Method of manufacturing a semiconductor device and a semiconductor device
In a method, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. The first semiconductor layers are etched at a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, thereby forming a first source/drain space in which the second semiconductor layers are exposed. A dielectric layer is formed at the first source/drain space, thereby covering the exposed second semiconductor layers. The dielectric layer and part of the second semiconductor layers are etched, thereby forming a second source/drain space. A source/drain epitaxial layer is formed in the second source/drain space. At least one of the second semiconductor layers is in contact with the source/drain epitaxial layer, and at least one of the second semiconductor layers is separated from the source/drain epitaxial layer.
1. A semiconductor device, comprising:
a first gate-all-around field effect transistor (GAA FET) disposed over a substrate; and
a second GAA FET disposed over the substrate, wherein:
each of the first GAA FET and the second GAA FET includes:
semiconductor wires vertically arranged over the substrate;
a source/drain epitaxial layer in contact with one or more of the semiconductor wires;
a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires; and
a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region,
in at least one of the first GAA FET and the second GAA FET, at least one of the semiconductor wires is separated from a bottom of the source/drain epitaxial layer by a dielectric layer, and
a thickness of an isolation insulating layer surrounding the first GAA FET is different from a thickness of an isolation insulating layer surrounding the second GAA FET.
2. The semiconductor device of claim 1 , wherein a number of the semiconductor wires contacting the source/drain epitaxial layer in the first GAA FET is different from a number of the semiconductor wires contacting the source/drain epitaxial layer in the second GAA FET.
3. The semiconductor device of claim 2 , wherein the dielectric layer includes a low-k dielectric material.
4. The semiconductor device of claim 2 , wherein:
the number of the semiconductor wires contacting the source/drain epitaxial layer in the first GAA FET is greater than the number of the semiconductor wires contacting the source/drain epitaxial layer in the second GAA FET, and
in the second GAA FET, at least one of the semiconductor wires is separated from the bottom of the source/drain epitaxial layer by the dielectric layer.
5. The semiconductor device of claim 4 , wherein the gate electrode layer wraps the at least one of the semiconductor wires separated from the bottom of the source/drain epitaxial layer in the second GAA FET.
6. The semiconductor device of claim 4 , wherein the at least one of the semiconductor wires separated from the bottom of the source/drain epitaxial layer is located closer to the substrate than remaining one or more semiconductor wires contacting the source/drain epitaxial layer.
7. The semiconductor device of claim 4 , wherein in the second GAA FET, two or more of the semiconductor wires are electrically separated from the bottom of the source/drain epitaxial layer.
8. The semiconductor device of claim 4 , wherein, in the second GAA FET, only one of the semiconductor wires is in contact with the source/drain epitaxial layer.
9. The semiconductor device of claim 4 , wherein, in the first GAA FET, at least one of the semiconductor wires is separated from the bottom of the source/drain epitaxial layer by the dielectric layer.
10. The semiconductor device of claim 4 , wherein, in the first GAA FET, all of the semiconductor wires are in contact with the source/drain epitaxial layer.
11. The semiconductor device of claim 1 , wherein a number of the semiconductor wires contacting the source/drain epitaxial layer in the first GAA FET is equal to a number of the semiconductor wires contacting the source/drain epitaxial layer in the second GAA FET.
12. A semiconductor device, comprising:
semiconductor wires vertically arranged over a substrate;
a source/drain epitaxial layer in contact with one or more of the semiconductor wires;
a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires;
a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region;
a dielectric layer disposed in a source/drain region; and
an isolation insulating layer, wherein:
at least one of the semiconductor wires is separated from a bottom of the source/drain epitaxial layer by the dielectric layer, and
an upper surface of the isolation insulating layer is located at a level below the bottom of the source/drain epitaxial layer.
13. The semiconductor device of claim 12 , wherein the gate electrode layer wraps the at least one of the semiconductor wires separated from the bottom of the source/drain epitaxial layer.
14. The semiconductor device of claim 13 , wherein two or more of the semiconductor wires are separated from the bottom of the source/drain epitaxial layer by the dielectric layer.
15. The semiconductor device of claim 12 , wherein the dielectric layer includes a low-k dielectric material.
16. The semiconductor device of claim 12 , wherein the bottom of the source/drain epitaxial layer is in contact with the dielectric layer.
17. The semiconductor device of claim 12 , wherein the bottom of the source/drain epitaxial layer is in contact with one of the semiconductor wires.
18. A semiconductor device, comprising:
a first gate-all-around field effect transistor (GAA FET) disposed over a substrate; and
a second GAA FET disposed over the substrate, wherein:
each of the first GAA FET and the second GAA FET includes:
semiconductor wires vertically arranged over the substrate;
a source/drain epitaxial layer wrapping around each source/drain region of one or more of the semiconductor wires;
a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires; and
a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region,
in at least one of the first GAA FET and the second GAA FET, at least one of the semiconductor wires is separated from a bottom of the source/drain epitaxial layer by a dielectric layer, and
a thickness of an isolation insulating layer surrounding the first GAA FET is different from a thickness of an isolation insulating layer surrounding the second GAA FET.
19. The semiconductor device of claim 18 , wherein a number of the semiconductor wires contacting the source/drain epitaxial layer in the first GAA FET is different from a number of the semiconductor wires contacting the source/drain epitaxial layer in the second GAA FET.
20. The semiconductor device of claim 18 , wherein:
the number of the semiconductor wires contacting the source/drain epitaxial layer in the first GAA FET is greater than the number of the semiconductor wires contacting the source/drain epitaxial layer in the second GAA FET, and
in the second GAA FET, at least one of the semiconductor wires is separated from the bottom of the source/drain epitaxial layer by the dielectric layer.