Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices
View Patent ↗In one example, an electronic device includes: an electronic component comprising a sensor and an electrical interconnect; a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate; and a translucent underfill contacting the electrical interconnect and between the translucent mold compound and the sensor. Other examples and related methods are also disclosed herein.
1. An electronic device, comprising:
an electronic component comprising a top surface, a bottom surface, a sensor and an electrical interconnect;
a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate;
a translucent underfill on a top surface of the electronic component contacting the electrical interconnect and between the translucent mold compound and the top surface of the electronic component, wherein the translucent underfill is exposed from a bottom side of the substrate; and
a solder ball coupled to a first bottom surface of the electrically conductive material of the substrate,
wherein the electrical interconnect is on the top surface of the electronic component and is coupled to a second bottom surface of the electrically conductive material, and the solder ball is external to the translucent underfill and the translucent mold compound, and
wherein the electrically conductive material extends between the electrical interconnect and the solder ball.
2. The electronic device of claim 1 , wherein the translucent underfill surrounds the electrical interconnect.
3. The electronic device of claim 1 , wherein the electronic component comprises a semiconductor die, and wherein the electrical interconnect comprises a wafer bump.
4. The electronic device of claim 1 , wherein the electronic component comprises a side surface between the top surface and the bottom surface, and wherein the translucent underfill contacts the side surface of the electronic component and the electrically conductive material.
5. The electronic device of claim 1 , wherein the translucent underfill contacts the sensor and the translucent mold compound.
6. The electronic device of claim 1 , wherein the translucent underfill comprises a mold compound, the electrical interconnect comprises solder, and the electrically conductive material comprises copper, and wherein the electrically conductive material contacts the translucent mold compound.
7. The electronic device of claim 1 , wherein the sensor comprises a fingerprint sensor.
8. The electronic device of claim 1 , wherein a top surface of the translucent mold compound is substantially coplanar with a top surface of the electrically conductive material.
9. The electronic device of claim 1 , wherein the substrate comprises a cavity and the electronic component is within the cavity.
10. The electronic device of claim 1 , wherein the electrically conductive material comprises a lead contacting a top side of the translucent underfill, and a flank contacting a lateral side of the translucent underfill.
11. The electronic device of claim 10 , wherein the translucent mold compound contacts a top side of the flank.
12. The electronic device of claim 10 , wherein the translucent mold compound contacts a lateral side of the lead.
13. The electronic device of claim 10 , wherein a top side of the lead is exposed through the translucent mold compound.
14. The electronic device of claim 1 , wherein an edge of the translucent mold compound is substantially coplanar with a lateral side of the electrically conductive material.
15. The electronic device of claim 1 , wherein an edge of the translucent mold compound is exposed at a lateral side of the substrate.
16. A method to manufacture an electronic device, the method comprising:
providing an electronic component comprising a top surface, a bottom surface, a sensor and an electrical interconnect;
providing a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate;
providing a translucent underfill on a top surface of the electronic component contacting the electrical interconnect and between the translucent mold compound and the top surface of the electronic component, wherein the translucent underfill is exposed from a bottom side of the substrate; and
providing a solder ball coupled to a first bottom surface of the electrically conductive material of the substrate,
wherein the electrical interconnect is on the top surface of the electronic component and is coupled to a second bottom surface of the electrically conductive material, and the solder ball is external to the translucent underfill and the translucent mold compound, and
wherein the electrically conductive material extends between the electrical interconnect and the solder ball.
17. The method of claim 16 , wherein the translucent underfill contacts the sensor and the translucent mold compound.
18. The method of claim 16 , wherein the sensor comprises a fingerprint sensor.
19. An electronic device, comprising:
an electronic component comprising a sensor and an electrical interconnect;
a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate; and
a translucent underfill on a top surface of the electronic component contacting the electrical interconnect and between the translucent mold compound and the top surface of the electronic component,
wherein the translucent underfill is exposed from a bottom side of the substrate, and a bottom surface of the electronic component is exposed from the bottom side of the substrate and is coplanar with the bottom side of the substrate, and
wherein the electrically conductive material comprises a top surface flush with a top surface of the translucent mold compound, a first bottom surface flush with a bottom surface of the translucent mold compound and over the top surface of the electronic component, and a second bottom surface lower than the first bottom surface and flush with a bottom surface of the translucent underfill.
20. The electronic device of claim 19 , comprising:
an external interconnect coupled to the second bottom surface of the electrically conductive material of the substrate;
wherein the electrical interconnect is on the top surface of the electronic component and is coupled to the first bottom surface of the electrically conductive material, and the external interconnect is external to the translucent underfill and the translucent mold compound.