Package-on-package semiconductor device
Exemplary methods of forming the semiconductor device, encompasses forming a first package with at least one first die on a packaging substrate that is removably coupled to a carrier. Forming a thermal contact pad on the first die package, with or without a surrounding seal ring, and bonding a second die package to the first die package where the thermal contact pad is between the two packages. Electrically coupling the first die package to the second die package with a set of conductive elements and removing the carrier from the first package.
1. A method of forming a package-on-package semiconductor device, comprising:
electrically coupling at least two dies to a first die packaging substrate by a first set of conductive elements to form a first die package;
removably coupling the first die package to a carrier;
forming a thermal contact pad on the first die package;
bonding a second die package onto the first die package, wherein the thermal contact pad is between the first die package and the second die package;
electrically coupling the first die package to the second die package by a second set of conductive elements; and
removing the carrier from the first die package.
2. The method of claim 1 , further comprising electrically coupling at least one die to a second substrate by a third set of conductive elements to form the second die package.
3. The method of claim 2 , wherein electrically coupling the at least one die to the second substrate by the third set of conductive elements comprises coupling the at least one die to the second substrate with at least one of metal pillars, solder bumps, solder balls or under-bump metallurgies.
4. The method of claim 1 wherein electrically coupling the first die package to the second die package comprises using conductive pads, conductive pillars and conductive vias for the electrical coupling.
5. The method of claim 1 , wherein forming the thermal contact pad further comprises forming a seal ring surrounding the thermal contact pad.
6. The method of claim 4 , wherein forming the thermal contact pad comprises forming a non-continuous thermal contact pad.
7. The method of claim 1 further comprising encapsulating the first die package and the second die package in a molding compound wherein the molding compound is between a portion of the thermal contact pad and at least one conductive element of the second set of conductive elements.
8. A method of forming a semiconductor device, comprising:
forming a top die package having a plurality of first dies on a top packaging substrate;
forming a bottom die package having at least one second die;
electrically connecting the top die package and the bottom die package with a first set of conductive elements;
providing a thermal contact pad between a top surface of the bottom die package and a bottom surface of the top packaging substrate, wherein the thermal contact pad thermally isolates the bottom die package from the top packaging substrate; and
surrounding the thermal contact pad, the top packaging substrate and the bottom die package with a molding compound.
9. The method of claim 8 , wherein forming the top die package comprises forming a die stack from the plurality of first dies and electrically coupling each die of the plurality of first dies to the top packaging substrate by wire bonding each die of the stacked dies to the top die package.
10. The method of claim 8 , wherein forming the top die package comprises physically coupling each first die of the plurality of first dies directly to the top packaging substrate and electrically coupling each physically coupled die to the top packaging substrate by wire bonding each physically coupled die to the top die package.
11. The method of claim 8 , wherein surrounding the thermal contact pad, the top packaging substrate and the bottom die package with the molding compound further comprises surrounding the top die package with a first molding compound and surrounding the first molding compound and a bottom substrate with a second molding compound.
12. The method of claim 11 , wherein providing the thermal contact pad further comprises providing a non-continuous thermal contact pad and a seal ring surrounding portions of the non-continuous thermal contact pad.
13. The method of claim 12 , wherein surrounding the first molding compound and the bottom substrate further comprises positioning the second molding compound between portions of the non-continuous thermal contact pad and the surrounding seal ring.
14. The method of claim 8 , further comprising:
electrically coupling the plurality of first dies to the top packaging substrate by a second set of conductive elements; and
electrically coupling the at least one second die to a bottom packaging substrate by a third set of conductive elements.
15. A method of forming a semiconductor device comprising:
forming a top die package having at least two stacked dies on a top packaging substrate;
electrically coupling the at least two stacked dies to the top packaging substrate with a first set of conductive elements;
depositing a first molding compound on the top packaging substrate, wherein the first molding compound surrounds the at least two stacked dies and the first set of conductive elements;
forming a bottom die package having at least one die on a bottom substrate;
providing a thermal contact pad and a seal ring between a top surface of the bottom die package and a bottom surface of the top packaging substrate; and
electrically coupling the top die package to the bottom die package with a second set of conductive elements.
16. The method of claim 15 , wherein electrically coupling the at least two stacked dies to the top packaging substrate with the first set of conductive elements comprises wire bonding each die of the at least two stacked dies to the top packaging substrate.
17. The method of claim 15 , wherein forming the bottom die package having the at least one die on the bottom substrate comprises electrically coupling the at least one die to the bottom substrate by a third set of conductive elements.
18. The method of claim 17 , wherein electrically coupling the at least one die to the bottom substrate by the third set of conductive elements comprises using conductive pads, conductive pillars and conductive vias for the electrical coupling.
19. The method of claim 15 further comprising surrounding the first molding compound and the bottom substrate with a second molding compound.
20. The method of claim 19 , wherein providing the thermal contact pad and the seal ring between the top surface of the bottom die package and the bottom surface of the top packaging substrate comprises providing a non-continuous thermal contact pad surrounded by the seal ring.