiplexing (WDM) optical modules

1. A Wavelength Division Multiplexing (WDM) optical module configured for M optical fibers, N WDM wavelengths and M×N optical signals, the module comprising:

an active silicon interposer, the interposer comprising:

a (M/2)×N array of photodetectors established on a front side of the interposer, and

N chips for the N WDM wavelengths, each chip comprising:

M lenses for M optical signals, the M lenses established on a back side of a GaAs substrate, the M lenses comprising a first group of M/2 lenses to focus M/2 optical input signals onto M/2 photodetectors of the (M/2)×N array, and a second group of M/2 lenses to collimate M/2 optical output signals, and

M/2 Vertical Cavity Surface Emitting Lasers (VCSELs) established on a front side of the GaAs substrate to generate the M/2 optical output signals.

2. The WDM optical module of claim 1 , further comprising an organic substrate, wherein the back side of the active silicon interposer is bonded to the organic substrate, and wherein the front side of the GaAs substrate is bonded to the front side of the active silicon interposer with solder reflow.

3. The WDM optical module of claim 1 , wherein each chip comprises:

M/2 antireflection (AR) coated surfaces established on the front side of the GaAs substrate and along the optical path between the first group of M/2 lenses and the M/2 photodetectors;

M/2 semiconductor optical amplifiers (SOA) established in the location of the M/2 antireflection (AR) coated surfaces; and

an additional AR coated surface established on a top side of each of the M lenses.

4. The WDM optical module of claim 2 , wherein each of the M/2 coated surfaces comprises a VCSEL epi material or GaAs substrate.

5. The WDM optical module of claim 4 , wherein the active silicon interposer further comprises at least one optical power monitor for one or more VCSELs of the (M/2)×N array of VCSELs, the at least one optical power monitor being biased by one or more DC bias circuits.

6. The WDM optical module of claim 4 , further comprising an integrated chip (IC) bonded on the organic substrate, wherein the IC is configured to:

receive electrical input from the (M/2)×N array of TIAs with through-silicon via (TSVs) and electrical traces; and

transmit electrical output to the (M/2)×N array of laser diode drivers (LDD) with electrical traces and TSVs.

7. The WDM optical module of claim 6 , further comprising at least one heat sink attached to the IC and at least one heat sink attached to the interposer.

8. The WDM optical module of claim 1 , wherein the active silicon interposer further comprises one or more temperature sensors.

9. The WDM optical module of claim 1 , wherein the (M/2)×N array of photodetectors are avalanche photodiodes (APD).

10. The WDM optical module of claim 1 , further comprising an optical connector assembly, the optical connector assembly comprising:

an optical ferrule connected to M optical fibers transmitting the M×N optical signals;

a turning mirror adapted to turn the M×N optical signals; and

N−1 relay mirrors adapted to relay the M×N optical signals.

11. The WDM optical module of claim 1 , further comprising:

a multiplexer/demultipexer configured to multiplex/demultiplex the M×N optical signals for each of the N WDM wavelengths;

a WDM filter for each WDM wavelength, each WDM filter configured to pass optical signals with a unique wavelength from the N WDM wavelengths; and

an index matched optically transparent underfill between the N chips for the N WDM wavelengths and the active silicon interposer.

12. The WDM optical module of claim 1 , wherein the active silicon interposer further comprises:

a (M/2)×N array of laser diode drivers (LDD) established on the front side of the interposer, wherein for the M/2 optical output signals and for each chip:

M/2 LDDs of the array are to provide electrical signals to the M/2 VCSELs;

a (M/2)×N array of transimpedance amplifiers (TIA) connected to the (M/2)×N array of photodetectors;

a plurality of DC bias circuits to bias the M/2 VCSELs for each chip and the (M/2)×N array of photodetectors; and

a plurality of impedance matching circuits to match the impedance of the (M/2)×N array of LDDs and the (M/2)×N array of TIAs to electrical traces comprised on the organic substrate.

13. A method comprising:

establishing a (M/2)×N array of photodetectors on a front side of an active silicon interposer;

building N chips for N Wavelength Division Multiplexing wavelengths by, for each chip:

establishing M lenses for the M optical signals on a back side of a GaAs substrate, and

establishing M/2 Vertical Cavity Surface Emitting Lasers (VCSELs) on a front side of the GaAs substrate.

14. The method of claim 13 , further comprising:

bonding the GaAs substrate by the front side to the front side of the active silicon interposer; and

flip chipping the active silicon interposer on an organic substrate.

15. The method of claim 14 , further comprising:

establishing an optical connector assembly on the organic substrate, the optical connector comprising means for:

plugging M optical fibers transmitting the M×N optical signals;

turning the M×N optical signals;

relaying the M×N optical signals;

multiplexing/demultiplexing the M×N optical signals for each of the N WDM wavelengths; and

filtering the M×N optical signals by establishing a WDM filter for each WDM wavelength.

16. The method of claim 13 , further comprising:

establishing a (M/2)×N array of laser diode drivers (LDD) on the front side of the interposer, wherein for M/2 optical output signals from the M signals and for each chip:

configuring M/2 VCSELs to emit the M/2 optical output signals; and

collimating the emitted M/2 optical output signals with a second group of M/2 lenses,

wherein M/2 LDDs of the array provides electrical signals to the M/2 VCSELs; and

establishing a (M/2)×N array of transimpedance amplifiers (TIA) associated with the (M/2)×N array of photodetectors on the interposer.

17. The method of claim 16 , further comprising:

establishing an optical power monitor for one or more VCSELs of the (M/2)×N array of VCSELs on the active silicon interposer;

flip chipping an integrated chip (IC) on the organic substrate, wherein the IC is configured to:

receive electrical input from the (M/2)×N array of TIA with TSVs (through-silicon via) and electrical traces; and

transmit electrical output to the (M/2)×N array of laser diode drivers (LDD) with electrical traces and TSVs.

18. A method comprising:

receiving at the WDM optical module M×N optical signals via M optical fibers, the WDM optical module comprising:

an active silicon interposer comprising a (M/2)×N array of photodetectors established on a front side of the interposer, and

a chip for each WDM wavelength, each chip comprising:

M lenses for M optical signals, the M lenses established on a back side of a GaAs substrate, the M lenses comprising a first group of M/2 lenses to focus M/2 optical input signals and a second group of M/2 lenses to collimate M/2 optical output signals;

converting the M/2 optical input signals entering each chip into electrical output signals by means of M/2 photodetectors of the (M/2)×N array; and

converting electrical input signals into the M/2 optical output signals exiting each chip by means of M/2 Vertical Cavity Surface Emitting Lasers (VCSELs) established on a front side of the GaAs substrate.

19. The method of claim 18 , further comprising:

transmitting the electrical output signals from the interposer to an integrated chip (IC) comprised in the WDM optical module, and

receiving the electrical input signals for each chip from the IC.

20. The method of claim 18 , further comprising:

multiplexing/demultiplexing the M×N optical signals for each of the N WDM wavelengths; and

filtering the M×N optical signals by establishing a WDM filter for each WDM wavelength, wherein each WDM filter is configured to pass optical signals with a unique wavelength from the N WDM wavelengths.