Semiconductor device package and method for manufacturing the same
A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
1. A semiconductor device, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
an electronic component disposed on the first surface of the substrate;
a sensor disposed adjacent to the second surface of the substrate;
an electrical contact disposed on the first surface of the substrate, the electrical contact electrically connected with the sensor by the substrate; and
a package body exposing a portion of the electrical contact, the package body in contact with the first surface of the substrate.
2. The semiconductor device of claim 1 , wherein the package body comprises a transparent material and covers a surface of the sensor.
3. The semiconductor device of claim 1 , wherein a sensing area of the sensor is disposed adjacent to the second surface of the substrate.
4. The semiconductor device of claim 1 , wherein the sensor is a light-sensing sensor.
5. The semiconductor device of claim 1 , further comprising:
a passive electrical component disposed on the first surface of the substrate.
6. The semiconductor device of claim 1 , wherein the package body defines a cavity to expose the portion of the electrical contact, and a sidewall of the cavity of the package body is spaced apart from the portion of the electrical contact.
7. The semiconductor device of claim 1 , wherein the portion of the electrical contact protrudes from a surface of the package body facing away from the first surface of the substrate.
8. The semiconductor device of claim 1 , wherein the package body directly contacts a portion of the sensor exposed from the second surface of the substrate.
9. The semiconductor device of claim 1 , wherein the package body is in contact with a backside surface of the electronic component.
10. A semiconductor device, comprising:
a substrate having a first surface, a second surface opposite to the first surface and a third surface extending between the first surface and the second surface;
an electronic component disposed on the first surface of the substrate;
a sensor disposed adjacent to the second surface of the substrate;
an electrical contact electrically connected with the sensor by the substrate; and
a package body covering the second surface and the third surface of the substrate.
11. The semiconductor device of claim 10 , wherein the package body comprises a transparent material and covers a surface of the sensor.
12. The semiconductor device of claim 10 , wherein a sensing area of the sensor is disposed adjacent to the second surface of the substrate.
13. The semiconductor device of claim 10 , wherein the sensor is a light-sensing sensor.
14. The semiconductor device of claim 10 , further comprising:
a passive electrical component disposed on the first surface of the substrate.
15. The semiconductor device of claim 10 , wherein the package body directly contacts a portion of the sensor exposed from the second surface of the substrate.