Chip stack package and method of fabricating the same
Provided is a chip stack package and a method of manufacturing the same. A chip stack package may include a base chip including a base substrate, a base through via electrode penetrating the base substrate, a base chip pad connected to the base through via electrode, and a base encapsulant. The chip stack package may further include at least one stack chip on a surface of the base substrate. The chip stack package may also include an external connection terminal connected to the base through via electrode and the base chip pad and protruding from the base encapsulant, and an external encapsulant surrounding and protecting outer surfaces of the base chip and the at least one stack chip, wherein the chip through via electrode and the chip pad are connected to the base through via electrode and the base chip pad of the base chip.
1. A chip stack package comprising:
a base chip including
a base substrate,
a base through via electrode penetrating the base substrate,
a base chip pad connected to the base through via electrode, and
a base encapsulant directly on a first surface of the base substrate;
at least one stack chip on a second surface of the base substrate, the at least one stack chip including
a substrate,
a chip through via electrode penetrating the substrate, and
a chip pad connected to the chip through via electrode;
an adhesive layer between the at least one stack chip and the second surface of the base substrate;
an external connection terminal connected to the base through via electrode and the base chip pad and protruding from the base encapsulant; and
an external encapsulant on outer surfaces of the base chip and the at least one stack chip, wherein the chip through via electrode and the chip pad are connected to the base through via electrode and the base chip pad of the base chip.
2. The chip stack package of claim 1 , further comprising:
a second chip attached to the first surface of the base substrate, wherein the second chip and the at least one stack chip are different types of chips, and the base encapsulant is configured to protect the heterogeneous chip.
3. The chip stack package of claim 1 , wherein the external connection terminal includes a first external connection terminal in the base encapsulant and a second external connection terminal connected to the first external connection terminal, the second external connection terminal protruding from the base encapsulant.
4. The chip stack package of claim 1 , wherein the base substrate and the substrate are silicon substrates with integrated circuits.
5. The chip stack package of claim 1 , wherein the base chip pad is a redistribution chip pad.
6. The chip stack package of claim 1 , wherein the base chip pad is on the first surface of the base substrate and the base through via electrode protrudes from the second surface of the base substrate.
7. The chip stack package of claim 6 , wherein the chip pad of the at least one stack chip is on a first surface of the substrate, and the chip pad on the first surface of the substrate is connected to the base through via electrode protruding from the second surface of the base substrate.
8. The chip stack package of claim 1 , wherein the base chip pad is on the second surface of the base substrate and the base through via electrode protrudes from the first surface of the base substrate.
9. The chip stack package of claim 8 , wherein the chip pad of the at least one stack chip is on a first surface of the substrate, and the chip pad on the first surface of the substrate is connected to the base chip pad on the second surface of the base substrate.
10. The chip stack package of claim 8 , further comprising:
a redistribution layer on the first surface of the base substrate, the redistribution layer being connected to the base through via electrode and the external connection terminal.
11. The chip stack package of claim 1 , wherein the base encapsulant includes a hole exposing the base chip pad and the external connection terminal is in the hole.
12. The chip stack package of claim 1 , wherein
the first surface of the base substrate is an active surface, the second surface of the base substrate is a non-active surface, and the base chip is on the active surface, and
the chip pad of the at least one stack chip is on an active surface of the substrate of the at least one stack chip.
13. The chip stack package of claim 12 , further comprising:
a second chip attached to the active surface of the base substrate, wherein the second chip is a different type of chip from the at least one stack chip and the base encapsulant is configured to protect the heterogeneous chip.
14. The chip stack package of claim 1 , wherein the base substrate is a wiring substrate.
15. The chip stack package of claim 1 , wherein the adhesive layer is in direct contact with a first surface of the stack chip.