Systems for direct transfer of semiconductor device die

1. A system for performing a direct transfer of a semiconductor device die from a first substrate to a second substrate, the first substrate having a first side and a second side, and the semiconductor device die being disposed on the first side of the first substrate, the system comprising:

a first conveyance mechanism to convey the first substrate;

a second conveyance mechanism to convey the second substrate with respect to the first substrate, the second conveyance mechanism including a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate, wherein the first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion;

a transfer mechanism disposed adjacent to the first conveyance mechanism, said transfer mechanism configured to effectuate the direct transfer of the semiconductor device die; and

a controller including one or more processors communicatively coupled with the first conveyance mechanism, the second conveyance mechanism, and the transfer mechanism, the controller having executable instructions, which when executed, cause the one or more processors to perform operations including:

activating the transfer mechanism to contact the second side of the first substrate to press the semiconductor device die into contact with a surface of the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.

2. The system of claim 1 , wherein the controller further has executable instructions, which when executed, cause the one or more processors to perform operations including:

conveying at least one of the first substrate or the second substrate such that the surface of the second substrate is adjacent to the first side of the first substrate; and

orienting the transfer mechanism to a position adjacent to the second side of the first substrate.

3. The system of claim 1 , wherein the first conveyance mechanism includes a frame to secure the first substrate within the frame, and wherein the frame is movable in at least one direction.

4. The system of claim 1 , wherein the transfer mechanism includes a needle to press on the second side of the first substrate.

5. The system of claim 1 , further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine a position of the semiconductor device die relative to a transfer fixing location on the second substrate,

wherein the conveying further includes conveying the at least one of the first substrate or the second substrate to align the position of the semiconductor device die with the transfer fixing location.

6. The system of claim 1 , further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine a position of the second substrate with respect to the transfer mechanism,

wherein the conveying further includes conveying the at least one of the first substrate or the second substrate to align the position of the second substrate with the transfer mechanism.

7. A system for performing a direct transfer of a semiconductor device die from a first substrate to a second substrate, the first substrate having a first side and a second side, and the semiconductor device die being disposed on the first side of the first substrate, the system comprising:

a first conveyance mechanism to convey the first substrate;

a second conveyance mechanism to convey the second substrate with respect to the first substrate, the second conveyance mechanism including a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate, wherein the first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion; and

a transfer mechanism disposed adjacent to the first conveyance mechanism, said transfer mechanism configured to effectuate the direct transfer of the semiconductor device die.

8. The system of claim 7 , further comprising:

a controller including one or more processors communicatively coupled with the first conveyance mechanism, the second conveyance mechanism, and the transfer mechanism, the controller having executable instructions, which when executed, cause the one or more processors to perform operations including:

conveying at least one of the first substrate or the second substrate such that the surface of the second substrate is adjacent to the first side of the first substrate;

orienting the transfer mechanism to a position adjacent to the second side of the first substrate; and

activating the transfer mechanism to contact the second side of the first substrate to press the semiconductor device die into contact with a surface of the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.

9. The system of claim 7 , further comprising:

a first optical sensor positioned to sense a position of the semiconductor device die with respect to a die transfer location on the second substrate; and

a second optical sensor positioned to sense a position of the die transfer location on the second substrate.

10. The system of claim 7 , wherein the transfer mechanism includes a needle to press on the second side of the first substrate.

11. The system of claim 10 , wherein the controller is configured to move the needle, during the direct transfer, to cause a deflection of the first substrate localized at the semiconductor device die.

12. The system of claim 7 , wherein at least one of the first substrate or the second substrate is a wafer tape.

13. The system of claim 7 , further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine a position of the semiconductor device die relative to a transfer fixing location on the second substrate,

wherein the conveying further includes conveying the at least one of the first substrate or the second substrate to align the position of the semiconductor device die with the transfer fixing location.

14. The system of claim 7 , wherein the second substrate has an attraction force greater than an attraction force of the first substrate.

15. A system for performing a direct transfer of a semiconductor device die from a first substrate to a second substrate, the first substrate having a first side and a second side, and the semiconductor device die being disposed on the first side of the first substrate, the system comprising:

a first conveyance mechanism to convey the first substrate;

a second conveyance mechanism to convey the second substrate with respect to the first substrate, the second conveyance mechanism including a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate, wherein the first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion;

a transfer mechanism disposed adjacent to the first conveyance mechanism, said transfer mechanism configured to effectuate the direct transfer of the semiconductor device die; and

a controller including one or more processors communicatively coupled with the first conveyance mechanism, the second conveyance mechanism, and the transfer mechanism, the controller having executable instructions, which when executed, cause the one or more processors to perform operations including:

conveying at least one of the first substrate or the second substrate such that the surface of the second substrate is adjacent to the first side of the first substrate; and

orienting the transfer mechanism to a position adjacent to the second side of the first substrate.

16. The system of claim 15 , wherein the controller further has executable instructions, which when executed, cause the one or more processors to perform operations including:

activating the transfer mechanism to contact the second side of the first substrate to press the semiconductor device die into contact with a surface of the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.

17. The system of claim 15 , wherein the first conveyance mechanism includes a frame to secure the first substrate within the frame, and wherein the frame is movable in at least one direction.

18. The system of claim 15 , wherein the transfer mechanism includes a needle to press on the second side of the first substrate.

19. The system of claim 15 , further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine a position of the semiconductor device die relative to a transfer fixing location on the second substrate,

wherein the conveying further includes conveying the at least one of the first substrate or the second substrate to align the position of the semiconductor device die with the transfer fixing location.

20. The system of claim 15 , further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine a position of the second substrate with respect to the transfer mechanism,

wherein the conveying further includes conveying the at least one of the first substrate or the second substrate to align the position of the second substrate with the transfer mechanism.