Semiconductor devices and related methods
View Patent ↗In one example, a semiconductor device, comprising a substrate having a top side and a bottom side, an electronic device on the top side of the substrate, a first encapsulant on the top side of the substrate contacting a side of the electronic device, a second encapsulant on the bottom side of the substrate, wherein the second encapsulant includes an undercut at an end of the second encapsulant, and a cover layer comprising a top cover on a top side of the first encapsulant and a side cover on a side of the first encapsulant and a side of the substrate, wherein the side cover extends adjacent to the undercut. Other examples and related methods are also disclosed herein.
1. A semiconductor device, comprising:
a substrate having a top side and a bottom side;
an electronic device on the top side of the substrate;
a first encapsulant on the top side of the substrate contacting a side of the electronic device;
a second encapsulant on the bottom side of the substrate, wherein the second encapsulant includes an undercut at an end of the second encapsulant, wherein the undercut extends from a lateral side of the second encapsulant to a bottom side of the second encapsulant; and
a cover layer comprising a top cover on a top side of the first encapsulant and a side cover on a side of the first encapsulant and a side of the substrate, wherein the side cover extends adjacent to the undercut.
2. The semiconductor device of claim 1 , wherein the undercut comprises a horizontal ledge that is parallel with a bottom surface of the substrate.
3. The semiconductor device of claim 2 , wherein the cover layer comprises an undercut cover that covers a portion of the horizontal ledge.
4. The semiconductor device of claim 1 , wherein the undercut comprises an angular ledge that is slanted with respect to a bottom surface of the substrate the substrate.
5. The semiconductor device of claim 4 , wherein the angular ledge is at an acute angle with respect to a bottom surface of the substrate.
6. The semiconductor device of claim 4 , wherein the cover layer comprises an undercut cover that covers a portion of the angular ledge.
7. The semiconductor device of claim 1 , wherein the undercut comprises a curved surface.
8. The semiconductor device of claim 7 , wherein the curved surface is concave.
9. The semiconductor device of claim 1 , wherein the undercut comprises multiple ledges.
10. The semiconductor device of claim 9 , wherein the cover layer comprises an undercut cover that covers a portion of one of the multiple ledges and leaves a portion of a second one of the multiple ledges uncovered.
11. The semiconductor device of claim 1 , further comprising an additional electronic device on the bottom side of the substrate, wherein the second encapsulant contacts a side of the additional electronic device.
12. A method to manufacture a semiconductor device, comprising:
providing a substrate having a top side and a bottom side;
providing a first electronic device on the top side of the substrate and a second electronic device on the bottom side of the substrate;
providing a first encapsulant on the top side of the substrate contacting a side of the first electronic device, and a second encapsulant on the bottom side of the substrate contacting a side of the second electronic device;
providing an undercut at an end of the second encapsulant, wherein the undercut extends from a lateral side of the second encapsulant to a bottom side of the second encapsulant;
attaching a carrier to the bottom side of the second encapsulant;
providing a cover layer on a top side of the first encapsulant, on a side of the first encapsulant, on a side of the substrate, and on a portion of the carrier; and
removing the carrier and a portion of the cover layer on the portion of the carrier, wherein the cover layer remains adjacent to the undercut after the removing.
13. The method of 12 , wherein said attaching the carrier includes providing a fillet that extends into and at least partially covers the undercut, wherein the cover layer covers the fillet.
14. The method of claim 13 , wherein the fillet is outwardly slanted adjacent the undercut.
15. The method of claim 12 , wherein the cover layer covers a vertical sidewall of the second encapsulant between the undercut and the substrate.
16. The method of claim 13 , wherein the fillet fully covers the undercut.
17. A semiconductor device, comprising:
a substrate having a top side and a bottom side;
an electronic device on the top side of the substrate;
a first encapsulant portion on the top side of the substrate and a second encapsulant portion on the bottom side of the substrate, wherein the first encapsulant portion contacts a side of the electronic device;
an undercut in the second encapsulant portion, wherein the undercut extends from a lateral side of the second encapsulant portion to the bottom side of the second encapsulant portion; and
a shield on a top side of the first encapsulant portion, on a lateral side of the second encapsulant portion, and extending adjacent to the undercut.
18. The semiconductor device of claim 17 , wherein an end of the shield covers a portion of the undercut.
19. The semiconductor device of claim 17 , wherein part of the second encapsulant portion is between the substrate and the undercut.
20. The semiconductor device of claim 17 , further comprising an additional electronic device on the bottom side of the substrate, wherein the second encapsulant portion contacts a side of the additional electronic device.