Method of peeling mother protective film, method of manufacturing organic light-emitting display apparatus, and organic light emitting display apparatus manufactured using the same
A method of peeling a mother protective film from a mother display panel includes: laminating the mother display panel and the mother protective film, the mother display panel including a plurality of display cells each including a display area and a peripheral area around the plurality of display cell; forming a target area and a dummy area in the mother protective film by forming a cutting line in a closed loop shape enclosing the target area corresponding to each of the display cells and a first additional cutting line in a first direction near the cutting line; physically peeling off the dummy area from the mother display panel, including: primarily peeling off a portion of the mother protective film adjacent to the first additional cutting line; and secondarily peeling off rest of the mother protective film from the mother display panel along the cutting line.
1. A method of peeling a mother protective film from a mother display panel, the method comprising:
laminating the mother display panel and the mother protective film, the mother display panel comprising a plurality of display cells each comprising a display area and a peripheral area around the plurality of display cell;
forming a target area and a dummy area in the mother protective film by forming a cutting line in a closed loop shape enclosing the target area corresponding to each of the display cells and a first additional cutting line in a first direction near the cutting line, the first additional cutting line connected to the cutting line;
physically peeling off the dummy area from the mother display panel, comprising:
primarily peeling off a portion of the mother protective film adjacent to the first additional cutting line; and
secondarily peeling off rest of the mother protective film from the mother display panel along the cutting line.
2. The method of claim 1 , wherein depths of the cutting line and the first additional cutting line are less than a thickness of the mother protective film.
3. The method of claim 1 , wherein the cutting line and the first additional cutting line are formed using a laser beam.
4. The method of claim 3 , wherein the laser beam comprises a CO 2 laser.
5. The method of claim 1 , wherein the cutting line and the first additional cutting line are formed using a knife.
6. The method of claim 1 , wherein the cutting line and the first additional cutting line are formed using an ultrasound cutter including a vibrator and a blade.
7. The method of claim 1 , wherein at least an end of the first additional cutting line is formed within the cutting line.
8. A method of peeling a mother protective film from a mother display panel, the method comprising:
laminating the mother display panel and the mother protective film, the mother display panel comprising a plurality of display cells each comprising a display area and a peripheral area around the plurality of display cell;
forming a target area and a dummy area in the mother protective film by forming a cutting line in a closed loop shape enclosing the target area corresponding to each of the display cells and a first additional cutting line in a first direction near the cutting line;
physical peeling off the dummy area from the mother display panel, comprising:
primarily peeling off a portion of the mother protective film adjacent to the first additional cutting line; and
secondary peeling off rest of the mother protective film from the mother display panel along the cutting line,
wherein
the primarily peeling off of the portion of the mother protective film comprises applying a first force having a component in a second direction away from the first additional cutting line, the second direction intersecting with the first direction, and
the secondarily peeling off of the rest of the mother protective film comprises applying a second force in the first direction to the primarily peeled mother protective film.
9. The method of claim 8 , wherein the first additional cutting line is spaced apart from the cutting line.
10. The method of claim 8 , further comprising:
forming, in the mother protective film, a second additional cutting line connected to the first additional cutting line.
11. The method of claim 10 , wherein the primarily peeling off of the portion of the mother protective film comprises applying a first force between the first additional cutting line and the second additional cutting line.
12. The method of claim 8 , wherein the primarily peeled mother protective film comprises a portion of the cutting line extending in a direction intersecting with the second force.
13. The method of claim 8 , wherein the first force is applied using a peeling pin.
14. The method of claim 1 , wherein the target area defined by the cutting line in a closed loop shape has a smaller area than the display cell.
15. The method of claim 1 , wherein the mother protective film comprises an adhesive layer attached to the mother display panel and a base substrate arranged on the adhesive layer.
16. The method of claim 15 , the method further comprising, before the primarily peeling, irradiating the dummy area with ultraviolet rays (UV) to reduce an adhesive force of a portion of the adhesive layer corresponding to the dummy area.
17. The method of claim 15 , the method further comprising, after the secondarily peeling, irradiating the target area with ultraviolet rays (UV) to increase an adhesive force of a portion of the adhesive layer corresponding to the target area.
18. The method of claim 1 , wherein the mother display panel comprises a substrate comprising a glass material, and
wherein the method further comprises, before the primarily peeling off of the mother display panel, etching the substrate to reduce a thickness of the substrate.