Semiconductor device and display device including the semiconductor device
To improve field-effect mobility and reliability of a transistor including an oxide semiconductor film. A semiconductor device includes an oxide semiconductor film, a gate electrode, an insulating film over the gate electrode, the oxide semiconductor film over the insulating film, and a pair of electrodes over the oxide semiconductor film. The oxide semiconductor film includes a first oxide semiconductor film and a second oxide semiconductor film over the first oxide semiconductor film. The first oxide semiconductor film and the second oxide semiconductor film, include the same element. The first oxide semiconductor film includes a region having lower crystallinity than the second oxide semiconductor film.
1. A method for manufacturing a semiconductor device comprising:
forming a gate electrode;
forming a gate insulating film over the gate electrode;
forming a first oxide semiconductor film over the gate insulating film; and
forming a second oxide semiconductor film over and in direct contact with the first oxide semiconductor film,
forming an oxide insulating film over and in direct contact with the second oxide semiconductor film,
wherein percentage of a flow rate of an oxygen gas in entire flow rate of a deposition gas for forming the second oxide semiconductor film is higher than percentage of a flow rate of an oxygen gas in entire flow rate of a deposition gas for forming the first oxide semiconductor film,
wherein each of the first oxide semiconductor film and the second oxide semiconductor film comprises indium, gallium, and zinc,
wherein a proportion of the indium is higher than a proportion of gallium in the first oxide semiconductor film,
wherein a proportion of the indium is higher than a proportion of gallium in the second oxide semiconductor film, and
wherein the first oxide semiconductor film comprises a region having lower crystallinity than the second oxide semiconductor film.
2. A method for manufacturing a semiconductor device comprising:
forming a gate electrode;
forming a gate insulating film over the gate electrode;
forming a first oxide semiconductor film over the gate insulating film; and
forming a second oxide semiconductor film over and in direct contact with the first oxide semiconductor film,
forming an oxide insulating film over and in direct contact with the second oxide semiconductor film,
wherein percentage of a flow rate of an oxygen gas in entire flow rate of a deposition gas for forming the first oxide semiconductor film is higher than or equal to 5% and lower than or equal to 15%, and
wherein percentage of a flow rate of an oxygen gas in entire flow rate of a deposition gas for forming the second oxide semiconductor film is higher than or equal to 70% and lower than or equal to 100%,
wherein each of the first oxide semiconductor film and the second oxide semiconductor film comprises indium, gallium, and zinc,
wherein a proportion of the indium is higher than a proportion of gallium in the first oxide semiconductor film,
wherein a proportion of the indium is higher than a proportion of gallium in the second oxide semiconductor film, and
wherein the first oxide semiconductor film comprises a region having lower crystallinity than the second oxide semiconductor film.
3. A method for manufacturing a semiconductor device comprising:
forming a gate electrode;
forming a gate insulating film over the gate electrode;
forming a first oxide semiconductor film over the gate insulating film; and
forming a second oxide semiconductor film over and in direct contact with the first oxide semiconductor film,
forming an oxide insulating film over and in direct contact with the second oxide semiconductor film,
wherein percentage of a flow rate of an oxygen gas in entire flow rate of a deposition gas for forming the first oxide semiconductor film is 10%, and
wherein percentage of a flow rate of an oxygen gas in entire flow rate of a deposition gas for forming the second oxide semiconductor film is 100%,
wherein each of the first oxide semiconductor film and the second oxide semiconductor film comprises indium, gallium, and zinc,
wherein a proportion of the indium is higher than a proportion of gallium in the first oxide semiconductor film,
wherein a proportion of the indium is higher than a proportion of gallium in the second oxide semiconductor film, and
wherein the first oxide semiconductor film comprises a region having lower crystallinity than the second oxide semiconductor film.
4. The method for manufacturing the semiconductor device according to claim 1 ,
wherein the first oxide semiconductor film is formed by a sputtering target, and
wherein the second oxide semiconductor film is formed by the sputtering target.
5. The method for manufacturing the semiconductor device according to claim 1 ,
wherein the proportion of the gallium is higher than or equal to 1.5 and lower than or equal to 2.5 and a proportion of the zinc is higher than or equal to 2 and lower than or equal to 4 when the proportion of the indium is 4.
6. The method for manufacturing the semiconductor device according to claim 1 , wherein a thickness of the second oxide semiconductor film is larger than a thickness of the first oxide semiconductor film.
7. The method for manufacturing the semiconductor device according to claim 1 ,
wherein the second oxide semiconductor film includes a crystal part, and
wherein the crystal part has a c-axis alignment.
8. The method for manufacturing the semiconductor device according to claim 2 ,
wherein the first oxide semiconductor film is formed by a sputtering target, and
wherein the second oxide semiconductor film is formed by the sputtering target.
9. The method for manufacturing the semiconductor device according to claim 2 ,
wherein the proportion of the gallium is higher than or equal to 1.5 and lower than or equal to 2.5 and a proportion of the zinc is higher than or equal to 2 and lower than or equal to 4 when the proportion of the indium is 4.
10. The method for manufacturing the semiconductor device according to claim 2 , wherein a thickness of the second oxide semiconductor film is larger than a thickness of the first oxide semiconductor film.
11. The method for manufacturing the semiconductor device according to claim 2 ,
wherein the second oxide semiconductor film includes a crystal part, and
wherein the crystal part has a c-axis alignment.
12. The method for manufacturing the semiconductor device according to claim 3 ,
wherein the first oxide semiconductor film is formed by a sputtering target, and
wherein the second oxide semiconductor film is formed by the sputtering target.
13. The method for manufacturing the semiconductor device according to claim 3 ,
wherein the proportion of the gallium is higher than or equal to 1.5 and lower than or equal to 2.5 and a proportion of the zinc is higher than or equal to 2 and lower than or equal to 4 when the proportion of the indium is 4.
14. The method for manufacturing the semiconductor device according to claim 3 ,
wherein a thickness of the second oxide semiconductor film is larger than a thickness of the first oxide semiconductor film.
15. The method for manufacturing the semiconductor device according to claim 3 ,
wherein the second oxide semiconductor film includes a crystal part, and
wherein the crystal part has a c-axis alignment.
16. The method for manufacturing the semiconductor device according to claim 1 , wherein a substrate temperature in forming the second oxide semiconductor film is higher than a substrate temperature in forming the first oxide semiconductor film.
17. The method for manufacturing the semiconductor device according to claim 2 , wherein a substrate temperature in forming the second oxide semiconductor film is higher than a substrate temperature in forming the first oxide semiconductor film.
18. The method for manufacturing the semiconductor device according to claim 3 , wherein a substrate temperature in forming the second oxide semiconductor film is higher than a substrate temperature in forming the first oxide semiconductor film.
19. The method for manufacturing the semiconductor device according to claim 1 ,
wherein the second oxide semiconductor film comprises a depression; and
wherein the oxide insulating film is in direct contact with the depression of the second oxide semiconductor film.
20. The method for manufacturing the semiconductor device according to claim 2 ,
wherein the second oxide semiconductor film comprises a depression; and
wherein the oxide insulating film is in direct contact with the depression of the second oxide semiconductor film.
21. The method for manufacturing the semiconductor device according to claim 3 ,
wherein the second oxide semiconductor film comprises a depression; and
wherein the oxide insulating film is in direct contact with the depression of the second oxide semiconductor film.