Patterned nanoparticle structures
Aspects relate to patterned nanostructures having a feature size not including film thickness below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder material, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a suitable pattern onto the nanoparticle composition and the composition is cured through UV or thermal energy. Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may be arranged to form a three-dimensional patterned nanostructure in accordance with suitable applications.
1. A method of forming a patterned nanostructure, comprising:
applying a first nanoparticle composition to a surface of a substrate, wherein the first nanoparticle composition includes a plurality of first nanoparticles, and wherein the plurality of first nanoparticles has an average particle size of less than 100 nm; and
using a first patterned mold to form the first nanoparticle composition into a first patterned nanostructure layer, wherein a first feature size of the first patterned nanostructure layer is less than 5 microns, wherein the first patterned nanostructure layer includes features with an aspect ratio of height to width between or equal to 1.5:1 and 10:1, and wherein the first feature size does not include a film thickness of the first patterned nanostructure layer.
2. The method of claim 1 , wherein using the first patterned mold to form the first nanoparticle composition into the first patterned nanostructure layer comprises pressing the first patterned mold into the first nanoparticle composition.
3. The method of claim 1 , wherein forming the first patterned nanostructure layer further comprises using electromagnetic radiation to cure the first nanoparticle composition.
4. The method of claim 1 , wherein the plurality of first nanoparticles are electrically conductive and the plurality of first nanoparticles within the patterned nano structure are electrically connected with one another.
5. The method of claim 4 , wherein the first nanoparticle composition further includes a binder material mixed with the plurality of first nanoparticles, and wherein the binder material comprises a conductive material.
6. The method of claim 1 , wherein the first nanoparticle composition further includes a binder material mixed with the plurality of first nanoparticles, and wherein the binder material is a precursor of a material of the plurality of first nanoparticles.
7. The method of claim 6 , further comprising calcining the plurality of first nanoparticles and the binder material to form a uniform composition within the first patterned nanostructure layer.
8. The method of claim 1 , wherein the patterned nanostructure has an index of refraction of between 1.5 and 5.0.
9. The method of claim 1 , wherein a geometry of the patterned nanostructure is constructed and arranged to manipulate electromagnetic radiation.
10. The method of claim 1 , comprising forming a continuous film on a uniform portion of the substrate with the first nanoparticle composition, wherein the first patterned nanostructure layer is formed in the continuous film.
11. The method of claim 1 , wherein the first nanoparticle composition is optically transparent.
12. The method of claim 11 , wherein the first nanoparticle composition is at least 90% transparent at at least one wavelength.
13. The method of claim 11 , wherein the first nanoparticle composition further includes a binder material mixed with the plurality of first nanoparticles, and wherein the binder material is optically transparent.
14. The method of claim 13 , wherein the binder material is crosslinked.
15. The method of claim 1 , wherein the plurality of first nanoparticles are catalytic.
16. The method of claim 1 , further comprising applying a second nanoparticle composition to a surface of the first patterned nanostructure layer, and using a second patterned mold to form the second nanoparticle composition into a second patterned nanostructure layer disposed on the first patterned nanostructure layer, wherein a second feature size of the second patterned nanostructure layer is less than 5 microns, wherein the second feature size does not include a film thickness of the second patterned nanostructure layer, wherein the second nanoparticle composition includes a plurality of second nanoparticles, and wherein the plurality of second nanoparticles has an average particle size of less than 100 nm.
17. The method of claim 1 , wherein the first patterned mold is flexible or semi-flexible.
18. The method of claim 1 , wherein using the first patterned mold includes a roll-to-roll process or a roll-to-plate process.
19. The method of claim 1 , wherein the first nanoparticle composition is formed at a temperature less than 100° C.
20. The method of claim 1 , wherein the first nanoparticle composition is formed at room temperature.
21. A method of forming an optically transparent material, comprising:
applying a nanoparticle composition to a surface of an optically transparent substrate, wherein the nanoparticle composition includes a plurality of nanoparticles, wherein the nanoparticle composition is optically transparent, and wherein the plurality of nanoparticles has an average particle size of less than 100 nm; and
using a patterned mold to form the nanoparticle composition into an optically transparent patterned nanostructure layer, wherein a feature size of the optically transparent patterned nanostructure layer is less than 5 microns, wherein the optically transparent patterned nanostructure layer includes features with an aspect ratio of height to width between or equal to 1.5:1 and 10:1, and wherein the feature size does not include a film thickness of the optically transparent patterned nanostructure layer.
22. The method of claim 21 , wherein the optically transparent substrate comprises glass or a transparent conductive oxide.
23. The method of claim 21 , wherein the nanoparticle composition comprises an optically transparent binder.
24. The method of claim 23 , wherein the optically transparent binder comprises an optical adhesive material.
25. The method of claim 21 , wherein the nanoparticle composition is at least 90% transparent at at least one wavelength.
26. The method of claim 21 , wherein the nanoparticle composition further includes a binder material mixed with the plurality of nanoparticles, and wherein the binder material is a precursor of a material of the plurality of nanoparticles.
27. The method of claim 26 , further comprising calcining the plurality of nanoparticles and the binder material to form a uniform composition within the optically transparent patterned nanostructure layer.
28. The method of claim 21 , wherein a geometry of the optically transparent material is constructed and arranged to manipulate electromagnetic radiation.
29. The method of claim 21 , wherein the patterned mold is flexible or semi-flexible.
30. The method of claim 21 , wherein forming the optically transparent patterned nanostructure layer further comprises using electromagnetic radiation to cure the nanoparticle composition.
31. The method of claim 21 , wherein the nanoparticle composition is formed at a temperature less than 100° C.
32. The method of claim 21 , wherein the nanoparticle composition is formed at room temperature.