Patent Assignment
Reel/Frame 075543/0215
Assignment of Assignor's Interest
Recorded: 2026-08-06
Pages: 7
Assignor
HU, DYI-CHUNG
Executed: 2026-01-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Properties
(24)
System in Package
Metal via Structure
Wafer Reconfiguration During a Coating Process or an Electric Plating Process
Package on Package Configuration
Package Substrate with Double Sided Fine Line Rdl
Package Substrate
Joint Structure for Metal Pillars
Patent:
9,972,604 →
Application:
15/440,905 →
System in Package
Metal Pillar with Cushioned Tip
Package Substrate with Embedded Noise Shielding Walls
Redistribution Film for Ic Package
Electronic Package and Manufacturing Method Thereof
Pad Structure and Manufacturing Method Thereof
Package Structure and Manufacturing Method Thereof
Manufacturing Method of Integrated Circuit Package
Metal via Structure
Package Substrate and Package Structure
Package Substrate and Package Structure
Manufacturing Method of Package Structure Having Embedded Bonding Film
Composite Carrier for Warpage Management
Electronic Package and Manufacturing Method Thereof
Space Transformer and Manufacturing Method Thereof
Carrier for Chip Packaging and Manufacturing Method Thereof
Substrate Structure with High-Density Wiring and Manufacturing Method Thereof