Semiconductor structure
A semiconductor structure includes a plurality of first dies, a second die disposed over each of the first dies, and a dielectric material surrounding the first dies and the second die. The second dies overlaps a portion of each of the first dies. A dimension of the second die is different from a dimension of the first dies.
1. A semiconductor structure, comprising:
a plurality of first dies;
a second die disposed over each of the first dies; and
a dielectric material surrounding the plurality of first dies and the second die, wherein the plurality of first dies are in a same level, and the second die overlaps a portion of each of the first dies.
2. The semiconductor structure of claim 1 , wherein each of the first dies comprises a first side and a second side perpendicular to the first side from a top view, and the second die comprises a third side and a fourth side perpendicular to the third side from the top view.
3. The semiconductor structure of claim 2 , wherein a length of the first side is greater than a length of the second side, and a length of the third side is less than a length of the fourth side.
4. The semiconductor structure of claim 3 , wherein the first side of the first die is parallel to the third side of the second die, and the second side of the first die is parallel to the fourth side of the second die.
5. The semiconductor structure of claim 3 , wherein the fourth side of the second die and the second side of the first die form an included angle, and the included angle is less than 90°.
6. The semiconductor structure of claim 1 , wherein each of the first dies comprises a plurality of first corners, and the second die comprises a plurality of second corners.
7. The semiconductor structure of claim 6 , wherein the first corners are visible from a top view.
8. The semiconductor structure of claim 6 , wherein the first corners of each first die are overlapped by the second die.
9. The semiconductor structure of claim 6 , wherein one of the second corners of the second die overlaps one of the first corners of one of the first dies.
10. The semiconductor structure of claim 1 , wherein a dimension of the second die is different from a dimension of the plurality of first dies.
11. The semiconductor structure of claim 1 , wherein the dielectric material is a molding or includes a molding compound.
12. A semiconductor structure, comprising:
a plurality of first dies, wherein each of the first dies comprises a first side and a second side perpendicular to the first side from a top view;
a second die disposed over each of the first dies, wherein the second die comprises a third side and a fourth side perpendicular to the third side from the top view; and
a dielectric material surrounding the plurality of first dies and the second die, wherein the plurality of first dies are in a same level, a length of the first side is greater than a length of the second side, a length of the third side is less than a length of the fourth side, the second die overlaps at least a portion of each first die, the first side of the first die is parallel to the third side of the second die, and the second side of the first die is parallel to the fourth side of the second die.
13. The semiconductor structure of claim 12 , wherein each of the first dies comprises a plurality of first corners, and the second die comprises a plurality of second corners.
14. The semiconductor structure of claim 13 , wherein the first corners are visible from a top view.
15. The semiconductor structure of claim 13 , wherein the first corners of each first die are overlapped by the second die.
16. The semiconductor structure of claim 12 , wherein a dimension of the second die is different from a dimension of the plurality of first dies.
17. A semiconductor structure, comprising:
a plurality of first dies, wherein each of the first dies comprises a pair of first sides, a pair of second sides perpendicular to the pair of first sides from a top view, and a plurality of first corners formed by the pair of first sides and the pair of second sides;
a second die disposed over each of the first dies, wherein the second die comprises a pair of third side, a pair of fourth side perpendicular to the pair of third side from the top view, and a plurality of second corners formed by the pair of third sides and the pair of fourth sides; and
a dielectric material surrounding the plurality of first dies and the second die, wherein the plurality of first dies are in a same level, the second die overlaps a portion of each first die, the fourth side of the second die and the second side of the first die form an included angle, and the included angle is less than 90°.
18. The semiconductor structure of claim 17 , wherein the first corners are visible from a top view.
19. The semiconductor structure of claim 17 , wherein one of the second corners of the second die overlaps one of the first corners of one of the first dies.
20. The semiconductor structure of claim 17 , wherein a dimension of the second die is different from a dimension of the plurality of first dies.