MEMS actuation systems and methods

1. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a MEMS actuator to a metal plate, wherein mounting the MEMS actuator to the metal plate includes:

applying epoxy to the metal plate;

positioning the MEMS actuator on the epoxy applied to the metal plate; and

curing the epoxy applied to the metal plate;

mounting an image sensor assembly to the MEMS actuator; and

electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly.

2. The method of manufacturing the MEMS assembly of claim 1 wherein mounting the image sensor assembly to the MEMS actuator includes:

applying epoxy to the MEMS actuator;

positioning the image sensor on the epoxy applied to the MEMS actuator; and

curing the epoxy applied to the MEMS actuator.

3. The method of manufacturing the MEMS assembly of claim 1 wherein electrically coupling the image sensor assembly to the MEMS actuator includes:

wirebonding the image sensor assembly to the MEMS actuator.

4. The method of manufacturing the MEMS assembly of claim 1 further comprising:

mounting the MEMS subassembly to a printed circuit board.

5. The method of manufacturing the MEMS assembly of claim 4 wherein mounting the MEMS subassembly to the printed circuit board includes:

applying epoxy to the printed circuit board;

positioning the MEMS subassembly on the epoxy applied to the printed circuit board; and

curing the epoxy applied to the printed circuit board.

6. The method of manufacturing the MEMS assembly of claim 4 further comprising:

electrically coupling the MEMS subassembly to the printed circuit board.

7. The method of manufacturing the MEMS assembly of claim 6 wherein electrically coupling the MEMS subassembly to the printed circuit board includes:

wirebonding the MEMS subassembly to the printed circuit board.

8. The method of manufacturing the MEMS assembly of claim 7 wherein electrically coupling the MEMS subassembly to the printed circuit board further includes:

encapsulating the wirebonding in epoxy.

9. The method of manufacturing the MEMS assembly of claim 1 further comprising:

mounting a holder assembly to the MEMS subassembly.

10. The method of manufacturing the MEMS assembly of claim 9 wherein mounting the holder assembly to the MEMS subassembly includes:

applying epoxy to the printed circuit board;

positioning the holder assembly on the epoxy applied to the printed circuit board; and

curing the epoxy applied to the printed circuit board.

11. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a MEMS actuator to a metal plate;

mounting an image sensor assembly to the MEMS actuator;

electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly;

mounting the MEMS subassembly to a printed circuit board, wherein mounting the MEMS subassembly to the printed circuit board includes:

applying epoxy to the printed circuit board;

positioning the MEMS subassembly on the epoxy applied to the printed circuit board; and

curing the epoxy applied to the printed circuit board; and

electrically coupling the MEMS subassembly to the printed circuit board.

12. The method of manufacturing the MEMS assembly of claim 11 wherein mounting the MEMS actuator to a metal plate includes:

applying epoxy to the metal plate;

positioning the MEMS actuator on the epoxy applied to the metal plate; and

curing the epoxy applied to the metal plate.

13. The method of manufacturing the MEMS assembly of claim 11 wherein mounting the image sensor assembly to the MEMS actuator includes:

applying epoxy to the MEMS actuator;

positioning the image sensor on the epoxy applied to the MEMS actuator; and

curing the epoxy applied to the MEMS actuator.

14. The method of manufacturing the MEMS assembly of claim 11 wherein electrically coupling the image sensor assembly to the MEMS actuator includes:

wirebonding the image sensor assembly to the MEMS actuator.

15. The method of manufacturing the MEMS assembly of claim 11 wherein electrically coupling the MEMS subassembly to the printed circuit board includes:

wirebonding the MEMS subassembly to the printed circuit board; and

encapsulating the wirebonding in epoxy.

16. The method of manufacturing the MEMS assembly of claim 11 further comprising:

mounting a holder assembly to the MEMS subassembly.

17. The method of manufacturing the MEMS assembly of claim 16 wherein mounting the holder assembly to the MEMS subassembly includes:

applying epoxy to the printed circuit board;

positioning the holder assembly on the epoxy applied to the printed circuit board; and

curing the epoxy applied to the printed circuit board.

18. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a MEMS actuator to a metal plate;

mounting an image sensor assembly to the MEMS actuator;

electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly;

mounting the MEMS subassembly to a printed circuit board;

electrically coupling the MEMS subassembly to the printed circuit board; and

mounting a holder assembly to the MEMS subassembly, wherein mounting the holder assembly to the MEMS subassembly includes:

applying epoxy to the printed circuit board;

positioning the holder assembly on the epoxy applied to the printed circuit board; and

curing the epoxy applied to the printed circuit board.