IP Library Assignment 053717/0495
Patent Assignment
Reel/Frame 053717/0495

Assignment of Assignor's Interest

Recorded: 2020-09-07 Pages: 9
Assignor
AMKOR TECHNOLOGY KOREA, INC.
Executed: 2019-12-17
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12-03, SINGAPORE, 248373, SINGAPORE
Covered Properties (16)
Semiconductor Device Having a Lid with Through-Holes
Application: 16/450,680 →
Publication: US 2020/0402885
Semiconductor Devices and Related Methods
Application: 16/702,854 →
Publication: US 2021/0175140
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/703,240 →
Publication: US 2021/0175177
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 17/002,607 →
Publication: US 2021/0066206
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 62/895,196 →
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/748,956 →
Publication: US 2021/0066093
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/596,566 →
Publication: US 2021/0104642
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/571,904 →
Publication: US 2021/0082891
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/590,801 →
Publication: US 2021/0104809
Semiconductor Devices and Related Methods
Application: 62/902,473 →
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/775,648 →
Publication: US 2021/0233848
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/797,307 →
Publication: US 2021/0265225
Electronic Devices Having a Sensor and a Translucent Mold Compound and Methods of Manufacturing Electronic Devices
Application: 16/707,114 →
Publication: US 2021/0175372
Hybrid Bonding Interconnection Using Laser and Thermal Compression
Application: 16/908,928 →
Publication: US 2021/0398940
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application: 16/918,074 →
Publication: US 2022/0005787
Electrionic Devices with Interposer and Redistribution Layer
Application: 17/008,239 →
Publication: US 2022/0068739
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 24, 2019
From: KIM, KEUN SOO; KWON, YOUNG IK; JEON, YU JIN; CHOI, MI KYOUNG
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 049570/0736 →
Assignment of Assignor's Interest Sep 3, 2019
From: JAYARAMAN, SURESH; HINER, DAVE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 050250/0831 →
Assignment of Assignor's Interest Sep 3, 2019
From: KIM, JAE YOON; LEE, JI HUN; DO, WON CHUL; KHIM, JIN YOUNG
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 050250/0882 →
Assignment of Assignor's Interest Sep 16, 2019
From: HUEMOELLER, RON
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 050391/0214 →
Assignment of Assignor's Interest Sep 16, 2019
From: CHA, HYUN GOO; KANG, DONG HEE; MA, SANG YUN; CHO, SANG HYEOK
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 050390/0982 →
Assignment and Agreement Oct 2, 2019
From: LEE, KYOUNG YEON; LEE, TAE YONG; SHIN, DOO SOUB; LEE, SEON A
To: AMKOR TECHNOLOGY KOREA, INC.,
Reel/Frame 050610/0662 →
Assignment and Agreement Oct 24, 2019
From: BOWERS, SHAUN
To: AMKOR TECHNOLOGY INC.,
Reel/Frame 050820/0496 →
Assignment and Agreement Oct 24, 2019
From: WAN HAN, GYU; BAE BANG, WON; HYUNG LEE, JU; HWA CHANG, MIN
To: AMKOR TECHNOLOGY KOREA, INC.,
Reel/Frame 050822/0116 →
Assignment and Agreement Oct 25, 2019
From: CHOI, WOOK; GUN LEE, DONG; DAE JUNG, JONG
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 050831/0399 →
Assignment of Assignor's Interest Dec 4, 2019
From: KIM, JIN SEONG; KO, YEONG BEOM; OH, KWANG SEOK; BAE, JO HYUN
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 051179/0166 →
Assignment of Assignor's Interest Dec 4, 2019
From: JEONG, JIN SUK; KONG, MIN JAE; JUNG, HYUN HYE
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 051178/0663 →
Assignment of Assignor's Interest Dec 9, 2019
From: YOUNG CHUNG, JI; HWAN YANG, SUNG; HO LEE, JAE
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 051218/0402 →
Assignment of Assignor's Interest Jan 22, 2020
From: JAYARAMAN, SURESH; HINER, DAVID
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 051584/0282 →
Assignment of Assignor's Interest Jan 22, 2020
From: YOON KIM, JAE; HUN LEE, JI; CHUL DO, WON; YOUNG KHIM, JIN
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 051584/0192 →
Assignment of Assignor's Interest Jan 30, 2020
From: YOUNG CHUNG, JI; CHUL JANG, SEUNG
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 051673/0204 →
Assignment of Assignor's Interest Jan 30, 2020
From: HUEMOELLER, RON
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 051673/0167 →
Assignment of Assignor's Interest Feb 21, 2020
From: LU, WEILUNG; BARBER, BURT; ARCEDERA, ADRIAN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 051891/0880 →
Assignment of Assignor's Interest Feb 21, 2020
From: NAKAMURA, SHINGO
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 051891/0826 →
Assignment of Assignor's Interest Feb 21, 2020
From: JANG, SANG JAE
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 051891/0851 →
Assignment of Assignor's Interest Jun 23, 2020
From: KIM, MIN HO; NA, SEOK HO; PARK, DONG HYEON; KIM, CHOONG HOE
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 053012/0026 →
Assignment of Assignor's Interest Jul 1, 2020
From: HAN, YI SEUL; LEE, TAE YONG; RYU, JI YEON; DO, WON CHUL
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 053097/0794 →
Assignment of Assignor's Interest Jul 1, 2020
From: BOWERS, SHAUN; HUEMOELLER, RON
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 053097/0859 →
Assignment of Assignor's Interest Aug 31, 2020
From: SON, SEUNG NAM; KHIM, DONG HYUN; YOO, JIN KUN
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 053648/0543 →
Assignment of Assignor's Interest Sep 4, 2020
From: OH, JI HOON; BANG, DONG HYUN; SHIN, SOO JIN; KWON, YOUNG IK
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 053698/0345 →
Assignment of Assignor's Interest Sep 4, 2020
From: LEE, MIN JAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 053697/0743 →