Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate
The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.
1. A radiant heat substrate, comprising:
a conductive substrate formed of a metal material and having:
a front surface on which a luminous element is disposed at a mounting region,
a rear surface opposite to the front surface, and
a through hole defined at a region where the luminous element is disposed;
a metal oxide film which covers the front and rear surfaces of the conductive substrate, and a surface of the through hole of the conductive substrate in a conformal manner;
a heat transfer via filled in the through hole and interposed between the metal oxide film; and
a metal pattern which covers the metal oxide film disposed on the front surface of the conductive substrate, wherein:
the luminous element includes a body and electrical terminals,
and the metal pattern comprises:
a heat transfer pad bonded to and in contact with a lower surface of the body of the luminous element; and
a circuit line disposed at a region except for the mounting region such that the circuit line is disconnected with the heat transfer pad and is electrically connected to the electrical terminals wherein the heat transfer via has a hollow structure, and the radiant heat substrate further includes a filler formed of an epoxy resin and filled in a vacant space inside the heat transfer via.
2. The radiant heat substrate according to claim 1 , wherein:
the metal pattern is disposed to further cover the rear surface of the conductive substrate, and
the heat transfer via has one end connected only to the heat transfer pad, and the other end connected to the metal pattern disposed on the rear surface.
3. The radiant heat substrate according to claim 1 , wherein:
the metal pattern further covers the rear surface of the conductive substrate, and
the metal oxide film is an anti-leakage current film for preventing the leakage currents from the conductive substrate to the outside through the metal pattern disposed on the rear surface.
4. The radiant heat substrate according to claim 1 , wherein:
the conductive substrate is formed of an Al material,
the metal oxide film includes an Al 2 O 3 layer, and
the metal pattern is formed of a Cu material.
5. A luminous element package, comprising:
a luminous element comprising a body and electrical terminals;
a conductive substrate formed of a metal material and having:
a front surface on which the luminous element is disposed at a mounting region,
a rear surface opposite to the front surface, and
a through hole defined on a region where the luminous element is disposed;
a metal oxide film which covers the front and rear surfaces of the conductive substrate, and the through hole of the conductive substrate;
a heat transfer via filled in the through hole and interposed between the metal oxide film; and
a metal pattern which covers the metal oxide film disposed on the front surface,
wherein the metal pattern comprises:
a heat transfer pad bonded to and in contact with a lower surface of the body of the luminous element; and
a circuit line disposed at a region except for the mounting region such that the circuit line is disconnected with the heat transfer pad and is electrically connected to the electrical terminals of the luminous element the heat transfer via has a hollow structure, and the radiant heat substrate further includes a filler formed of an epoxy resin and filled in a vacant space inside the heat transfer via.
6. The luminous element package according to claim 5 , wherein:
the metal pattern further covers the rear surface of the conductive substrate, and
the heat transfer via has one end connected only to the heat transfer pad, and the other end connected to the metal pattern formed on the rear surface.
7. The luminous element package according to claim 5 , wherein:
the metal pattern is disposed to further cover the metal oxide film, and
the metal oxide film is an anti-leakage current film for preventing leakage currents from the conductive substrate to the outside through the metal pattern covering the metal oxide film.
8. The luminous element package according to claim 5 , wherein:
the conductive substrate is formed of an Al material,
the metal oxide film includes an Al 2 O 3 layer, and
the metal pattern is formed of a Cu material.