Semiconductor devices and methods of manufacturing semiconductor devices
In one example, an electronic assembly comprises a first semiconductor device and a second semiconductor device. Each of the first semiconductor device and the second semiconductor devices comprises a substrate comprising a top surface and a conductive structure, an electronic component over the top surface of the substrate, a dielectric material over the top surface of the substrate and contacting a side of the electronic component, a substrate tab at an end of substrate and not covered by the dielectric material, wherein the conductive structure of the substrate is exposed at the substrate tab, and an interconnect electrically coupled to the conductive structure at the substrate tab of the first semiconductor device and the conductive structure at the substrate tab of the second semiconductor device. Other examples and related methods are also disclosed herein.
1. An electronic assembly, comprising:
a first semiconductor device and a second semiconductor device, wherein each of the first semiconductor device and the second semiconductor devices comprises:
a substrate comprising a top surface and a conductive structure;
an electronic component over the top surface of the substrate;
a dielectric material over the top surface of the substrate and contacting a side of the electronic component;
wherein the substrate comprises a substrate tab at an end of the substrate and not covered by the dielectric material, wherein the substrate tab comprises a portion of the substrate that extends beyond a lateral side of the dielectric material, and wherein the conductive structure of the substrate is exposed at the substrate tab; and
an interconnect electrically coupled to the conductive structure at the substrate tab of the first semiconductor device and the conductive structure at the substrate tab of the second semiconductor device, wherein the interconnect overlaps the substrate tab of the first semiconductor device and the substrate tab of the second semiconductor device.
2. The electronic assembly of claim 1 , further comprising a base structure comprising a top surface, wherein the first semiconductor device is over the top surface of the base structure and the second semiconductor device is over the top surface of the base structure.
3. The electronic assembly of claim 2 , wherein:
the base structure comprises a first support structure, a second support structure, and an intermediate structure between the first support structure and the second support structure,
the first semiconductor device is coupled to a top surface of the first support structure and the second semiconductor device is coupled to a top surface of the second support structure, and
the second semiconductor device is inverted with respect to the first semiconductor device with the substrate tab of the second semiconductor device over the substrate tab of the second semiconductor device.
4. The electronic assembly of claim 1 , wherein the interconnect comprises a wire bond.
5. The electronic assembly of claim 1 , wherein the interconnect comprises a clip.
6. The electronic assembly of claim 1 , wherein the second semiconductor device is inverted with respect to the first semiconductor device and the substrate tab of the second semiconductor device is over the substrate tab of the first semiconductor device.
7. The electronic assembly of claim 6 , wherein the interconnect comprises solder.
8. The electronic assembly of claim 6 , wherein the interconnect comprises a copper pillar.
9. The electronic assembly of claim 1 , wherein the interconnect comprises an interconnect substrate.
10. The electronic assembly of claim 1 , wherein the interconnect comprises a flexible substrate.
11. The electronic assembly of claim 1 , wherein the interconnect comprises a lead frame.