IP Library Granted Patent US 10,830,706
Granted Patent B2
US 10,830,706 · App. 16/616,069 · Granted Nov 10, 2020

Defect inspection apparatus and defect inspection method

Inventors: Toshifumi Honda (Tokyo, JP); Shunichi Matsumoto (Tokyo, JP); Masami Makuuchi (Tokyo, JP); Yuta Urano (Tokyo, JP); Keiko Oka (Tokyo, JP)
Assignee: HITACHI HIGH-TECH CORPORATION
G01N21/8806G01N21/47G01N21/956G01N2021/4792G01N2021/8812G01N2021/8848
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Quick Facts
Patent No.
US 10,830,706
App. No.
16/616,069
Granted
Nov 10, 2020
Kind
B2
Abstract

A defect inspection apparatus includes: an illumination unit configured to illuminate an inspection object region of a sample with light emitted from a light source; a detection unit configured to detect scattered light in a plurality of directions, which is generated from the inspection object region; a photoelectric conversion unit configured to convert the scattered light detected by the detection unit into an electrical signal; and a signal processing unit configured to process the electrical signal converted by the photoelectric conversion unit to detect a defect in the sample. The detection unit includes an imaging unit configured to divide an aperture and form a plurality of images on the photoelectric conversion unit. The signal processing unit is configured to synthesize electrical signals corresponding to the plurality of formed images to detect a defect in the sample.

Claims (60)

1. A defect inspection apparatus comprising:

an illumination unit configured to illuminate an inspection object region of a sample with light emitted from a light source;

a detection unit configured to detect scattered light in a plurality of directions, which is generated from the inspection object region;

a photoelectric conversion unit configured to convert the scattered light detected by the detection unit into an electrical signal;

a signal processing unit configured to process the electrical signal converted by the photoelectric conversion unit to detect a defect in the sample, wherein

the detection unit includes

an imaging unit configured to divide an aperture and form a plurality of images on the photoelectric conversion unit,

an objective lens configured to converge the scattered light generated from the inspection object region;

an imaging lens configured to form an image of the light converged by the objective lens at a predetermined position;

a condenser lens configured to converge the image formed by the imaging lens;

a lens array including a plurality of arrays and configured to divide an image converged by the condenser lens by the plurality of arrays to form the plurality of images on the photoelectric conversion unit; and,

the signal processing unit is configured to synthesize electrical signals corresponding to the plurality of formed images to detect a defect in the sample.

2. The defect inspection apparatus according to claim 1 , wherein

the detection unit further includes:

an aperture that is arranged at the predetermined position and shields a region, where photoelectric conversion is not performed by the photoelectric conversion unit, in the image formed by the imaging lens.

3. The defect inspection apparatus according to claim 1 , wherein

the photoelectric conversion unit includes a plurality of pixel blocks corresponding to the plurality of arrays of the lens array, and

the imaging unit forms the plurality of images on the plurality of pixel blocks of the photoelectric conversion unit respectively.

4. The defect inspection apparatus according to claim 1 , wherein

the inspection object region is divided into a plurality of inspection regions,

the pixel block is configured with a plurality of pixel groups respectively corresponding to the plurality of inspection regions obtained by dividing the inspection object region,

each of the pixel groups includes a plurality of pixels arranged in a line shape, and

the photoelectric conversion unit electrically connects the plurality of pixels and synthesizes photoelectric conversion signals output by the plurality of pixels to output the electrical signals.

5. The defect inspection apparatus according to claim 1 , wherein the lens array is arranged at a position where a pupil of the objective lens is relayed, and

the plurality of arrays divide the pupil of the objective lens and forms the image on the photoelectric conversion unit for each of the pupil regions obtained by dividing the pupil.

6. The defect inspection apparatus according to claim 1 , wherein the lens array is arranged at a pupil position of the condenser lens.

7. The defect inspection apparatus according to claim 1 , wherein

the lens array is arranged at a rear focal position of the condenser lens.

8. The defect inspection apparatus according to claim 4 , further comprising:

a gain control unit configured to determine output intensity of the electrical signal corresponding to a quantity of light input to the pixels for each pixel group of the pixel block in the photoelectric conversion unit.

9. The defect inspection apparatus according to claim 8 , wherein

the photoelectric conversion unit is configured with an avalanche photodiode formed for each of the pixels, and

the gain control unit controls an inverse voltage to be applied to the avalanche photodiode.

10. A defect inspection method comprising:

an illumination step of illuminating an inspection object region of a sample with light emitted from a light source;

a light detection step of detecting scattered light in a plurality of directions, which is generated from the inspection object region;

a photoelectric conversion step of converting the detected scattered light by a photoelectric conversion unit into an electrical signal; and

a defect detection step of processing the converted electrical signal to detect a defect of the sample, wherein

an aperture of an imaging unit is divided to form a plurality of images on the photoelectric conversion unit in the light detection step,

electrical signals corresponding to the plurality of formed images are synthesized to detect a defect of the sample in the defect detection step,

a plurality of pixel blocks are formed in the photoelectric conversion unit,

the plurality of images are formed on the plurality of pixel blocks of the photoelectric conversion unit respectively,

wherein

the inspection object region is divided into a plurality of inspection regions,

the pixel block is configured with a plurality of pixel groups respectively corresponding to the plurality of inspection regions obtained by dividing the inspection object region,

the pixel group is configured with a plurality of pixels arranged in a line shape, and

the photoelectric conversion unit electrically connects the plurality of pixels, and synthesizes photoelectric conversion signals output by the plurality of pixels to output the electrical signals.

11. The defect inspection method according to claim 10 , further comprising:

a step of determining output intensity of the electrical signals each corresponding to a quantity of light input to the pixel for each pixel group of the pixel block of the photoelectric conversion unit.

12. The defect inspection method according to claim 11 , wherein

the photoelectric conversion unit is configured with an avalanche photodiode formed for each of the pixels, and

the output intensity of the electrical signal is determined by controlling a reverse voltage to be applied to the avalanche photodiode.

13. The defect inspection apparatus according to claim 1 , wherein

the imaging unit forms each of the plurality of images obtained by dividing the aperture at magnification determined for each image on the photoelectric conversion unit.

14. The defect inspection apparatus according to claim 1 , wherein

in the photoelectric conversion unit, a pitch of pixels formed in the photoelectric conversion unit is set according to magnification of an image formed on the photoelectric conversion unit.

15. The defect inspection apparatus according to claim 1 , wherein

the imaging unit forms an image of the inspection object region in one direction and an image of a position of a pupil of the objective lens in another direction different from the one direction, at magnification determined for each image on the photoelectric conversion unit.

16. The defect inspection apparatus according to claim 1 , wherein

the imaging unit forms an image of the inspection object region in one direction and an image of a position of the objective lens where a pupil thereof is relayed in another direction different from the one direction, at magnification determined for each image on the photoelectric conversion unit.

Assignments (2)
CHANGE OF NAME Recorded May 14, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052662/0726 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2019
From: HONDA, TOSHIFUMI; MATSUMOTO, SHUNICHI; MAKUUCHI, MASAMI; URANO, YUTA; OKA, KEIKO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 051099/0848 →
Priority Claims (1)
WO PCT/JP2017/019046 · May 22, 2017 · international
Continuity (1)
Related Publication 20200256804A1 · Aug 13, 2020