Stacked die package with curved spacer
Apparatuses and techniques include a substrate, a controller die mounted on the substrate, fingers electrically connecting the controller die to the substrate, a spacer mounted on the substrate adjacent to the controller die, and a first memory die mounted on the spacer. The first memory die is attached to a top surface of the spacer. The spacer has a curved edge facing the controller. The curved edge may have a first curve including a first curve apex extending away from the controller, a first curve peak on one side of the first curve apex, and a second curve peak on an opposite side of the first curve apex than the first curve peak. Additional fingers connect the controller and the first memory die at a point that is aligned with the space between the first curve and a line extending from the first curve peak and the second curve peak.
1. A device, comprising:
a substrate;
a controller die mounted on the substrate;
at least one finger electrically connecting the controller die to the substrate;
a spacer mounted on the substrate adjacent to the controller die; and
a first memory die mounted on the spacer,
wherein the spacer has a first curved edge facing the controller die, the first curved edge having a first curve comprising:
a first curve apex extending away from the controller die;
a first curve peak located on one side of the first curve apex; and
a second curve peak on an opposite side of the first curve apex than the first curve peak.
2. The device of claim 1 , wherein the at least one finger is in connection with the substrate at a bonding point that is vertically aligned with a space between the first curve and a line extending from the first curve peak and the second curve peak.
3. The device of claim 1 , wherein the first memory die overhangs the first curved edge of the spacer, thereby extending past the first curved edge and towards the controller die.
4. The device of claim 3 , wherein the first curve peak and the second curve peak are each closer to the controller die than the first curve apex.
5. The device of claim 3 , wherein the first curved edge further comprises a second curve comprising:
a second curve apex extending away from the controller die;
a third curve peak; and
a fourth curve peak on an opposite side of the second curve apex than the third curve peak.
6. The device of claim 5 , wherein the third curve peak and fourth curve peak are each closer to the controller die than the second curve apex.
7. The device of claim 1 , wherein the first memory die is electrically connected to the substrate with one or more bond wires.
8. The device of claim 1 , wherein the spacer comprises a second straight edge opposite the first curved edge.
9. The device of claim 8 , wherein the second straight edge is approximately flush with an edge of the first non-volatile memory die.
10. The device of claim 1 , wherein the spacer has a height that is greater than a height of the controller die.
11. The device of claim 1 , further comprising a second memory die mounted on the first memory die on a surface of the first memory die that is opposite from the spacer, at least a portion of the second memory die extending past the first memory die towards the controller die.
12. The device of claim 1 , wherein a height of the spacer is greater than a maximum height of the finger.
13. The device of claim 1 , wherein the first memory die is a NAND memory die.
14. A method of assembling a semiconductor device, comprising:
providing a substrate;
mounting a controller die on the substrate;
electrically connecting the controller die to the substrate with a plurality of first fingers;
attaching a spacer on the substrate adjacent to the controller die, the spacer comprising a first curved edge facing the controller die, the first curved edge having a first curve comprising:
a first curve apex extending away from the controller die;
a first curve peak; and
a second curve peak on an opposite side of the first curve apex than the first curve peak;
attaching a first memory die on a top surface of the spacer; and
electrically connecting the first memory die to the controller die by way of the substrate with second fingers.
15. The method of claim 14 , wherein the second fingers are electrically connected to the substrate at a bonding point that is vertically aligned with a space between the first curve and a line extending from the first curve peak and the second curve peak.
16. The method of claim 14 , wherein the first curve peak and the second curve peak are each closer to the controller die than the first curve apex.
17. The method of claim 14 , wherein the first curved edge further comprises a second curve comprising:
a second curve apex extending away from the controller die;
a third curve peak; and
a fourth curve peak on an opposite side of the second curve apex than the third curve peak.
18. The method of claim 17 , wherein the third curve peak and fourth curve peak are each closer to the controller die than the second curve apex.
19. The method of claim 14 , further comprising:
attaching a second memory die over the first memory die on a surface of the first memory die that is opposite from the spacer, at least a portion of the second memory die extending past the first memory die towards the controller die; and
electrically connecting the second memory die to the first memory die.