Granted Patent B2

US 12,735,903 · App. 16/899,582 · Granted Sep 15, 2026

Inventors: Rodger Bennett (Newport News, VA); Celeste Vaughn (Newport News, VA)

E04F15/185E04B5/48E04F13/02E04F15/02194E04F15/082E04F15/182

Abstract

Claims (57)

1 . An insulating modular panel configuration comprising:

i) at least one panel having an edge, a depth adjacent said edge, a width, and a length;

ii) a generally planar top surface formed at a top end of said edge defining the upper most surface of said panel and extending across said width and along said length;

iii) a generally planar bottom surface, formed at a lower end of said edge and generally parallel to said top surface, on said panel for coupling to an installation surface;

iv) at least one channel formed into said depth and extending through said depth from said top surface to near said bottom surface, and extending generally along said width, thereby defining said at least one channel within said depth;

v) at least a second channel formed into said depth and extending through said depth from said top surface to near said bottom surface, and extending generally along said length, thereby defining said at least a second channel within said depth;

where said at least one channel and said at least a second channel are configured to receive an elongated transfer element, said transfer element being used to transfer energy;

wherein said at least one channel and said at least a second channel are open at said generally planar top to receive said elongated transfer element;

wherein the at least one panel is configured to be installed across an installation surface;

wherein the composition of the at least one panel is selected to provide thermal insulation between the installation surface and a top surface of said at least one panel;

wherein the configuration of the at least one panel is selected to provide a secure connection between the installation surface and a top surface of said at least one panel; and

wherein the at least one panel is configured for installation on said installation surface as part of a modular system.

2 . The configuration of claim 1 wherein the at least one panel is made of a material having a density between 0.5 and 6 lbs. per cubic feet.

3 . The configuration of claim 1 wherein said panel comprises expanded polystyrene foam.

4 . The configuration of claim 1 further comprising apertures.

5 . The configuration of claim 4 wherein the apertures are filled.

6 . The configuration of claim 4 wherein the apertures include tapered walls.

7 . The configuration of claim 1 further comprising a plurality of said at least one channel.

8 . The configuration of claim 1 wherein said plurality of channels are spaced 3 inches or 6 inches or 9 inches or 12 inches on center.

9 . The configuration of claim 1 wherein said bottom surface further comprises at least one protrusion or at least one depression.

10 . The configuration of claim 1 wherein the installation surface is a subfloor.

11 . An insulating modular panel configuration comprising:

i) at least one panel having an edge and a depth adjacent said;

ii) a top surface on said panel, said top surface defining an uppermost surface of said panel;

iii) a bottom surface on said panel for coupling to an installation surface, wherein the bottom surface is spaced from the top surface a distance equal to about said depth;

iv) a plurality of apertures formed in said panel extending from said top surface to near said bottom surface such that the depth of said plurality of apertures is more than 50% of said depth;

wherein said apertures are configured to receive a filler material;

wherein the at least one panel is installed across an installation surface;

wherein the composition of the at least one panel is selected to provide thermal insulation between the installation surface and a top surface of said at least one panel;

wherein the configuration of the at least one panel is selected to provide a secure connection between the installation surface and a top surface of said at least one panel; and

wherein the at least one panel is configured for installation on said installation surface as part of a modular system.

12 . The configuration of claim 11 wherein the at least one panel is made of a material having a density between 0.5 and 6 lbs. per cubic feet.

13 . The configuration of claim 11 wherein the apertures are filled.

14 . The configuration of claim 11 wherein the apertures include tapered walls.

15 . The configuration of claim 11 wherein the installation surface is a sub-floor.

16 . A method of installation comprising the steps of:

i) providing at least one panel having an edge and a depth adjacent said edge; wherein said at least one panel includes an upper most top surface, a bottom surface, generally parallel to and spaced from said top surface, for coupling to an installation surface, and a channel formed in said panel extending from said top surface to near said bottom surface such that the depth of said channel is more than 50% of said depth, and wherein the channel is formed within said depth between the top surface and said bottom surface, where said at least one channel is configured to receive a transfer element adapted for transporting energy;

ii) coupling said at least one panel to said installation surface;

iii) providing a second one of said at least one panel having a channel;

iv) coupling said second panel to said installation surface;

v) placing one or more of said transfer element within the channel of the at least one panel and within the channel the second panel;

wherein the composition of the at least one panel is selected to provide thermal insulation between the installation surface and a top surface of said at least one panel; and wherein the configuration of the at least one panel is selected to provide a secure connection between the installation surface and a top surface of said at least one panel; and wherein the at least one panel is configured for installation on said installation surface as part of a modular system.

17 . A method of installation comprising the steps of:

i) providing at least one panel having an edge and a depth adjacent said edge; wherein said at least one panel includes an upper most top surface, a bottom surface, generally parallel to and spaced from said top surface, for coupling to an installation surface, and a plurality of apertures formed in said panel extending from said top surface to near said bottom surface such that the depth of said plurality of apertures is more than 50% of said depth, wherein the plurality of apertures are formed within said depth between the top surface and said bottom surface;

ii) coupling said at least one panel to said installation surface;

iii) providing a second one of said at least one panel having a plurality of apertures;

iv) coupling said second panel to said installation surface;

v) filling said apertures with a filler;

wherein the composition of the at least one panel is selected to provide thermal insulation between the installation surface and a top surface of said at least one panel; and wherein the configuration of the at least one panel is selected to provide a secure connection between the installation surface and a top surface of said at least one panel; and wherein the at least one panel is configured for installation on said installation surface as part of a modular system.

18 . A method of using first and second panels configured for installation as part of a modular system comprising the steps of:

i) providing the first panel having an edge and a depth adjacent said edge; wherein said first panel includes an upper most top surface, a bottom surface, generally parallel to and spaced from said top surface, for coupling to an installation surface, and a channel formed in said panel extending from said top surface to near said bottom surface such that the depth of said channel is more than 50% of said depth, wherein the channel is formed within said depth between the top surface and said bottom surface; wherein said channel is configured to receive a transfer element adapted for transporting energy;

ii) coupling said first panel to said installation surface;

iii) providing said second panel having a channel;

iv) coupling said second panel to said installation surface;

v) placing one or more of said transfer element within the channel of the first panel and the channel of the second panel;

wherein the composition of the first and second panels is selected to provide thermal insulation between the installation surface and a top surface of said first and second panels; and

wherein the configuration of the at least one panel is selected to provide a secure connection between the installation surface and a top surface of said first and second panels.

Continuity (2)

References Cited (142)