Multi-gate device and related methods
A semiconductor device includes a first transistor having a first gate structure and a first source/drain feature adjacent to the first gate structure. The semiconductor device further includes a second transistor having a second gate structure and a second source/drain feature adjacent to the second gate structure. In some examples, the semiconductor device further includes a hybrid poly layer disposed between the first transistor and the second transistor. The hybrid poly layer is adjacent to and in contact with each of the first source/drain feature and the second source/drain feature, and the hybrid poly layer provides isolation between the first transistor and the second transistor.
1. A semiconductor device, comprising:
a first transistor including a first gate structure and a first source/drain feature adjacent to the first gate structure;
a second transistor including a second gate structure and a second source/drain feature adjacent to the second gate structure, wherein the second gate structure is parallel to, and physically separated from, the first gate structure; and
a hybrid poly layer disposed between, and extending along a direction parallel to, the first gate structure and the second gate structure, wherein the hybrid poly layer is adjacent to and in contact with each of the first source/drain feature and the second source/drain feature, and wherein the hybrid poly layer provides isolation between the first transistor and the second transistor.
2. The semiconductor device of claim 1 , wherein the first transistor and the second transistor include a multi-gate transistor.
3. The semiconductor device of claim 1 , wherein the first transistor and the second transistor include a gate-all-around (GAA) transistor or a fin field-effect transistor (FinFET).
4. The semiconductor device of claim 1 , wherein the first transistor is disposed in a first active region, wherein the second transistor is disposed in a second active region adjacent to the first active region, and wherein an active edge is defined at a boundary between the first and second active regions.
5. The semiconductor device of claim 4 , wherein the hybrid poly layer is disposed along a plane that includes the active edge.
6. The semiconductor device of claim 1 , wherein the hybrid poly layer includes a high-K (HK) material selected from a group including HfO2, ZrO2, HfAlOx, HfSiOx and Al2O3.
7. The semiconductor device of claim 1 , wherein the hybrid poly layer includes a low-K (LK) material selected from a group including SiCN, SiOC, and SiOCN.
8. The semiconductor device of claim 1 , wherein the hybrid poly layer includes a bi-layer dielectric material, wherein an upper portion of the bi-layer dielectric material includes a high-K material, and wherein a lower portion of the bi-layer dielectric material includes a low-K material.
9. The semiconductor device of claim 8 , wherein a ratio of the upper portion to the lower portion is between about 1/20-20/1.
10. The semiconductor device of claim 1 , wherein a width of the hybrid poly layer is about 6 nm, wherein the hybrid poly layer extends above a top surface of an adjacent fin structure by about 10-30 nm, and wherein the hybrid poly layer has a depth below the top surface of the adjacent fin structure of between about 90-200 nm.
11. A semiconductor device, comprising:
a first fin element extending from a substrate including a fin cut region that separates the first fin element into a first fin portion and a second fin portion;
a first gate structure disposed over the first fin portion and a second gate structure disposed over the second fin portion;
a first source/drain feature disposed over the first fin portion adjacent to the first gate structure, wherein the first source/drain feature abuts a first side of the fin cut region;
a second source/drain feature disposed over the second fin portion adjacent to the second gate structure, wherein the second source/drain feature abuts a second side of the fin cut region opposite the first side; and
a first dielectric layer disposed within the fin cut region and in contact with each of the first and second source/drain features, wherein the first dielectric layer isolates the first fin portion from the second fin portion.
12. The semiconductor device of claim 11 , wherein the first fin element includes a plurality of nanowires that define a plurality of channels of a gate-all-around (GAA) device.
13. The semiconductor device of claim 11 , wherein the first fin element includes an epitaxial layer having a uniform composition, and wherein the epitaxial layer defines a channel of a fin field-effect transistor (FinFET).
14. The semiconductor device of claim 11 , wherein the first dielectric layer includes a high-K (HK) material selected from a group including HfO2, ZrO2, HfAlOx, HfSiOx and Al2O3.
15. The semiconductor device of claim 11 , wherein the first dielectric layer includes a low-K (LK) material selected from a group including SiCN, SiOC, and SiOCN.
16. The semiconductor device of claim 11 , wherein the first dielectric layer includes a bi-layer dielectric material, wherein an upper portion of the bi-layer dielectric material includes a high-K material, and wherein a lower portion of the bi-layer dielectric material includes a low-K material.
17. The semiconductor device of claim 11 , further comprising:
a second fin element extending from the substrate, wherein the second fin element is parallel to the first fin element, wherein a third source/drain feature is disposed over the second fin element, and wherein the third source/drain feature is adjacent to the first source/drain feature; and
a hybrid fin parallel to each of the first and second fin elements, wherein the hybrid fin interposes the first and second fin elements, and wherein the hybrid fin includes a second dielectric layer;
wherein the second dielectric layer is configured to isolate the first source/drain feature from the third source/drain feature.
18. A semiconductor device, comprising:
a first active region including a first source/drain feature;
a second active region including a second source/drain feature, wherein the second active region abuts the first active region along an active edge; and
a bi-layer dielectric material disposed at the active edge and electrically isolating the first source/drain feature from the second source/drain feature;
wherein a first surface of the bi-layer dielectric material contacts the first source/drain feature within the first active region, and wherein a second surface of the bi-layer dielectric material contacts the second source/drain feature within the second active region; and
wherein the bi-layer dielectric material includes an upper portion and a lower portion, wherein the upper portion includes a high-K material, and wherein the lower portion includes a low-K material.
19. The semiconductor device of claim 18 , further comprising a first source/drain contact over the first source/drain feature and a second source/drain contact over the second source/drain feature, wherein the first source/drain contact is disposed within the first active region and adjacent to a first side of the high-K material, and wherein the second source/drain contact is disposed within the second active region and adjacent to a second side of the high-K material.
20. The semiconductor device of claim 18 , wherein the high-K material is selected from a group including HfO2, ZrO2, HfAlOx, HfSiOx and Al2O3, and wherein the low-K material is selected from a group including SiCN, SiOC, and SiOCN.