IP Library › Granted Patent US 11,784,416
Granted Patent B2
US 11,784,416 · App. 16/735,497 · Granted Oct 10, 2023

Tunable radio frequency (RF) absorber and thermal heat spreader

Inventors: Jeremy J. Holdstock (McKinney, TX); James E. Foreman (Frisco, TX); David R. Gorman (Lucas, TX); Darrell W. Miller (Allen, TX)
Assignee: Raytheon Company
H01Q17/008H05K9/0088
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Quick Facts
Patent No.
US 11,784,416
App. No.
16/735,497
Granted
Oct 10, 2023
Kind
B2
Abstract

An apparatus includes a first layer having an RF lossy material, a second layer having the RF lossy material, and a plurality of conductive or resistive pads arranged in a planar array between the first layer and the second layer. The apparatus may also include a plurality of thermal vias, where each thermal via may correspond to one of the pads, may extend through at least the first layer, and may be formed of a thermally-conductive material. Dimensions of each pad may be selected based on a desired resonant frequency band, and the desired resonant frequency band may be associated with RF energy transmitted by at least one RF source in proximity to the apparatus.

Claims (42)

1. An apparatus comprising:

a first layer comprising a radio frequency (RF) lossy material mounted to a platform;

a second layer comprising the RF lossy material;

a plurality of conductive or resistive pads arranged in a planar array between the first layer and the second layer, the pads separated from each other by gaps, wherein dimensions of each pad and each gap are selected based on a desired resonant frequency band of RF energy transmitted by at least one RF source associated with the platform; and

a plurality of thermal vias, each thermal via corresponding to one of the pads and extending through at least the first layer, each thermal via formed of a thermally-conductive material;

wherein each thermal via has a first dimension across the thermal via that is at least one-third as large as a second dimension across the corresponding pad, the first dimension and the second dimension being measured in a same plane.

2. The apparatus of claim 1 , wherein each thermal via extends through the first layer, through a center portion of the corresponding pad, and through the second layer.

3. The apparatus of claim 1 , wherein each thermal via extends through the first layer and terminates at a first surface of the corresponding pad.

4. The apparatus of claim 1 , wherein each pad comprises copper.

5. The apparatus of claim 1 , wherein the RF lossy material of the first and second layers comprises urethane or silicone.

6. The apparatus of claim 1 , wherein each pad comprises copper.

7. The apparatus of claim 1 , wherein the RF lossy material comprises urethane or silicone.

8. The apparatus of claim 1 , wherein the platform comprises a land or air vehicle.

9. A system comprising:

a first radio frequency (RF) source associated with a platform;

a second RF source associated with the platform; and

an RF absorber disposed between the first RF source and the second RF source and configured to absorb RF energy transmitted between the first RF source and the second RF source, the RF absorber comprising:

a first layer comprising an RF lossy material mounted to the platform;

a second layer comprising the RF lossy material;

a plurality of conductive or resistive pads arranged in a planar array between the first layer and the second layer, the pads separated from each other by gaps, wherein dimensions of each pad and each gap are selected based on a desired resonant frequency band of the RF energy transmitted between the first RF source and the second RF source; and

a plurality of thermal vias, each thermal via corresponding to one of the pads and extending through at least the first layer, each thermal via formed of a thermally-conductive material;

wherein each thermal via has a first dimension across the thermal via that is at least one-third as large as a second dimension across the corresponding pad, the first dimension and the second dimension being measured in a same plane.

10. The system of claim 9 , wherein each thermal via extends through the first layer, through a center portion of the corresponding pad, and through the second layer.

11. The system of claim 9 , wherein each thermal via extends through the first layer and terminates at a first surface of the corresponding pad.

12. The system of claim 9 , wherein each pad comprises copper.

13. The system of claim 9 , wherein the RF lossy material of the first and second layers comprises urethane or silicone.

14. The system of claim 9 , wherein the first RF source, the second RF source, and the RF absorber are disposed in an enclosed space.

15. The system of claim 9 , wherein the platform comprises a land or air vehicle.

16. A method comprising:

providing a first layer comprising a radio frequency (RF) lossy material;

positioning a plurality of conductive or resistive pads over a surface of the first layer such that the pads are separated from each other by gaps, wherein dimensions of each pad and each gap are selected based on a desired resonant frequency band of RF energy transmitted by at least one RF source associated with a platform to which the first layer is to be mounted;

positioning a second layer over the plurality of conductive or resistive pads, the second layer comprising the RF lossy material; and

forming a plurality of thermal vias through at least the first layer, each thermal via corresponding to one of the pads, each thermal via formed of a thermally-conductive material;

wherein each thermal via has a first dimension across the thermal via that is at least one-third as large as a second dimension across the corresponding pad, the first dimension and the second dimension being measured in a same plane.

17. The method of claim 16 , wherein each thermal via extends through the first layer, through a center portion of the corresponding pad, and through the second layer.

18. The method of claim 16 , wherein each thermal via extends through the first layer and terminates at a first surface of the corresponding pad.

19. An apparatus comprising:

a layer comprising a radio frequency (RF) lossy material mounted to a platform;

a plurality of conductive or resistive pads arranged in a planar array and disposed on an exterior surface of the layer, the pads separated from each other by gaps, wherein dimensions of each pad and each gap are selected based on a desired resonant frequency band of RF energy transmitted by at least one RF source associated with the platform; and

a plurality of thermal vias, each thermal via corresponding to one of the pads and extending through the layer, each thermal via formed of a thermally-conductive material;

wherein each thermal via has a first dimension across the thermal via that is at least one-third as large as a second dimension across the corresponding pad, the first dimension and the second dimension being measured in a same plane.

20. The apparatus of claim 19 , wherein the platform comprises a land or air vehicle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2020
From: HOLDSTOCK, JEREMY J.; FOREMAN, JAMES E.; GORMAN, DAVID R.; MILLER, DARRELL W.
To: RAYTHEON COMPANY
Reel/Frame 051429/0032 →
Continuity (1)
Related Publication 20210210862A1 · Jul 8, 2021
Cited By (1)
US 12,628,321