Semiconductor device package and method for manufacturing the same
A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
1. A semiconductor device, comprising:
a substrate having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
an electronic component disposed on the first surface of the substrate;
a first package body covering the electronic component and the first surface of the substrate;
a second package body covering a lateral surface of the first package body and the lateral surface of the substrate, wherein the second package body covers the second surface of the substrate; and
a sensor disposed adjacent to the second surface of the substrate.
2. A semiconductor device, comprising:
a substrate having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
an electronic component disposed on the first surface of the substrate;
a first package body covering the electronic component and the first surface of the substrate;
a second package body covering a lateral surface of the first package body and the lateral surface of the substrate; and
an electrical contact electrically connected to the substrate and exposed from the first package body.
3. The semiconductor device of claim 2 , wherein the lateral surface of the first package body and the lateral surface of the substrate are substantially coplanar.
4. A semiconductor device, comprising:
a substrate having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
an electronic component disposed on the first surface of the substrate;
a first package body covering the electronic component and the first surface of the substrate;
a second package body covering a lateral surface of the first package body and the lateral surface of the substrate; and
an electronic element disposed proximal to the second surface of the substrate, wherein the electronic element comprises a sensor.
5. The semiconductor device of claim 4 , wherein the sensor is configured for sensing through the second package body.
6. The semiconductor device of claim 4 , wherein the second package body covers the sensor.
7. The semiconductor device of claim 6 , further comprising:
an electrical contact electrically connected to the substrate and exposed from the first package body.
8. The semiconductor device of claim 7 , wherein the first package body has an opening, and a sidewall of the opening is spaced apart from a portion of the electrical contact.
9. The semiconductor device of claim 4 , wherein the first package body is in contact with the second package body, and an interface between the first package body and the second package body is substantially aligned with the lateral surface of the substrate.
10. A semiconductor device, comprising:
a substrate having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
an electronic component disposed on the first surface of the substrate;
a first package body covering the electronic component and the first surface of the substrate;
a second package body covering a lateral surface of the first package body and the lateral surface of the substrate;
a passive electrical component disposed on the first surface of the substrate; and
a sensor adjacent to the second surface of the substrate and encapsulated by the second package body.
11. The semiconductor device of claim 10 , wherein the second package body directly contacts a portion of the sensor exposed from the second surface of the substrate.
12. A method of manufacturing a semiconductor device, the method comprising:
(a) providing a substrate having a first surface, a second surface opposite to the first surface, a lateral surface extending from the first surface and the second surface, and a sensor disposed on the second surface;
(b) disposing a first electrical contact on the first surface of the substrate; and
(c) providing a package body covering the sensor, the first surface, the second surface and the lateral surface of the substrate and a portion of the first electrical contact.
13. The method of claim 12 , further comprising disposing a second electrical contact on the first electrical contact.