IP Library Granted Patent US 11,749,552
Granted Patent B2
US 11,749,552 · App. 16/738,798 · Granted Sep 5, 2023

Wafer processing tools and methods thereof

Inventors: Jagan Rangarajan (Fremont, CA); Edward Golubovsky (San Jose, CA); Shaun Van Der Veen (San Jose, CA); Justin Ho Kuen Wong (Pleasanton, CA); Steven M. Zuniga (Soquel, CA)
Assignee: Applied Materials, Inc.
H01L21/68707B24B41/06H01L21/67028H01L21/67051H01L21/67703
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Quick Facts
Patent No.
US 11,749,552
App. No.
16/738,798
Filed
Jan 9, 2020
Granted
Sep 5, 2023
Kind
B2
Examiner
LEE, JAE
Art Unit
2899
USPC
451/365
Abstract

A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.

Claims (23)

1. A wafer processing device, comprising:

a wafer exchanger including two or more blades, each of the two or more blades configured to receive a wafer, the two or more blades rotatable about an axis on a single horizontal plane, and the two or more blades movable between at least a load cup and a robot access location;

wherein the load cup includes a wafer station that is vertically moveable relative to a blade located in the load cup and is configured to remove a wafer from a blade located in the load cup and place the wafer on the blade located in the load cup, and

wherein the wafer station is vertically moveable between a first location where the wafer station is spaced from a wafer and a second location where the wafer is received by the wafer station, and wherein a notch in the wafer station is sized to receive a portion of the blade configured to support the wafer as the wafer station moves between the first location and the second location.

2. The wafer processing device of claim 1 , wherein the blade located in the load cup is configured to remain stationary as the wafer station moves in a vertical direction to remove the wafer from the blade located in the load cup and to place the wafer on the blade located in the load cup.

3. The wafer processing device of claim 1 , further comprising a nebulizer located in the load cup, the nebulizer including one or more nozzles configured to spray at least one fluid.

4. The wafer processing device of claim 3 , wherein the nebulizer includes two or more sets of nozzles, wherein each set of nozzles is coupled to a different fluid source.

5. The wafer processing device of claim 3 , wherein the nebulizer is in a fixed location within the load cup.

6. The wafer processing device of claim 3 , wherein the nebulizer remains in a fixed location within the load cup during movement of the wafer station.

7. The wafer processing device of claim 1 , wherein the wafer exchanger includes three or more blades movable between at least the load cup, the robot access location, and a rinse station.

8. The wafer processing device of claim 7 , wherein the rinse station includes a nebulizer configured to rinse a wafer located therein.

9. The wafer processing device of claim 1 , further comprising:

a first wafer exchanger including three blades;

a second wafer exchanger including three blades;

a first load cup accessible by the three blades of the first wafer exchanger; and

a second load cup accessible by the three blades of the second wafer exchanger.

10. The wafer processing device of claim 9 , further comprising:

a first rinse station accessible by the three blades of the first wafer exchanger; and

a second rinse station accessible by the three blades of the second wafer exchanger.

11. The wafer processing device of claim 1 , further comprising at least one polishing station, wherein wafers are transportable between the load cup and the at least one polishing station.

12. The wafer processing device of claim 1 , comprising a nebulizer positioned in the load cup and configured to remain in a fixed location within the load cup during movement of the wafer station.

13. The wafer processing device of claim 12 , wherein the nebulizer includes one or more upward-oriented nozzles.

14. The wafer processing device of claim 12 , wherein the nebulizer includes two or more sets of nozzles, wherein each set of nozzles is coupled to a different fluid source.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2020
From: RANGARAJAN, JAGAN; GOLUBOVSKY, EDWARD; VEEN, SHAUN VAN DER; WONG, JUSTIN HO KUEN; ZUNIGA, STEVEN M.
To: APPLIED MATERIALS, INC.
Reel/Frame 053578/0793 →
Continuity (2)
Provisional Application 62794556 · Jan 18, 2019
Related Publication 20200234995A1 · Jul 23, 2020
Cited By (4)
US 12,224,186 US 12,525,468 US 12,673,431 US 12,728,540