Semiconductor image sensor device having back side illuminated image sensors with embedded color filters

1. A device comprising:

a substrate having a first side and a second side that is opposite the first side;

an interconnect structure disposed over the first side of the substrate;

a first pixel disposed in the substrate;

an anti-reflective coating layer disposed over the second side of the substrate;

a buffer layer disposed on the anti-reflective coating layer;

a radiation-blocking structure disposed on the buffer layer, wherein the radiation-blocking structure includes a first portion and a second portion;

a passivation layer disposed on the radiation-blocking structure;

a dielectric isolation structure disposed within the substrate, wherein the passivation layer extends to the dielectric isolation structure disposed within the substrate;

a color filter disposed on the passivation layer; and

wherein the first pixel is disposed within the substrate between the first and second portions of the radiation-blocking structure.

2. The device of claim 1 , further comprising a bond pad interfacing with a portion of the interconnect structure, and

wherein the passivation layer extends to the bond pad.

3. The device of claim 1 , wherein a third portion of the radiation-blocking structure is disposed directly over the dielectric isolation structure thereby preventing light from reaching the dielectric isolation structure.

4. The device of claim 1 , wherein the anti-reflective coating layer include a high-k dielectric layer and the buffer layer includes an oxide material.

5. The device of claim 1 , wherein the radiation-blocking structure includes a metal material, and

wherein the passivation layer includes a dielectric material selected from the group consisting of silicon oxide, silicon nitride and silicon oxynitride.

6. The device of claim 1 , further comprising a second pixel is disposed within the substrate, and

wherein the radiation-blocking structure further includes a third portion, and

wherein the second pixel is disposed within the substrate between the second and third portions of the radiation-blocking structure.

7. A device comprising:

a substrate having a front side and a back side that is opposite the front side;

an interconnect structure disposed over the front side of the substrate;

a first pixel disposed in the substrate;

a light-reflective structure disposed over the back side of the substrate;

a color filter disposed over the back side of the substrate, the color filter having a top surface at a first height, the top surface of the color filter facing away from the substrate;

a reference pixel disposed in the substrate, wherein a first portion of the light-reflective structure is disposed directly over the reference pixel thereby preventing light from reaching the reference pixel; and

a passivation layer disposed over the light-reflective structure and having a top surface at the first height, the top surface of the passivation layer facing away from the substrate and interfacing with the top surface of the color filter at the first height.

8. The device of claim 7 , wherein the light-reflective structure further includes a second portion and a third portion and wherein the first pixel is disposed within the substrate between the second and third portions of the light-reflective structure.

9. The device of claim 8 , wherein the first portion of the light-reflective structure has a first thickness and a first width and the second portion of the light-reflective structure has the first thickness and a second width that is different than the first width.

10. The device of claim 9 ,

wherein the second width is less than the first width.

11. The device of claim 7 , further comprising an anti-reflective coating layer disposed over the back side of the substrate, and

wherein the light-reflective structure is disposed over the anti-reflective coating layer.

12. The device of claim 7 , further comprising:

a bond pad disposed on the interconnect structure;

a dielectric isolation structure disposed within the substrate and interfacing with the bond pad, and

wherein the dielectric isolation structure is positioned closer to the back side of the substrate than the bond pad.

13. The device of claim 7 , further comprising:

a first material layer disposed over the back side of the substrate and formed of a first material; and

a second material layer disposed over the first material layer and formed of a second material that is different than the first material, and

wherein the passivation layer extends along and physically contacts a sidewall surface of the second material layer and a sidewall surface of the first material layer.

14. The device of claim 7 , wherein the color filter has a sidewall facing a sidewall of the first portion of the light-reflective structure, and

wherein the passivation layer physically contacts the entire sidewall of the color filter and the entire sidewall of the first portion of the light-reflective structure.

15. A device comprising:

a substrate having a first side and a second side that is opposite the first side, the substrate further including a sidewall extending from the first side to the second side of the substrate;

an interconnect structure disposed over the first side of the substrate;

a first pixel disposed in the substrate and extending from the first side of the substrate toward the second side, wherein a portion of the substrate is disposed between the first pixel and the second side of the substrate;

a radiation-blocking structure disposed over the second side of the substrate, wherein the radiation-blocking structure includes a first portion and a second portion and wherein the first pixel is disposed within the substrate between the first and second portions of the radiation-blocking structure;

a passivation layer extending from over the light-reflective structure to the sidewall of the substrate such that the passivation layer extends along and physically contacts the sidewall of the substrate;

a shallow trench isolation structure disposed within the substrate; and

a bond pad interfacing with shallow trench isolation structure such that the bond pad physically contacts the shallow trench isolation structure.

16. The device of claim 15 , further comprising a second pixel disposed in the substrate, and

wherein the radiation-blocking structure further includes a third portion disposed directly over the second pixel thereby blocking radiation directed toward the second pixel.

17. The device of claim 16 , wherein the third portion of the radiation-blocking structure is disposed directly over the shallow trench isolation structure.

18. The device of claim 15 , further comprising:

a second pixel disposed in the substrate;

a first color filter segment disposed directly over the first pixel; and

a second color filter segment disposed directly over the second pixel,

wherein the first color filter segment allows a first color of light to pass through the first color filter segment while filtering out a second color of light, and

wherein the second color filter segment allows the second color of light to pass through the second color filter segment while filtering out the first color of light.

19. The device of claim 18 , wherein the radiation-blocking structure further includes a third portion,

wherein the second pixel is disposed within the substrate between the second portion and the third portion of the radiation-blocking structure,

wherein the first color filter segment is disposed between the first portion and the second portion of the radiation-blocking structure, and

wherein the second color filter segment is disposed between the second portion and the third portion of the radiation-blocking structure.

20. The device of claim 15 , wherein the passivation layer extends to the shallow trench isolation structure disposed within the substrate.