Method and apparatus for positioning heating elements
An underlayment system is provided that includes a plurality of protrusions that extend from a common base member. The protrusions and base member can include an opening therethrough that allows for subsequent layers of material, such as adhesive, to interact and bond to each other. The protrusions are arranged in such a way to contain a wire, string, or heating element, within a receiving area. The arrangement of the protrusions allow for routing of the wire, string, or heating element in a variety of angles, bends, and other routing layouts.
1. A floor underlayment, comprising:
a base; and
a plurality of routing hubs arranged in rows and columns, each routing hub comprising:
a plurality of contact surfaces symmetrically arranged about a center point of the routing hub, each contact surface substantially planar and offset from the base by a first height;
a plurality of element receiving surfaces curved in a plane that is parallel to the plurality of contact surfaces, each element receiving surface extending from the base to one contact surface of the plurality of contact surfaces, each element receiving surface having a first portion substantially perpendicular to the one contact surface and a second portion disposed at an angle to the one contact surface and extending away from the center point, the first portion positioned between the base and the second portion; and
an interior surface sloping downward from one of the plurality of contact surfaces toward the base in the direction of the center point.
2. The underlayment of claim 1 , wherein an interior surface slopes downward from each of the plurality of contact surfaces.
3. The underlayment of claim 2 , wherein each routing hub comprises at least four protrusions equally-spaced about an array axis extending through the center point of the routing hub.
4. The underlayment of claim 1 , wherein a channel extends between each adjacent pair of contact surfaces toward the center point.
5. The underlayment of claim 4 , wherein each channel is adapted to receive one of at least adhesive, epoxy, grout, cement, glue, and plastic.
6. The underlayment of claim 1 , further comprising a plurality of routing element receiving cavities that have a maximum width proximate the base and a minimum width proximate the first height.
7. The underlayment of claim 1 , wherein each of the plurality of contact surfaces is formed from a first material and the base is also formed from the first material.
8. A floor assembly, comprising;
an underlayment layer comprising:
a base; and
a plurality of routing hubs arranged in rows and columns, each routing hub comprising:
a plurality of contact surfaces symmetrically arranged about a center point of the routing hub, each contact surface substantially planar and offset from the base by a first height;
a plurality of element receiving surfaces curved in a plane that is parallel to the plurality of contact surfaces, each element receiving surface extending from the base to one contact surface of the plurality of contact surfaces, each element receiving surface having a first portion substantially perpendicular to the one contact surface and a second portion disposed at an angle to the one contact surface and extending away from the center point, the first portion positioned between the base and the second portion; and
an interior surface sloping downward from each of the plurality of contact surfaces toward the base in the direction of the center point; and
a heating element contained within at least one of the plurality of element receiving cavities.
9. The floor assembly of claim 8 , further comprising:
a pad layer, wherein the pad layer is attached to the base layer.
10. The floor assembly of claim 9 , wherein the pad layer is attached to the base layer by at least one of adhesive, thermal bonding, welding, and mechanical attachment.
11. The floor assembly of claim 9 , wherein the pad layer is at least one of foil, cork, rubber, plastic, concrete, wood, organic materials, inorganic materials, composites, and compounds.
12. The floor assembly of claim 9 , further comprising a sub floor, wherein the sub floor is attached to a bottom side of the pad layer.
13. The floor assembly of claim 8 , wherein the heating element is one of a wire and a fluid conduit.
14. An underlayment comprising:
a base; and
a plurality of routing hubs, each routing hub comprising:
a plurality of contact surfaces symmetrically arranged about a center point of the routing hub, each contact surface substantially planar and offset from the base by a first height;
a plurality of element receiving surfaces having a concave curvature relative to the center point, each element receiving surface extending from the base to one contact surface of the plurality of contact surfaces, each element receiving surface having a perpendicular portion proximate the base and an angled portion proximate the contact surface, the angled portion extending away from the center point; and
an interior surface sloping downward from each of the plurality of contact surfaces toward the base in the direction of the center point.
15. The underlayment of claim 14 , further comprising a channel extending toward the center point between adjacent pairs of contact surfaces of each of the plurality of routing hubs.
16. The underlayment of claim 15 , wherein each channel is adapted to receive one of at least adhesive, epoxy, grout, cement, glue, and plastic.
17. The underlayment of claim 14 , wherein each of the plurality of routing hubs is integrally formed with the base.
18. The underlayment of claim 14 , wherein the plurality of routing hubs is arranged in a matrix configuration.
19. The underlayment of claim 14 , further comprising a plurality of routing element receiving cavities, each routing element receiving cavity having a maximum width proximate the base and a minimum width proximate the first height.
20. The underlayment of claim 19 , further comprising a heating element disposed in at least one of the plurality of routing element receiving cavities.