IP Library Granted Patent US 10,854,255
Granted Patent B1
US 10,854,255 · App. 16/691,448 · Granted Dec 1, 2020

Vertical selector stt-MRAM architecture

Inventors: Adrian E. Ong (Pleasanton, CA); Andrew J. Walker (Mountain View, CA); Dafna Beery (Palo Alto, CA)
Assignee: SPIN MEMORY, INC.
G11C11/161G11C11/1655G11C11/1657G11C11/4074H01L21/0257
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Quick Facts
Patent No.
US 10,854,255
App. No.
16/691,448
Granted
Dec 1, 2020
Kind
B1
Abstract

A magnetic memory array having a source-plane electrically connected with an array of channel selectors in two-dimensions. The array of channel selectors can be arranged in rows and columns with both the rows and columns being electrically connected with a source-plane. A memory element such as a two terminal resistive switching memory element can be electrically connected with each of the channel selectors. The source-plane can include a doped region formed in a surface of a semiconductor substrate and may also include an electrically conductive layer formed on the doped region. The use of such a planar, two-dimensional source-plane allows for greatly increased data density by eliminating the need to form separate source-line source lines for individual rows of channel selectors.

Claims (33)

1. A memory array, comprising:

an electrically conductive source-plane;

an array of vertical semiconductor channel structures; and

a plurality of memory elements, each of the memory elements being electrically connected one of the vertical semiconductor channel structures; wherein

the vertical semiconductor channel structures are formed on and connected with the source-plane in two dimensions;

wherein the source-plane comprises an n-doped region formed in a surface of a semiconductor substrate.

2. The memory array as in claim 1 , wherein the array of vertical semiconductor channel structures is arranged as a plurality of rows and a plurality of columns that are generally perpendicular with the rows.

3. The memory array as in claim 1 , further comprising an electrically conductive contact structure connecting each of the memory element structures with one of the vertical semiconductor channel structures.

4. The memory array as in claim 1 , wherein the source-plane further a layer of electrically conductive metal formed over the n-doped region of the semiconductor substrate.

5. The memory array as in claim 1 , further comprising an electrically conductive word-line connected with each of the vertical semiconductor channel structures.

6. The memory array as in claim 1 further comprising an electrically conductive bit-line connected with each of the memory elements at an end of the memory element that is opposite the vertical semiconductor channel structure.

7. The memory array as in claim 1 , wherein the source-plane is electrically connected with a voltage source.

8. The memory array as in claim 1 , wherein the source-plane is electrically connected with a ground.

9. The memory array as in claim 1 , wherein the memory elements are two terminal resistive switching memory elements.

10. A memory array, comprising:

an electrically conductive source-plane;

an array of vertical semiconductor channel structures; and

a plurality of memory elements, each of the memory elements being electrically connected one of the vertical semiconductor channel structures; wherein

the vertical semiconductor channel structures are formed on and connected with the source-plane in two dimensions;

wherein each of the vertical semiconductor channel structures includes a semiconductor column structure and a gate dielectric layer surrounding the semiconductor column structure, wherein the semiconductor column structure is formed by selective epitaxial growth.

11. A memory array, comprising;

a two-dimensional array of channel selectors arranged in rows and columns;

a two-dimensional source-plane electrically connected with the two-dimensional array of channel selectors in both the row and column direction; and

a plurality of memory element structures formed on the two-dimensional array of channel selectors, wherein the memory element structures are two terminal resistive switching memory elements;

wherein the channel structures include a semiconductor formed by selective epaxial growth.

12. The memory array as in claim 11 , wherein the two-dimensional source-plane is formed in a plane on a surface of a semiconductor substrate.

13. The memory array as in claim 11 , wherein the two-dimensional source-plane is formed in a two-dimensional plane on a semiconductor substrate and further comprises a doped region formed in a surface of the semiconductor substrate and a layer of electrically conductive metal formed on the doped region.

14. The memory array as in claim 11 , wherein the two-dimensional source-plane is electrically connected with a voltage source.

15. The memory array as in claim 11 , wherein the two-dimensional source-plane is electrically connected with a ground.

16. The memory array as in claim 11 , further comprising an electrically conductive bit-line connected with each of the magnetic memory elements at an end opposite the associated channel selector.

17. The memory array as in claim 11 , further comprising:

a plurality of electrically conductive word lines, each electrically conductive word line being electrically connected with a row of the channel structures; and

a plurality of bit lines, each of the bit lines being electrically connected with a column of magnetic memory elements, wherein the column is generally orthogonal with the row.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2021
From: SPIN (ASSIGNMENT FOR BENEFIT OF CREDITORS), LLC
To: INTEGRATED SILICON SOLUTION, (CAYMAN) INC.
Reel/Frame 057473/0319 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: SPIN MEMORY, INC.
To: SPIN (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 056927/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2019
From: ONG, ADRIAN E.; WALKER, ANDREW J.; BEERY, DAFNA
To: SPIN MEMORY, INC.
Reel/Frame 051118/0835 →
Continuity (1)
Continuation In Part 16457544 · Jun 28, 2019