Redistribution film for IC package
A redistribution film for IC package is disclosed, which comprises a top redistribution layer configured on top of a bottom redistribution layer. The top redistribution layer is fabricated following PCB design rule, and the bottom redistribution layer is fabricated following IC design rule. Further, the interface between the top redistribution layer and the bottom redistribution layer is optionally made roughed to increase bonding forces therebetween.
1. A redistribution film for IC package, the redistribution film comprising:
a bottom redistribution layer configured according to IC design rule, the bottom redistribution layer having a plurality of bottom metal pads and a plurality of first top metal pads, wherein a layout density of the plurality of bottom metal pads is higher than a layout density of the plurality of first top metal pads;
a top redistribution layer configured according to PCB design rule, the top redistribution layer configured on top of the bottom redistribution layer and having a plurality of second top metal pads, wherein the layout density of the plurality of first top metal pads is higher than a layout density of the plurality of second top metal pads;
a dielectric layer over the top surface of the bottom redistribution layer,
wherein
the plurality of first top metal pads of the bottom redistribution layer, and bottom conductive features of the top redistribution layer, are embedded in the dielectric layer, the bottom conductive features of the top redistribution layer are in direct electrical and physical contact with the corresponding first top metal pads of the bottom redistribution layer,
the bottom redistribution layer includes
a plurality of first conductive layers, wherein a topmost first conductive layer among the plurality of first conductive layers includes the plurality of first top metal pads, and
a plurality of first conductive vias coupling the plurality of first conductive layers to each other and to the plurality of bottom metal pads,
the top redistribution layer includes
a plurality of second conductive layers, wherein a topmost second conductive layer among the plurality of second conductive layers includes the plurality of second top metal pads, and
a plurality of second conductive vias coupling the plurality of second conductive layers to each other and to the plurality of first top metal pads, and
in a thickness direction in which the top redistribution layer is stacked on top of the bottom redistribution layer, the dielectric layer is (a) below the plurality of second conductive layers of the top redistribution layer and (b) above the plurality of first conductive vias of the bottom redistribution layer.
2. The redistribution film for IC package as claimed in claim 1 , wherein
the bottom redistribution layer has the plurality of first conductive layers and a plurality of first dielectric layers, each first conductive layer is embedded in a corresponding first dielectric layer; and
the top redistribution layer has the plurality of second conductive layers and a plurality of second dielectric layers, each second conductive layer is embedded in a corresponding second dielectric layer.
3. The redistribution film for IC package as claimed in claim 2 , wherein
each first conductive layer of the plurality of first conductive layers is thinner, in thickness direction, than each second conductive layer of the plurality of second conductive layers.
4. The redistribution film for IC package as claimed in claim 3 , wherein
each first conductive layer has a plurality of first circuits in width direction, each second conductive layer has a plurality of second circuits in width direction; and
each first circuit has a width narrower, in width direction, than each second circuit.
5. The redistribution film for IC package as claimed in claim 2 , wherein
each first dielectric layer of the plurality of first dielectric layers is thinner, in thickness direction, than each second dielectric layer of the plurality of second dielectric layers.
6. The redistribution film for IC package as claimed in claim 5 , further comprising:
a plurality of solder ball, each configured on a top surface of a corresponding second top metal pad.
7. The redistribution film for IC package as claimed in claim 6 , further comprising:
a chip configured on a bottom surface of the plurality of first bottom metal pads.
8. A redistribution film for IC package, the redistribution film comprising:
a bottom redistribution layer configured according to IC design rule, the bottom redistribution layer having a plurality of bottom metal pads and a plurality of first top metal pads, wherein a layout density of the plurality of bottom metal pads is higher than a layout density of the plurality of first top metal pads, and the bottom redistribution layer has the plurality of first conductive layers and a plurality of first dielectric layers, each first conductive layer is embedded in a corresponding first dielectric layer;
a top redistribution layer configured according to PCB design rule, the top redistribution layer configured on top of the bottom redistribution layer and having a plurality of second top metal pads, wherein the layout density of the plurality of first top metal pads is higher than a layout density of the plurality of second top metal pads, the top redistribution layer has the plurality of second conductive layers and a plurality of second dielectric layers, each second conductive layer is embedded in a corresponding second dielectric layer, and each first conductive layer of the plurality of first conductive layers is thinner, in thickness direction, than each second conductive layer of the plurality of second conductive layers.;
a dielectric layer over the top surface of the bottom redistribution layer, wherein the plurality of first top metal pads of the bottom redistribution layer, and bottom conductive features of the top redistribution layer, are embedded in the dielectric layer, the bottom conductive features of the top redistribution layer are in direct electrical and physical contact with the corresponding first top metal pads of the bottom redistribution layer,
the bottom redistribution layer comprises:
a plurality of first conductive layers, wherein a topmost first conductive layer among the plurality of first conductive layers includes the plurality of first top metal pads, and
a plurality of first conductive vias coupling the plurality of first conductive layers to each other and to the plurality of bottom metal pads,
the top redistribution layer comprises:
a plurality of second conductive layers, wherein a topmost second conductive layer among the plurality of second conductive layers includes the plurality of second top metal pads, and
a plurality of second conductive vias coupling the plurality of second conductive layers to each other and to the plurality of first top metal pads, and
in a thickness direction in which the top redistribution layer is stacked on top of the bottom redistribution layer, the dielectric layer is (a) below the plurality of second conductive layers of the top redistribution layer and (b) above the plurality of first conductive vias of the bottom redistribution layer.
9. A redistribution film for IC package, the redistribution film comprising:
a bottom redistribution layer configured according to IC design rule, the bottom redistribution layer having a plurality of bottom metal pads and a plurality of first top metal pads, wherein a layout density of the plurality of bottom metal pads is higher than a layout density of the plurality of first top metal pads, and the bottom redistribution layer has the plurality of first conductive layers and a plurality of first dielectric layers, each first conductive layer is embedded in a corresponding first dielectric layer;
a top redistribution layer configured according to PCB design rule, the top redistribution layer configured on top of the bottom redistribution layer and having a plurality of second top metal pads, wherein the layout density of the plurality of first top metal pads is higher than a layout density of the plurality of second top metal pads, the top redistribution layer has the plurality of second conductive layers and a plurality of second dielectric layers, each second conductive layer is embedded in a corresponding second dielectric layer, and each first dielectric layer of the plurality of first dielectric layers is thinner, in thickness direction, than each second dielectric layer of the plurality of second dielectric layers;
a dielectric layer over the top surface of the bottom redistribution layer,
wherein the plurality of first top metal pads of the bottom redistribution layer, and bottom conductive features of the top redistribution layer, are embedded in the dielectric layer, the bottom conductive features of the top redistribution layer are in direct electrical and physical contact with the corresponding first top metal pads of the bottom redistribution layer,
the bottom redistribution layer comprises:
a plurality of first conductive layers, wherein a topmost first conductive layer among the plurality of first conductive layers includes the plurality of first top metal pads, and
a plurality of first conductive vias coupling the plurality of first conductive layers to each other and to the plurality of bottom metal pads,
the top redistribution layer comprises:
a plurality of second conductive layers, wherein a topmost second conductive layer among the plurality of second conductive layers includes the plurality of second top metal pads, and
a plurality of second conductive vias coupling the plurality of second conductive layers to each other and to the plurality of first top metal pads, and
in a thickness direction in which the top redistribution layer is stacked on top of the bottom redistribution layer, the dielectric layer is (a) below the plurality of second conductive layers of the top redistribution layer and (b) above the plurality of first conductive vias of the bottom redistribution layer.