IP Library Granted Patent US 11,192,971
Granted Patent B2
US 11,192,971 · App. 16/562,744 · Granted Dec 7, 2021

Pattern forming material, composition for pattern formation, pattern forming method and method of manufacturing semiconductor device

Inventors: Norikatsu Sasao (Kawasaki Kanagawa, JP); Koji Asakawa (Kawasaki Kanagawa, JP); Shinobu Sugimura (Tokyo, JP)
Assignee: TOSHIBA MEMORY CORPORATION
C08F220/14B29C43/02C08F218/04C08F220/16C09D131/02C09D133/08C09D133/10C23C16/20C23C16/45553G03F7/0002G03F7/038G03F7/039H01L21/0273H01L21/28556H01L21/31138H01L21/32135H01L21/32139B29K2033/08B29L2031/3406G03F7/162G03F7/168G03F7/20
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Quick Facts
Patent No.
US 11,192,971
App. No.
16/562,744
Granted
Dec 7, 2021
Kind
B2
Abstract

According to one embodiment, a pattern forming material is disclosed. The pattern forming material contains a polymer. The polymer includes a specific first monomer unit. The monomer unit has a structure having ester of a carboxyl group at a terminal of a side chain. In the ester, a carbon atom bonded to an oxygen atom next to a carbonyl group is a primary carbon, a secondary carbon or a tertiary carbon. The pattern forming material is used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film is formed by a process including, forming an organic film on the target film with the pattern forming material, patterning the organic film, and forming the composite film by infiltering a metal compound into the patterned organic film.

Claims (38)

1. A pattern forming material comprising:

a polymer including a first monomer unit represented by a following general formula (1),

the pattern forming material being used for manufacturing a composite film as a mask pattern for processing a target film on a substrate,

the composite film being formed by a process including, forming an organic film on the target film with the pattern forming material, patterning the organic film, and forming the composite film by infiltering a metal compound into the patterned organic film after patterning the organic film,

wherein, R1, R2 and R3 each independently represent a hydrogen atom or a hydrocarbon group which may have an oxygen atom, at least one of R1, R2 and R3 is a hydrocarbon group, a total number of carbon atoms of R1, R2 and R3 is 1 to 13, and R1, R2 and R3 may be bonded to each other to form a ring, R4 is a hydrogen atom or a methyl group, and R5 is a single bond, or a hydrocarbon group which has 1 to 20 carbon atoms and may have an oxygen atom, a nitrogen atom, or a sulfur atom between carbon-carbon atoms or at a bond terminal, and a hydrogen atom thereof may be substituted by a halogen atom.

2. The pattern forming material according to claim 1 , wherein one or two of R1, R2 and R3 are hydrogen atoms in the general formula (1).

3. The pattern forming material according to claim 1 , wherein R5 in the general formula (1) contains an aromatic ring.

4. The pattern forming material according to claim 1 , wherein a molar ratio of the first monomer unit to all monomer units in the polymer is 50 mol % or more.

5. The pattern forming material according to claim 1 , wherein the polymer further includes a second monomer unit having a crosslinkable functional group at a terminal of a side chain.

6. The pattern forming material according to claim 5 , wherein a molar ratio of the second monomer unit to all monomer units in the polymer is 0.5 mol % or more and less than 20 mol %.

7. The pattern forming material according to claim 5 , further containing a curing agent having reactivity with the crosslinkable functional group.

8. A composition for pattern formation containing the pattern forming material according to claim 1 and an organic solvent capable of dissolving the pattern forming material.

9. The pattern forming material according to claim 1 , wherein the polymer includes a linear polymer.

10. A pattern forming method comprising:

forming an organic film on a substrate with a pattern forming material;

patterning the organic film; and

forming a composite film by infiltering a metal compound into the patterned organic film after patterning the organic film to obtain a mask pattern composed of the composite film, wherein

the pattern forming material contains a polymer including a first monomer unit represented by a following general formula (1),

wherein, R1, R2 and R3 each independently represent a hydrogen atom or a hydrocarbon group which may have an oxygen atom, at least one of R1, R2 and R3 is a hydrocarbon group, a total number of carbon atoms of R1, R2 and R3 is 1 to 13, and R1, R2 and R3 may be bonded to each other to form a ring, R4 is a hydrogen atom or a methyl group, and R5 is a single bond, or a hydrocarbon group which has 1 to 20 carbon atoms and may have an oxygen atom, a nitrogen atom, or a sulfur atom between carbon-carbon atoms or at a bond terminal, and a hydrogen atom thereof may be substituted by a halogen atom.

11. The method according to claim 10 , wherein one or two of R1, R2 and R3 are hydrogen atoms in the general formula (1).

12. The method according to claim 10 , wherein R5 in the general formula (1) contains an aromatic ring.

13. The method according to claim 10 , wherein a molar ratio of the first monomer unit to all monomer units in the polymer is 50 mol % or more.

14. The method according to claim 10 , wherein the polymer further includes a second monomer unit having a crosslinkable functional group at a terminal of a side chain.

15. The method according to claim 14 , wherein a molar ratio of the second monomer unit to all monomer units in the polymer is 0.5 mol % or more and less than 20 mol %.

16. The method according to claim 14 , wherein the pattern forming material further contains a curing agent having reactivity with the crosslinkable functional group.

17. The method according to claim 10 , wherein the polymer includes a linear polymer.

18. A method of manufacturing a semiconductor device, comprising:

forming an organic film on a target film on a semiconductor substrate with a pattern forming material;

patterning the organic film,

forming a mask pattern composed of a composite film by infiltering a metal compound into the patterned organic film after patterning the organic film; and

processing the target film by using the mask pattern, wherein

the pattern forming material contains a polymer including a first monomer unit represented by a following general formula (1),

wherein, R1, R2 and R3 each independently represent a hydrogen atom or a hydrocarbon group which may have an oxygen atom, at least one of R1, R2 and R3 is a hydrocarbon group, a total number of carbon atoms of R1, R2 and R3 is 1 to 13, and R1, R2 and R3 may be bonded to each other to form a ring, R4 is a hydrogen atom or a methyl group, and R5 is a single bond, or a hydrocarbon group which has 1 to 20 carbon atoms and may have an oxygen atom, a nitrogen atom, or a sulfur atom between carbon-carbon atoms or at a bond terminal, and a hydrogen atom thereof may be substituted by a halogen atom.

19. The method according to claim 18 , wherein one or two of R1, R2 and R3 are hydrogen atoms in the general formula (1).

20. The method according to claim 18 , wherein R5 in the general formula (1) contains an aromatic ring.

21. The method according to claim 18 , wherein the polymer further includes a second monomer unit having a crosslinkable functional group at a terminal of a side chain.

22. The method according to claim 21 , wherein the pattern forming material further contains a curing agent having reactivity with the crosslinkable functional group.

23. The method according to claim 18 , wherein the polymer includes a linear polymer.

Assignments (2)
CHANGE OF NAME Recorded Feb 2, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058950/0398 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2019
From: SASAO, NORIKATSU; ASAKAWA, KOJI; SUGIMURA, SHINOBU
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 050291/0389 →
Priority Claims (2)
JP JP2019-044105 · Mar 11, 2019 · national
JP JP2019-155576 · Aug 28, 2019 · national
Continuity (1)
Related Publication 20200291155A1 · Sep 17, 2020