Image sensor including a first and a second isolation layer
An image sensor is provided comprising a substrate comprising first and second surfaces opposite to each other. A first isolation layer is disposed on the substrate and forms a boundary of a sensing region. A second isolation layer is disposed at least partially in the substrate within the sensing region and has a closed line shape. A photoelectric conversion device is disposed within the closed line shape of the second isolation layer, and a color filter is disposed on the first surface of the substrate.
1. An image sensor comprising:
a substrate comprising a first surface and a second surface opposite to each other;
a first isolation layer disposed on the substrate and forming a boundary of a sensing region;
a second isolation layer disposed at least partially in the substrate within the sensing region and having a closed line shape;
a photoelectric conversion device disposed within the closed line shape of the second isolation layer; and
a color filter disposed on the first surface of the substrate,
wherein the first isolation layer is spaced apart from the second isolation layer along a first direction, and
wherein the first isolation layer has a first width along the first direction and the second isolation layer has a second width narrower than the first width along the first direction.
2. The image sensor of claim 1 , wherein the first isolation layer has a first end that is coplanar with the first surface of the substrate and a second end that is coplanar with the second surface of the substrate.
3. The image sensor of claim 2 , wherein the second isolation layer is exposed at the first surface of the substrate and is not exposed at the second surface of the substrate.
4. The image sensor of claim 1 , wherein the second isolation layer is exposed at each of the first surface of the substrate and the second surface of the substrate.
5. The image sensor of claim 1 , wherein a first end of the first isolation layer is not coplanar with the first surface of the substrate and a second end of the first isolation layer is coplanar with the second surface of the substrate.
6. The image sensor of claim 1 , wherein the first isolation layer comprises a different material than the second isolation layer.
7. The image sensor of claim 1 , further comprising an inner reflection pattern disposed on the substrate within the closed line shape of the second isolation layer.
8. The image sensor of claim 7 , wherein the inner reflection pattern is exposed at the first surface of the substrate, and is not exposed at the second surface of the substrate.
9. The image sensor of claim 1 , wherein the second isolation layer has a rectangular shape in a plan view.
10. The image sensor of claim 1 , wherein the second isolation layer has a circular shape in a plan view.
11. An image sensor comprising:
a substrate comprising a first surface and a second surface opposite to each other;
a photoelectric conversion device disposed within the substrate;
a first trench disposed in the substrate;
a first isolation layer disposed in the first trench and forming a boundary of a sensing region;
a second trench spaced apart from the first trench and formed in the substrate of the sensing region;
a second isolation layer disposed in the second trench and surrounding the photoelectric conversion device, wherein a material of the second isolation layer is different from a material of the first isolation layer; and
a color filter disposed on the substrate in the sensing region,
wherein the first isolation layer is spaced apart from the second isolation layer along a first direction, and
wherein the first isolation layer has a first width along the first direction and the second isolation layer has a second width narrower than the first width along the first direction.
12. The image sensor of claim 11 , wherein the second trench is spaced apart from the photoelectric conversion device.
13. The image sensor of claim 11 , wherein the first isolation layer has a first end that is coplanar with the first surface of the substrate and a second end that is not coplanar with the second surface of the substrate.
14. The image sensor of claim 13 , wherein a lower surface of the first trench is disposed closer to the second surface of the substrate than a lower surface of the second trench.
15. The image sensor of claim 13 , wherein a lower surface of the first trench is coplanar with a lower surface of the second trench.
16. An image sensor comprising:
a substrate comprising a first surface and a second surface opposite to each other;
a first isolation layer disposed in the substrate and forming a boundary of each of a first sensing region and a second sensing region;
a second isolation layer disposed in the substrate of the first sensing region, the second isolation layer having a closed line shape;
a photoelectric conversion device disposed in the substrate within the closed line shape of the second isolation layer;
a color filter disposed on the first surface of the substrate on the first sensing region; and
an infrared filter disposed on the first surface of the substrate on the second sensing region,
wherein the first isolation layer is spaced apart from the second isolation layer along a first direction, and
wherein the first isolation layer has a first width along the first direction and the second isolation layer has a second width narrower than the first width along the first direction.
17. The image sensor of claim 16 , wherein the photoelectric conversion device does not overlap the second isolation layer in a plan view.
18. The image sensor of claim 16 , wherein the second isolation layer is not disposed in the substrate of the second sensing region.
19. The image sensor of claim 16 , further comprising an inner reflection pattern disposed within the closed line shape of the second isolation layer.