IP Library › Granted Patent US 10,153,234
Granted Patent B2
US 10,153,234 · App. 15/341,132 · Granted Dec 11, 2018

System in package

Inventor: Dyi-Chung Hu (Hsinchu, TW)
H01L23/5386H01L23/3114H01L23/5226H01L23/53242H01L24/19H01L24/20H01L24/96H01L2224/04105H01L2924/14H01L2924/18162
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Quick Facts
Patent No.
US 10,153,234
App. No.
15/341,132
Granted
Dec 11, 2018
Kind
B2
Abstract

An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip package to mount. At least one chip is wrapped by molding material, a first redistribution circuitry is built on a bottom side of the molding material. A plurality of first inverse T-shaped metals of the first redistribution circuitry are electrically coupled to the at least one chip; a second redistribution circuitry is built on a bottom side of the first redistribution circuitry. A plurality of second inverse T-shaped metals of the second redistribution circuitry are electrically coupled to the first redistribution circuitry. Either the first redistribution circuitry or the second redistribution circuitry has at least a first extension extended beyond a corresponding side surface of the molding material to electrically couple to at least one device.

Claims (68)

1. A system in package, comprising:

at least one chip having a plurality of input/output (I/O) pads;

a molding material wrapping the at least one chip;

a first redistribution circuitry fabricated according to a first design rule, and configured on a bottom of the molding material, the first redistribution circuitry electrically coupled to the plurality of I/O pads of the chip through a plurality of first inverse T-shaped metals, the first inverse T-shaped metals located at a top of the first redistribution circuitry and being in direct contact with the I/O pads of the chip, the first redistribution circuitry expanded wider from the top of the first redistribution circuitry to a bottom of the first redistribution circuitry; and

a second redistribution circuitry fabricated according to a second design rule, and configured on the bottom of the first redistribution circuitry, the second redistribution circuitry electrically coupled to the first redistribution circuitry through a plurality of second inverse T-shaped metals, the second redistribution circuitry expanded wider from a top of the first second redistribution circuitry to a bottom of the second redistribution circuitry,

wherein

each circuit of the second redistribution circuitry is thicker and wider than each circuit of the first redistribution circuitry,

the plurality of second inverse T-shaped metals has a distribution density less than a distribution density of the plurality of first inverse T-shaped metals, and

at least one extension of either the first redistribution circuitry or the second redistribution circuitry extends beyond a corresponding side surface of the molding material,

wherein a top surface of the molding material facing away the first redistribution circuitry is located at a plane, an orthogonal projection area of the at least one extension of either the first redistribution circuitry or the second redistribution circuitry on the plane connects to and extends beyond an orthogonal projection area of the molding material on the plane.

2. The system in package as claimed in claim 1 , wherein

each of the plurality of first inverse T-shaped metals has a top via and a bottom flat metal, and no demarcation exists between the top via and the bottom flat metal.

3. The system in package as claimed in claim 1 , wherein

each of the plurality of second inverse T-shaped metals has a top via and a bottom flat metal, and no demarcation exists between the top via and the bottom flat metal.

4. The system in package as claimed in claim 1 , wherein

the top surface of the molding material is coplanar with a top surface of the at least one chip.

5. The system in package as claimed in claim 1 , further comprising:

a first dielectric layer embedding the first redistribution circuitry, wherein the first dielectric layer and the embedded first redistribution circuitry form a first redistribution layer (RDL); and

a second dielectric layer embedding the second redistribution circuitry, wherein the second dielectric layer and the embedded second redistribution circuitry form a second RDL.

6. The system in package as claimed in claim 5 , wherein the first RDL has

the at least one extension; and

a plurality of first contact pads on a terminal portion of the at least one extension.

7. The system in package as claimed in claim 6 , further comprising:

at least one electronic device electrically coupled to the plurality of first contact pads.

8. The system in package as claimed in claim 7 , wherein

the at least one device is selected from the group consisting of control key, speaker, camera, microphone, and power supply.

9. The system in package as claimed in claim 5 , wherein the second RDL has

the at least one extension; and

a plurality of second contact pads on a terminal portion of the at least one extension.

10. The system in package as claimed in claim 9 , further comprising:

at least one electronic device electrically coupled to the plurality of second contact pads.

11. The system in package as claimed in claim 10 , wherein

the at least one device is selected from the group consisting of control key, speaker, camera, microphone, and power supply.

12. The system in package as claimed in claim 1 , wherein the at least one extension comprises

a first extension extending beyond a first side surface of the molding material, and

a second extension extending beyond a second side surface of the molding material, the second side surface different from the first side surface.

13. The system in package as claimed in claim 12 , wherein the at least one extension further comprises

a third extension extending beyond a third side surface of the molding material, the third side surface different from the first and second side surfaces.

14. The system in package as claimed in claim 13 , wherein the at least one extension further comprises

a fourth extension extending beyond a fourth side surface of the molding material, the fourth side surface different from the first, second and third side surfaces.

15. The system in package as claimed in claim 1 , wherein

the at least one extension belongs to one of the first redistribution circuitry and the second redistribution circuitry, and extends beyond a corresponding side surface of the other of the first redistribution circuitry and the second redistribution circuitry.

16. The system in package as claimed in claim 15 , wherein

the at least one extension comprises

a first extension extending beyond a first side surface of the molding material, and beyond a first side surface of the other of the first redistribution circuitry and the second redistribution circuitry, and

a second extension extending beyond a second side surface of the molding material, and beyond a second side surface of the other of the first redistribution circuitry and the second redistribution circuitry,

the second side surface of the molding material is different from the first side surface of the molding material, and

the second side surface of the other of the first redistribution circuitry and the second redistribution circuitry is different from the first side surface of the other of the first redistribution circuitry and the second redistribution circuitry.

17. The system in package as claimed in claim 16 , wherein

the at least one extension further comprises

a third extension extending beyond a third side surface of the molding material, and beyond a third side surface of the other of the first redistribution circuitry and the second redistribution circuitry,

the third side surface of the molding material is different from the first and second side surfaces of the molding material, and the third side surface of the other of the first redistribution circuitry and the second redistribution circuitry is different from the first and second side surfaces of the other of the first redistribution circuitry and the second redistribution circuitry.

18. The system in package as claimed in claim 17 , wherein

the at least one extension further comprises

a fourth extension extending beyond a fourth side surface of the molding material, and beyond a fourth side surface of the other of the first redistribution circuitry and the second redistribution circuitry,

the fourth side surface of the molding material is different from the first, second and third side surfaces of the molding material, and

the fourth side surface of the other of the first redistribution circuitry and the second redistribution circuitry is different from the first, second and third side surfaces of the other of the first redistribution circuitry and the second redistribution circuitry.

19. A system in package, comprising:

at least one chip having a plurality of input/output (I/O) pads;

a molding material wrapping the at least one chip;

a first redistribution circuitry fabricated according to a first design rule, and configured on a bottom of the molding material, the first redistribution circuitry electrically coupled to the plurality of I/O pads of the chip, the first redistribution circuitry expanded wider from a top of the first redistribution circuitry to a bottom of the first redistribution circuitry, wherein an inverse T-shaped metal of the first redistribution circuitry located at the top of the first redistribution circuitry is in direct contact with the plurality of I/O pads of the chip; and

a second redistribution circuitry fabricated according to a second design rule, and configured on the bottom of the first redistribution circuitry, the second redistribution circuitry electrically coupled to the first redistribution circuitry, the second redistribution circuitry expanded wider from a top of the second redistribution circuitry to a bottom of the second redistribution circuitry,

wherein

each circuit of the second redistribution circuitry is thicker and wider than each circuit of the first redistribution circuitry, and

at least one extension of one of the first redistribution circuitry and the second redistribution circuitry extends beyond a corresponding side surface of the molding material, and beyond a corresponding side surface of the other of the first redistribution circuitry and the second redistribution circuitry,

wherein a top surface of the molding material facing away the first redistribution circuitry is located at a plane, an orthogonal projection area of the at least one extension of either the first redistribution circuitry or the second redistribution circuitry on the plane connects to and extends beyond an orthogonal projection area of the molding material on the plane.

20. The system in package as claimed in claim 19 , wherein

the system in package is free of solder balls, an interposer, a package substrate, a system board, and an underfill.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2026
From: HU, DYI-CHUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 075543/0215 →
Continuity (2)
Continuation In Part 14931044 · Nov 3, 2015
Related Publication 20170125348A1 · May 4, 2017