Patent Assignment
Reel/Frame 053012/0026
Assignment of Assignor's Interest
Recorded: 2020-06-23
Pages: 12
Assignors
KIM, MIN HO
Executed: 2020-06-17
NA, SEOK HO
Executed: 2020-06-17
PARK, DONG HYEON
Executed: 2020-06-17
KIM, CHOONG HOE
Executed: 2020-06-17
JOO, WOO KYUNG
Executed: 2020-06-17
SONG, YUN SEOK
Executed: 2020-06-17
RYU, DONG SU
Executed: 2020-06-17
Assignee
AMKOR TECHNOLOGY KOREA, INC.
100, AMKOR-RO, BUK-GU, GWANGJU, 61006, KOREA, REPUBLIC OF
Covered Property
(1)
Hybrid Bonding Interconnection Using Laser and Thermal Compression
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.