Substrate structure with high-density wiring and manufacturing method thereof
View Patent ↗A substrate structure, for connecting a semiconductor chip, including a high-density redistribution layer (RDL), a low-density RDL, and a middle-density RDL. The high-density RDL includes a fine conductive pattern. The semiconductor chip is disposed on the high-density RDL. The low-density RDL includes a coarse conductive pattern, and is disposed below the high-density RDL and away from the semiconductor chip. A layout density of the fine conductive pattern is denser than that of the coarse conductive pattern. The middle-density RDL is interposed between and electrically connected between the high-density and low-density RDLs. The middle-density RDL includes a middle dielectric layer, a middle conductive pattern disposed on the middle dielectric layer and close to the high-density RDL, and a middle conductive via penetrating the middle dielectric layer and including a top end connected to the middle conductive pattern and a bottom end protruding from a bottom surface of the middle dielectric layer.
1. A substrate structure, adapted to be connected to a semiconductor chip, the substrate structure comprising:
a first redistribution structure, facing the semiconductor chip;
a second redistribution structure, facing away the semiconductor chip; and
a core layer, disposed between the first redistribution structure and the second redistribution structure,
wherein the first redistribution structure comprising:
a high-wiring-density redistribution circuitry, comprising a fine conductive pattern, wherein the semiconductor chip is adapted to be disposed on the high-wiring-density redistribution circuitry;
a low-wiring-density redistribution circuitry, comprising a first coarse conductive pattern and disposed under the high-wiring-density redistribution circuitry and away from the semiconductor chip, wherein a layout density of the fine conductive pattern is higher than a layout density of the first coarse conductive pattern; and
a middle-wiring-density redistribution circuitry, interposed between the high-wiring-density redistribution circuitry and the low-wiring-density redistribution circuitry, and electrically connected to the high-wiring-density redistribution circuitry and the low-wiring-density redistribution circuitry, the middle-wiring-density redistribution circuitry comprising:
a middle dielectric layer;
a middle conductive pattern, disposed on the middle dielectric layer and close to the high-wiring-density redistribution circuitry; and
a middle via, penetrating the middle dielectric layer and comprising a top end connected to the middle conductive pattern and a bottom end protruding from a bottom surface of the middle dielectric layer,
wherein the second redistribution structure comprising a second coarse conductive pattern, and a stack layer number of the first coarse conductive pattern is greater than a stack layer number of the second coarse conductive pattern,
wherein a thickness of the core layer is greater than a thickness of the low-wiring-density redistribution circuitry.
2. The substrate structure according to claim 1 , wherein the high-wiring-density redistribution circuitry further comprises:
a conductive connecting member, disposed on a side facing the middle-wiring-density redistribution circuitry and connected to the middle conductive pattern of the middle-wiring-density redistribution circuitry.
3. The substrate structure according to claim 2 , further comprising:
an underfill, interposed between the high-wiring-density redistribution circuitry and the middle-wiring-density redistribution circuitry, and laterally covering the conductive connecting member of the high-wiring-density redistribution circuitry and the middle conductive pattern of the middle-wiring-density redistribution circuitry.
4. The substrate structure according to claim 1 , further comprising:
an adhesive layer, interposed between the middle-wiring-density redistribution circuitry and the low-wiring-density redistribution circuitry, and laterally covering the bottom end of the middle via protruding from the bottom surface of the middle dielectric layer.
5. The substrate structure according to claim 1 , wherein the middle-wiring-density redistribution circuitry comprises a first middle-wiring-density redistribution circuitry and a second middle-wiring-density redistribution circuitry, the first middle-wiring-density redistribution circuitry is interposed between the high-wiring-density redistribution circuitry and the second middle-wiring-density redistribution circuitry, and the second middle-wiring-density redistribution circuitry is interposed between the first middle-wiring-density redistribution circuitry and the low-wiring-density redistribution circuitry.
6. The substrate structure according to claim 5 , wherein an adhesive layer is disposed between the first middle-wiring-density redistribution circuitry and the second middle-wiring-density redistribution circuitry to cover the bottom end of the middle via of the first middle-wiring-density redistribution circuitry protruding from the bottom surface of the middle dielectric layer and the middle conductive pattern of the second middle-wiring-density redistribution circuitry connected to the middle via of the first middle-wiring-density redistribution circuitry.
7. The substrate structure according to claim 1 , wherein a hardness of the middle-wiring-density redistribution circuitry is between a hardness of the high-wiring-density redistribution circuitry and a hardness of the low-wiring-density redistribution circuitry.
8. The substrate structure according to claim 1 , wherein a layout density of the middle conductive pattern of the middle-wiring-density redistribution circuitry is between the layout density of the fine conductive pattern of the high-wiring-density redistribution circuitry and the layout density of the coarse conductive pattern of the low-wiring-density redistribution circuitry.
9. The substrate structure according to claim 1 , wherein the middle-wiring-density redistribution circuitry is a flexible printed circuit layer and the low-wiring-density redistribution circuitry is a printed circuit board.
10. The substrate structure according to claim 1 , wherein a material of the middle via of the middle-wiring-density redistribution circuitry comprises a conductive paste.
11. The substrate structure according to claim 1 , wherein the low-wiring-density redistribution circuitry comprising a first coarse dielectric layer and the second redistribution structure comprising a second coarse dielectric layer, and a stack layer number of the first coarse dielectric layer is greater than a stack layer number of the second coarse dielectric layer.