Semiconductor device package and method for manufacturing the same
A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
1. A semiconductor device, comprising:
a circuit structure having a first surface and a second surface opposite to the first surface;
a sensing element disposed adjacent to the second surface of the circuit structure;
a first encapsulant covering the second surface of the circuit structure, wherein the sensing element has a surface completely in contact with the first encapsulant;
a second encapsulant covering the first surface of the circuit structure; and
a passive component disposed adjacent to the first surface of the circuit structure,
wherein the first encapsulant has a top surface adjacent to the first surface and a bottom surface adjacent to the second surface of the circuit structure, and the top surface of the first encapsulant is at an elevation, with respect to the circuit structure, higher than that of a top surface of the passive component.
2. The semiconductor device of claim 1 , further comprising:
an electrical contact disposed adjacent to the first surface of the circuit structure, wherein the electrical contact laterally overlaps the first encapsulant and is free from vertically overlapping the sensing element.
3. The semiconductor device of claim 1 , further comprising:
an electrical contact disposed adjacent to the first surface of the circuit structure, wherein a portion of the electrical contact is free from laterally overlapping the second encapsulant.
4. The semiconductor device of claim 3 , wherein the portion of the electrical contact is spaced apart from the second encapsulant.
5. The semiconductor device of claim 1 , wherein the second encapsulant has a tapered portion.
6. The semiconductor device of claim 1 ,
wherein the passive component laterally overlaps the first encapsulant and the second encapsulant.
7. The semiconductor device of claim 1 ,
wherein the second encapsulant vertically overlaps the first encapsulant and the passive component.
8. The semiconductor device of claim 1 , wherein a distance between a lateral surface of the second encapsulant and a lateral surface of the circuit structure is less than a distance between a lateral surface of the first encapsulant and the lateral surface of the circuit structure, and the second encapsulant is spaced apart from the sensing element.
9. A semiconductor device, comprising:
a circuit structure having a first surface and a second surface opposite to the first surface;
a sensing element disposed adjacent to the second surface of the circuit structure;
a first encapsulant covering the second surface of the circuit structure, wherein the sensing element has a surface completely in contact with the first encapsulant; and
a second encapsulant covering the first surface of the circuit structure,
wherein a side of the sensing element is spaced apart from the first encapsulant by the circuit structure and laterally overlapping the first encapsulant.
10. A semiconductor device, comprising:
a circuit structure having a first surface and a second surface opposite to the first surface;
a sensing element disposed adjacent to the second surface of the circuit structure;
a first encapsulant covering the second surface of the circuit structure, wherein the sensing element has a surface completely in contact with the first encapsulant;
a second encapsulant covering the first surface of the circuit structure;
an electronic component disposed adjacent to the first surface of the circuit structure; and
an electrical connector electrically connected to the electronic component and disposed between the first encapsulant and the electronic component.