Planar transistor device comprising at least one layer of a two-dimensional (2D) material and methods for making such transistor devices
A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.
1. A planar transistor device comprising a gate having a gate length that extends in a gate length direction and a gate width that extends in a gate width direction, the transistor comprising:
a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface;
a first sidewall spacer and a second, opposite sidewall positioned adjacent the gate structure;
a channel region;
a source region;
a drain region; and
at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the at least one layer of 2D material has a substantially planar upper surface and a substantially planar bottom surface, wherein a lowermost bottom surface of the at least one layer of 2D material is positioned on and in contact with the substantially planar upper surface of the semiconductor substrate,
a first region of epi semiconductor material and a second region of epi semiconductor material positioned in the source region and the drain region, respectively, wherein the first region of epi semiconductor material conductively contacts a first sidewall of the at least one layer of 2D material, the second region of epi semiconductor material conductively contacts a second sidewall of the at least one layer of 2D material,
wherein the first and second sidewalls of the at least one layer of 2D material are aligned with a first sidewall of the first sidewall spacer and a second sidewall of the second sidewall spacer, respectively,
wherein the at least one layer of 2D material comprises a plurality of layers of 2D material in a vertically stacked arrangement,
wherein each of the plurality of layers of 2D material has a periodic crystallographic pattern, wherein the periodic crystallographic pattern of one of the plurality of layers of 2D material is rotated relative to the periodic crystallographic pattern of another of the plurality of layers of 2D material, and
wherein the first region of epi semiconductor material and the second region of epi semiconductor material are positioned on and in contact with the substantially planar surface of the semiconductor substrate.
2. The planar transistor device of claim 1 , wherein each of the plurality of layers of 2D material comprise a same 2D material.
3. The planar transistor device of claim 1 , wherein each of the plurality of layers of 2D material have a vertical thickness that is substantially the same.
4. The planar transistor device of claim 1 , wherein the at least one layer of 2D material comprises one of silicon, silicon germanium, a metal chalcogenide based material, a transition metal dichalcogenide (TMD), graphene, MoS 2 , MoSe 2 , MoTe 2 , WS 2 , WSe 2 , WTe 2 , HfS 2 , HfSe 2 , ZrS 2 , ZrSe 2 , NbSe 2 , or ReSe 2 and wherein the semiconductor substrate comprises one of a semiconductor-on-insulator (SOI) substrate or a bulk semiconductor substrate.
5. The planar transistor device of claim 1 , wherein the at least one layer of 2D material has a substantially uniform vertical thickness across an entire length of the at least one layer of 2D material in the gate length direction and across an entire width of the at least one layer of 2D material in the gate width direction.
6. The planar transistor device of claim 1 , wherein the at least one layer of 2D material extends across an entirety of the channel region.
7. The planar transistor device of claim 1 , wherein a bottom surface of the gate structure is positioned on and in contact with an uppermost surface of the at least one layer of 2D material.
8. The planar transistor device of claim 1 , wherein each of a bottom surface of the gate structure, a bottom surface of the first sidewall spacer and a bottom surface of the second sidewall spacer is positioned on and in contact with an uppermost surface of the at least one layer of 2D material.
9. The planar transistor device of 1 , further comprising a first source/drain contact structure that is conductively coupled to the first region of epi semiconductor material and a second source/drain contact structure that is conductively coupled to the second region of epi semiconductor material.
10. A planar transistor device comprising a gate having a gate length that extends in a gate length direction and a gate width that extends in a gate width direction, the transistor comprising:
a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface;
a sidewall spacer positioned adjacent the gate structure;
a channel region;
a source region;
a drain region;
at least one layer of a two-dimensional (2D) material that is positioned under the gate structure and the sidewall spacer, wherein the at least one layer of 2D material extends across an entirety of the channel region, wherein the at least one layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the at least one layer of 2D material in the gate length direction and across an entire width of the at least one layer of 2D material in the gate width direction, wherein a lowermost bottom surface of the at least one layer of 2D material is positioned on and in contact with the substantially planar upper surface of the semiconductor substrate; and
a first region of epi semiconductor material and a second region of epi semiconductor material positioned in the source region and the drain region, respectively, wherein the first region of epi semiconductor material conductively contacts a first edge of the at least one layer of 2D material, the second region of epi semiconductor material conductively contacts a second edge of the at least one layer of 2D material and wherein the first and second regions of epi semiconductor material are positioned on and in contact with the substantially planar upper surface of the semiconductor substrate,
wherein the at least one layer of 2D material comprises a plurality of layers of 2D material in a vertically stacked arrangement, and
wherein each of the plurality of layers of 2D material has a periodic crystallographic pattern, wherein the periodic crystallographic pattern of one of the plurality of layers of 2D material is rotated relative to the periodic crystallographic pattern of another of the plurality of layers of 2D material.
11. The planar transistor device of claim 10 , wherein each of the plurality of layers of 2D material comprise a same 2D material.
12. The planar transistor device of claim 10 , wherein each of the plurality of layers of 2D material have a vertical thickness that is substantially the same.
13. The planar transistor device of claim 10 , wherein the at least one layer of 2D material comprises one of silicon, silicon germanium, a metal chalcogenide based material, a transition metal dichalcogenide (TMD), graphene, MoS 2 , MoSe 2 , MoTe 2 , WS 2 , WSe 2 , WTe 2 , HfS 2 , HfSe 2 , ZrS 2 , ZrSe 2 , NbSe 2 , or ReSe 2 and wherein the semiconductor substrate comprises one of a semiconductor-on-insulator (SOI) substrate or a bulk semiconductor substrate.
14. The planar transistor device of claim 10 , wherein the at least one layer of 2D material has a substantially uniform vertical thickness across an entire length of the at least one layer of 2D material in the gate length direction and across an entire width of the at least one layer of 2D material in the gate width direction.
15. The planar transistor device of claim 10 , further comprising a first source/drain contact structure that is conductively coupled to the first region of epi semiconductor material and a second source/drain contact structure that is conductively coupled to the second region of epi semiconductor material.
16. The planar transistor device of claim 10 , wherein each of a bottom surface of the gate structure and a bottom surface of the sidewall spacer is positioned on and in contact with an uppermost surface of the at least one layer of 2D material.
17. A planar transistor device comprising a gate having a gate length that extends in a gate length direction and a gate width that extends in a gate width direction, the transistor comprising:
a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface;
a first sidewall spacer and a second, opposite sidewall positioned adjacent the gate structure;
a channel region;
a source region;
a drain region; and
a plurality of layers of two-dimensional (2D) material vertically stacked and positioned in any of the source region, the drain region, and the channel region, the plurality of layers of 2D material having a substantially planar upper and bottom surfaces,
wherein a lowermost bottom surface of the plurality of layers of 2D material is positioned on and in contact with the substantially planar upper surface of the semiconductor substrate,
wherein a first sidewall and a second sidewall of the plurality of layers of 2D material are aligned with a first sidewall of the first sidewall spacer and a second sidewall of the second sidewall spacer, respectively, and
wherein each of the plurality of layers of 2D material includes the same 2D material that has a periodic crystallographic pattern, wherein the periodic crystallographic pattern of one of the plurality of layers of 2D material is rotated relative to the periodic crystallographic pattern of another of the plurality of layers of 2D material;
a first region of epi semiconductor material and a second region of epi semiconductor material positioned in the source region and the drain region, respectively, wherein the first region of epi semiconductor material conductively contacts the first sidewall of the plurality of layers of 2D material, the second region of epi semiconductor material conductively contacts the second sidewall of the plurality of layers of 2D material.
18. The planar transistor device of 17 , wherein each layer of 2D material of the plurality of layers of 2D material has a vertical thickness that is substantially the same as the other layers of 2D material in the plurality of layers of 2D material.
19. The planar transistor device of claim 17 , wherein the plurality of layers of 2D material comprises any of silicon, silicon germanium, a metal chalcogenide based material, a transition metal dichalcogenide (TMD), graphene, MoS 2 , MoSe 2 , MoTe 2 , WS 2 , WSe 2 , WTe 2 , HfS 2 , HfSe 2 , ZrS 2 , ZrSe 2 , NbSe 2 , and ReSe 2 , and wherein the semiconductor substrate comprises any of a semiconductor-on-insulator (SOI) substrate and a bulk semiconductor substrate.
20. The planar transistor device of 17 , further comprising a first source/drain contact structure that is conductively coupled to the first region of epi semiconductor material and a second source/drain contact structure that is conductively coupled to the second region of epi semiconductor material.
21. The planar transistor device of 17 , wherein the first region of epi semiconductor material and the second region of epi semiconductor material are positioned on and in contact with the substantially planar surface of the semiconductor substrate.